Oanh K Nguyen

US Patent:

20030051662, Mar 20, 2003

Filed:

May 8, 2002

Appl. No.:

10/141358

Inventors:

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US

Assignee:

DIELECTRIC SYSTEMS, INC. - Fremont CA

International Classification:

C23C014/00

US Classification:

118/050000

Abstract:

An improved reactor to facilitate new precursor chemistries and transport polymerization processes that are useful for preparations of low ∈ (dielectric constant) films. An improved TP Reactor that consists of UV source and a fractionation device for chemicals is provided to generate useful reactive intermediates from precursors. The reactor is useful for the deposition system.

US Patent:

20030188683, Oct 9, 2003

Filed:

Apr 4, 2002

Appl. No.:

10/115879

Inventors:

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US

Assignee:

DIELECTRIC SYSTEMS, INC. - Fremont CA

International Classification:

C23F001/00
C23C014/00

US Classification:

118/050100, 156/345500

Abstract:

An improved reactor to facilitate new precursor chemistries and transport polymerization processes that are useful for preparations of low (dielectric constant) films. An improved TP Reactor that consists of UV source and a fractionation device for chemicals is provided to generate useful reactive intermediates from precursors. The reactor is useful for the deposition system.

US Patent:

20030196680, Oct 23, 2003

Filed:

Apr 19, 2002

Appl. No.:

10/126919

Inventors:

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Wei Shiang Lee - Milpitas CA, US
Michael Solomensky - Fremont CA, US
Atul Kumar - Fremont CA, US
James Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

Assignee:

DIELECTRIC SYSTEMS, INC - Freemont CA

International Classification:

C23C016/00
C25F001/00

US Classification:

134/001100, 118/719000, 118/726000, 438/905000

Abstract:

A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“∈”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.

US Patent:

20030198578, Oct 23, 2003

Filed:

Apr 18, 2002

Appl. No.:

10/125626

Inventors:

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Atul Kumar - Fremont CA, US
Jeff Wu - Palo Alto CA, US
Michael Solomensky - Fremont CA, US
James Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

Assignee:

DIELECTRIC SYSTEMS, INC. - Fremont CA

International Classification:

F28D017/00

US Classification:

422/138000, 422/198000, 422/134000, 422/206000

Abstract:

A multi-stage transport polymerization (“TP”) reactor useful for making a thin film for the fabrication of integrated circuits. One TP reactor has two distinct heating zones that facilitate the cracking of specific precursor materials. The multi-stage reactor comprises a first low temperature heating zone that heats incoming precursor materials to a temperature that is lower than the “cracking” temperature of the precursor. The second heating zone is maintained at a temperature useful for breaking the chemical bonds of a desired leaving groups in the selected precursor. Specialized heating bodies, which transfer heat to the precursor material in the low and high temperature zones, are used as elements of the invention that can simultaneously decrease the total volume and increase the inside surface area of the TP reactor. Chemistries of precursors used in the multi-stage reactor are also provided.

US Patent:

20040055539, Mar 25, 2004

Filed:

Sep 13, 2002

Appl. No.:

10/243990

Inventors:

Chung Lee - Fremont CA, US
Atul Kumar - Fremont CA, US
Oanh Nguyen - Union City CA, US
Jeff Wu - Palo Alto CA, US
Chieh Chen - Palo Alto CA, US

Assignee:

DIELECTRIC SYSTEMS, INC. - Fremont CA

International Classification:

C23C016/00
H01F041/00

US Classification:

118/724000, 427/457000, 427/508000

Abstract:

A semiconductor equipment that is useful for the fabrication of integrated circuits (“IC”). More specifically, this invention relates to a “reactive-reactor” for a transport polymerization (“TP”) process module, wherein the process module is useful for the deposition of low dielectric (“ ”) thin films in IC manufacture. The reactive-reactor has reactive metal interior surfaces for effective conversion of precursors to intermediates. The resultant reaction products of the precursor and the interior surface material of the reactive-reactor are very stable, and do not cause metallic contamination of the semiconductors. The reactive-reactor of this invention is also equipped with Reactor Re-generating capacity to restore the reactive metal interior surfaces.

US Patent:

20050047927, Mar 3, 2005

Filed:

Apr 7, 2004

Appl. No.:

10/820447

Inventors:

Chung Lee - Fremont CA, US
Oanh Nguyen - Union City CA, US
Wei Lee - Milpitas CA, US
Michael Solomensky - Fremont CA, US
Atul Kumar - Fremont CA, US
James Chung Chang - Cupertino CA, US
Binh Nguyen - Cupertino CA, US

International Classification:

F04B001/00

US Classification:

417152000, 417053000

Abstract:

A Process Module (“PM”) is designed to facilitate Transport Polymerization (“TP”) of precursors that are useful for preparations of low Dielectric Constant (“∈”) films. The PM consists primarily of a Material Delivery System (“MDS”) with a high temperature Vapor Phase Controller (“VFC”), a TP Reactor, a Treatment Chamber, a Deposition Chamber and a Pumping System. The PM is designed to facilitate TP for new precursors and for film deposition and stabilization processes.

US Patent:

20060274474, Dec 7, 2006

Filed:

May 31, 2006

Appl. No.:

11/421389

Inventors:

Chung Lee - Fremont CA, US
Atul Kumar - Santa Clara CA, US
George Tzeng - Oakland CA, US
Oanh Nguyen - Union City CA, US

International Classification:

H01H 47/00

US Classification:

361143000

Abstract:

A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.

US Patent:

20060275547, Dec 7, 2006

Filed:

May 31, 2006

Appl. No.:

11/421385

Inventors:

Chung Lee - Fremont CA, US
Atul Kumar - Santa Clara CA, US
George Tzeng - Oakland CA, US
Oanh Nguyen - Union City CA, US

International Classification:

C23C 16/00

US Classification:

427248100, 361143000

Abstract:

A system for depositing a vapor phase organic compound onto a substrate, comprising a vacuum chamber comprising a wall, a wall heater in thermal communication with the wall of the vacuum chamber, at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.