Pamela K Benicewicz

US Patent:

6483196, Nov 19, 2002

Filed:

Apr 3, 2000

Appl. No.:

09/542037

Inventors:

Robert J. Wojnarowski - Ballston Lake NY
William P. Minnear - Clifton Park NY
Pamela K. Benicewicz - Loudonville NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 2940

US Classification:

257778, 257432

Abstract:

A flip chip structure of a light-emitting device comprising a UV/blue light emitting diode (LED) is disclosed. The flip chip structure is optimized to produce unique light focusing and phosphor illumination out the bottom of the structure. The flip chip structure includes a substrate, a gallium nitride layer epitaxially grown on a top surface of the substrate, and one or more layers of lensing material deposited on a bottom surface of the substrate. The lensing material is preferably a polymer lensing material, an index matching material, or a mixture thereof. The gallium nitride layer is deposited in the form of one or more odd-sided polygons, for enhanced light extraction.

US Patent:

6762836, Jul 13, 2004

Filed:

May 22, 2002

Appl. No.:

10/152349

Inventors:

Pamela Benicewicz - Loudonville NY
Andrew Joseph Travaly - Ballston Spa NY
Pingfan Wu - Willingboro NJ
Elena Rozier - Schenectady NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

G01J 330

US Classification:

356318, 3562373

Abstract:

A portable Laser Plasma Spectroscopy (LPS) system and process is provided for performing in situ, near-real time, remote elemental analysis and identification of deposits or other foreign material found on surfaces of machine parts, such as turbine compressor blades or the like, wherein identification of the elemental constituents of a particular deposit is obtained without incurring significant ablative damage to the machine part substrate material underlying the deposit.

US Patent:

7273998, Sep 25, 2007

Filed:

Sep 15, 2004

Appl. No.:

10/941560

Inventors:

Pingfan Peter Wu - Niskayuna NY, US
Pamela King Benicewicz - Loudonville NY, US
Magdi Naim Azer - Niskayuna NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

B23K 26/00

US Classification:

21912162, 21912169, 21912185

Abstract:

A method and system for monitoring laser shock peening of a work piece. A line spectrum is obtained from radiation emitted by a plasma produced by a laser shock peening process. The shape of the line spectrum about its emission peak is compared to a defined line shape to verify proper operation of the laser shock peening process. The line shape may be a Lorentzian line shape corresponding to a desired line shape. The line shape may a Gaussian line shape corresponding to an undesired line shape. The system can also detect the failure mode that occurs when the opaque layer is broken through by detecting the plasma spectral component produced by the work piece material, along with the plasma produced by the opaque layer.

US Patent:

7440097, Oct 21, 2008

Filed:

Jun 27, 2006

Appl. No.:

11/426708

Inventors:

Pamela King Benicewicz - Loudonville NY, US
Pavel Alexeyevich Fomitchov - New York NY, US
Elena Rozier - Schenectady NY, US
John Ruediger Mader Viertl - Niskayuna NY, US
Tymm Bradner Schumaker - Saratoga Springs NY, US

Assignee:

General Electric Company - Niskayuna NY

International Classification:

G01J 3/443
G01J 3/30
G01N 21/63
G01B 11/22
G01B 11/06

US Classification:

356316, 356318, 356626

Abstract:

An in-situ laser plasma spectroscopy (LPS) system for automated near real-time elemental depth profiling of a target including: an optical source configured to generate an optical beam, wherein the optical beam is pulsed; an optical probe system configured to deliver the optical beam from the optical source to a surface of a target to generate an ablation plasma; a time resolved spectral detection system configured to generate time resolved spectral data from emission signals from the ablation plasma; and a data acquisition and processing system configured to acquire the time resolved spectral data to determine, in combination with predetermined calibration data, an absolute elemental concentration as a function of depth in near real-time.

US Patent:

20070296967, Dec 27, 2007

Filed:

Jun 27, 2006

Appl. No.:

11/475212

Inventors:

Bhupendra Kumra Gupta - Cincinnati OH, US
Nripendra Nath Das - West Chester OH, US
Pamela King Benicewicz - Loudonville NY, US

International Classification:

G01J 3/30
G01N 21/63

US Classification:

356318

Abstract:

A method comprising the following steps: (a) providing a turbine component comprising a metal substrate having an external surface; and (b) analyzing the external surface by laser plasma spectroscopy to determine whether a metallic coating is present on or absent from the external surface. If a metallic coating is determined to be present on the external surface, the elemental composition, elemental concentration and/or thickness of the metallic coating present on the external surface may be determined (qualitatively and/or quantitatively) by laser plasma spectroscopy. Another method comprises the following steps: (a) providing a turbine component comprising a metal substrate having an external surface which has been subjected to treatment to remove a metallic coating applied to the external surface; and (b) analyzing the treated external surface by laser plasma spectroscopy to determine the degree of removal of the metallic coating from the treated external surface.

US Patent:

20070296968, Dec 27, 2007

Filed:

Sep 4, 2007

Appl. No.:

11/849815

Inventors:

Pingfan Wu - Niskayuna NY, US
Pamela Benicewicz - Loudonville NY, US
Magdi Azer - Niskayuna NY, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

G01J 3/30

US Classification:

356318000

Abstract:

A method and system for monitoring laser shock peening of a work piece. A line spectrum is obtained from radiation emitted by a plasma produced by a laser shock peening process. The shape of the line spectrum about its emission peak is compared to a defined line shape to verify proper operation of the laser shock peening process. The line shape may be a Lorentzian line shape corresponding to a desired line shape. The line shape may a Gaussian line shape corresponding to an undesired line shape. The system can also detect the failure mode that occurs when the opaque layer is broken through by detecting the plasma spectral component produced by the work piece material, along with the plasma produced by the opaque layer.

US Patent:

6407411, Jun 18, 2002

Filed:

Apr 13, 2000

Appl. No.:

09/548440

Inventors:

Robert J. Wojnarowski - Ballston Lake NY
Richard J. Uriarte - Clifton Park NY
Ferenc Horkay - Rockville MD
Pamela K. Benicewicz - Loudonville NY
William P. Minnear - Clifton Park NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 3300

US Classification:

257 99, 257100, 257675, 257676

Abstract:

An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone.