Oliver E Farrens

age ~53

from Boise, ID

Get Report
Related to:
Connected to:

Oliver Farrens Phones & Addresses

  • 252 E Front St APT 614, Boise, ID 83702
  • 4301 Rose Hill St, Boise, ID 83705 • 2083437818
  • 3923 Cassia St, Boise, ID 83705 • 2083364126
  • Mesa, AZ

Work

  • Position:
    Administrative Support Occupations, Including Clerical Occupations

Education

  • Degree:
    Associate degree or higher

Us Patents

  • Integrated Circuit Chip Handling Apparatus And Method

    view source
  • US Patent:
    6904671, Jun 14, 2005
  • Filed:
    May 7, 1999
  • Appl. No.:
    09/307498
  • Inventors:
    Oliver Farrens - Boise ID, US
    Roy Cashin - Nampa ID, US
  • Assignee:
    Micron Technology, Inc. - Boise ID
  • International Classification:
    H05K003/00
  • US Classification:
    29829, 29593, 29741, 29719
  • Abstract:
    The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of magnetic forces generated by the invention, in combination with physical manipulation of the DUT boards and transfer structures, IC chips are quickly and efficiently transferred.
Get Report for Oliver E Farrens from Boise, ID, age ~53
Control profile