Patrick A Toole

US Patent:

47666706, Aug 30, 1988

Filed:

Feb 2, 1987

Appl. No.:

7/009981

Inventors:

Charles E. Gazdik - Endicott NY
Donald G. McBride - Binghamton NY
Donald P. Seraphim - Vestal NY
Patrick A. Toole - Westport CT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 334

US Classification:

29830

Abstract:

An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on a carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chip mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

US Patent:

48558672, Aug 8, 1989

Filed:

Feb 2, 1988

Appl. No.:

7/151382

Inventors:

Charles E. Gazdik - Endicott NY
Donald G. McBride - Binghamton NY
Donald P. Seraphim - Vestal NY
Patrick A. Toole - Westport CT

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

361306

Abstract:

An electronic packaging structure, and a method of making this structure, are disclosed. The electronic packaging structure comprises a full panel, circuitized flexible film semiconductor chip carrier mounted on a circuitized substrate such as a printed circuit board. A plurality of semiconductor chips are mounted on the carrier in a selected pattern, and the carrier, with the chips, is mounted on a matching pattern of bonding sites on the circuitized substrate. Preferably, the circuitized flexible film semiconductor chip carrier is manufactured on a support structure used to facilitate handling of the circuitized flexible film and to facilitate heat transfer from the semiconductor chips mounted on the carrier to a heat sink which is part of the circuitized substrate. Also, the semiconductor chips mounted on the flexible film chip carrier may be tested, and burned in, while on the support structure before the chip carrier, with the chips, is mounted on the circuitized substrate.

Address:

2 Buttonwood Ln, Westport, CT 06880

Phone:

2035202869

VIN:

5N3AA08C68N903450

Make:

INFINITI

Model:

QX56

Year:

2008

Address:

2 Buttonwood Ln, Westport, CT 06880

Phone:

2035202869

VIN:

1G6DH577080135245

Make:

CADILLAC

Model:

CTS

Year:

2008