Patrick S Weber

US Patent:

6560122, May 6, 2003

Filed:

Sep 28, 2001

Appl. No.:

09/967676

Inventors:

Patrick O. Weber - Mountain View CA

Assignee:

Hestia Technologies, Inc. - Santa Clara CA

International Classification:

H01L 2331

US Classification:

361783, 361760, 361770, 257667, 257737, 257738, 257778, 257787, 257789, 174260

Abstract:

An integrated circuit chip package according to the present invention includes an integrated circuit chip that is mounted on a substrate by a reflow process and by a plurality of solder bumps. At least one standoff is located between the circuit chip and the substrate to maintain a distance between the circuit chip and the substrate during the reflow process. A mold compound is used for underfilling air gaps between the chip and the substrate. The integrated circuit chip package is formed by placing the chip and substrate within a mold cavity and pressing a transfer mold compound into the mold cavity. Air spaces between the integrated circuit chip and the substrate are underfilled by the mold compound as it is pressed in between the integrated circuit chip, the standoffs and the substrate. Air is allowed to escape from between the chip and the substrate during the underfilling through a vent which extends through the substrate. The underfilling material may also be used to encapsulate the chip at the same time that underfilling is performed.

US Patent:

20100014234, Jan 21, 2010

Filed:

Jul 16, 2008

Appl. No.:

12/174518

Inventors:

Patrick O. Weber - Santa Clara CA, US

Assignee:

HESTIA TECHNOLOGIES, INC. - Santa Clara CA

International Classification:

H05K 7/18
B29D 11/00
H05K 3/20

US Classification:

36167906, 264 17, 29831

Abstract:

A method of manufacturing a display monitor, the method comprising: molding a pixel array frame having a plurality of pixel cavities and at least one pixel wall positioned adjacent to at least two pixel cavities, at least one of the pixel cavities having a light pit therein; molding a light diffusing material in the pixel cavities, wherein the light diffusing material does not enter the light pit; selecting a substrate having a top surface and a bottom surface, the substrate having a light source, such as a LED, on the top surface; coupling the bottom surface of the substrate to a printed circuit board configured to controllably operate the light source, wherein the light source is received within the light pit; and coupling the molded pixel array frame to the substrate.

US Patent:

20110017264, Jan 27, 2011

Filed:

Feb 19, 2009

Appl. No.:

12/389310

Inventors:

Patrick Weber - Santa Clara CA, US
Kevin Gibson - Redwood City CA, US
Ramon Rosal Reglos - San Ramon CA, US
Rick Briere - Santa Clara CA, US
Alelie Funcell - Fremont CA, US

Assignee:

Solaria Corporation - Fremont CA

International Classification:

H01L 31/052

US Classification:

136246

Abstract:

A photovoltaic device. The photovoltaic device includes a photovoltaic region including a surface region and characterized by a first thermal expansion constant. The surface region includes a first portion and a second portion, the second portion includes a first edge region and a second edge region. The photovoltaic device includes a concentrator element comprising substantially of a polymer material and being characterized by a second thermal expansion constant. The concentrator element includes an aperture region and an exit region. The photovoltaic device includes an elastomer material to couple the first portion of the surface region of the photovoltaic region to the exit region of the concentrator element, while the first edge region and the second edge region remain exposed. The first edge region and the second edge region allow for compensation by at least thermal expansion of the concentrator element for a change in temperature ranging from about −45 Degrees Celsius to about 95 Degrees Celsius to maintain the exit region to be optically coupled to the photovoltaic region.

US Patent:

58015310, Sep 1, 1998

Filed:

Jan 18, 1996

Appl. No.:

8/544090

Inventors:

Elliot Viches - Sunnyvale CA
Mostafa Mahmoudian - San Carlos CA
Jagdeep S. Buttar - Union City CA
Oleg A. Gergel - Mountain View CA
Patrick A. Weber - Sunnyvale CA
Victor Rudman - Palo Alto CA
Harry Ray Duer - Boulder Creek CA

Assignee:

Read-Rite Corporation - Milpitas CA

International Classification:

G01R 3312
G11B 554
G11B 2114

US Classification:

324212

Abstract:

An apparatus for testing magnetic heads that interact with magnetic disks includes a translational slide and a rotatable arm mounted to one end of the slide. The translational slide moves the rotatable arm in a longitudinal direction parallel to the surface of a magnetic disk. The arm rotates the magnetic head to different positions relative to data tracks on the disk. A second translational slide moves the magnetic head vertically above the disk to adjust the vertical position of the head. The three movements of the head, (1)horizontally across the disk, (2)rotationally by the arm, and (3)vertically relative to the disk surface are controlled by servomechanisms. A read/write amplifier circuit is connected to the head under test. The test apparatus is controlled by a computer that interfaces with circuitry connected to the servomechanisms.

US Patent:

60993626, Aug 8, 2000

Filed:

May 13, 1998

Appl. No.:

9/078003

Inventors:

Elliot Viches - Sunnyvale CA
Mostafa Mahmoudian - San Carlos CA
Jagdeep S. Buttar - Union City CA
Oleg A. Gergel - Mountain View CA
Patrick A. Weber - Sunnyvale CA
Victor Rudman - Palo Alto CA
Harry Ray Duer - Boulder Creek CA

Assignee:

Read-Rite Corporation - Milpitas CA

International Classification:

H01R 448

US Classification:

439817

Abstract:

An apparatus for testing magnetic heads that interact with magnetic disks includes a translational slide and a rotatable arm mounted to one end of the slide. The translational slide moves the rotatable arm in a longitudinal direction parallel to the surface of a magnetic disk. The arm rotates the magnetic head to different positions relative to data tracks on the disk. A second translational slide moves the magnetic head vertically above the disk to adjust the vertical position of the head. The three movements of the head, (1)horizontally across the disk, (2)rotationally by the arm, and (3)vertically relative to the disk surface are controlled by servomechanisms. A read/write amplifier circuit is connected to the head under test. The test apparatus is controlled by a computer that interfaces with circuitry connected to the servomechanisms.

US Patent:

58444203, Dec 1, 1998

Filed:

Jan 27, 1997

Appl. No.:

8/788331

Inventors:

Patrick A. Weber - Sunnyvale CA
Mostafa Mahmoudian - San Carlos CA
Victor Rudman - Palo Alto CA
Oleg A. Gergel - Mountain View CA

Assignee:

Read-Rite Corporation - Milpitas CA

International Classification:

G01R 3102
H01R 13629
H01R 13639

US Classification:

324757

Abstract:

A test mixture for testing a head gimbal assembly has a flex interconnect circuit with one or more test pads, and includes a clamp assembly and a connector board. The clamp assembly is secured to the connector board for locking the test pads in position. The connector board includes probing pins that contact the test pads in order to establish an electrical path with the head gimbal assembly. The clamp assembly includes a base and a self-locking mechanism, with the base serving as an interface between the self-locking mechanism and the connector board. The self-locking mechanism serves to position the test pads in a desired relation relative to the probing pins and to clamp the test pads during testing. The self-locking mechanism includes a clamp arm having a guiding slide that receives part of the flex interconnect circuit for positioning the test pads within the self-locking mechanism. The connector board is secured to a magnetic test cartridge.

US Patent:

63240696, Nov 27, 2001

Filed:

Dec 13, 1999

Appl. No.:

9/459602

Inventors:

Patrick O. Weber - Mountain View CA

Assignee:

Hestia Technologies, Inc. - Santa Clara CA

International Classification:

H01L 2331

US Classification:

361783

Abstract:

An integrated circuit chip package according to the present invention includes an integrated circuit chip that is mounted on a substrate by a reflow process and by a plurality of solder bumps. At least one standoff is located between the circuit chip and the substrate to maintain a distance between the circuit chip and the substrate during the reflow process. A mold compound is used for underfilling air gaps between the chip and the substrate. The integrated circuit chip package is formed by placing the chip and substrate within a mold cavity and pressing a transfer mold compound into the mold cavity. Air spaces between the integrated circuit chip and the substrate are underfilled by the mold compound as it is pressed in between the integrated circuit chip, the standoffs and the substrate. Air is allowed to escape from between the chip and the substrate during the underfilling through a vent which extends through the substrate. The underfilling material may also be used to encapsulate the chip at the same time that underfilling is performed.

US Patent:

20190029119, Jan 24, 2019

Filed:

Jul 19, 2018

Appl. No.:

16/039719

Inventors:

- Lisle IL, US
Patrick Weber - Fremont CA, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H05K 3/12
H05K 1/09
H05K 3/22

Abstract:

A method of manufacturing includes bonding a paste material to an organic substrate by a polymer thick film (PTF) process to form a PTF trace, coating a sinterable material over the PTF trace, and sintering the sinterable material to the PTF trace.