Paul Alan Cole

US Patent:

6397461, Jun 4, 2002

Filed:

Feb 22, 2000

Appl. No.:

09/510939

Inventors:

Brian S. Jarrett - Hillsboro OR
Ronald C. Flamm - Olympia WA
Sanjay Pai - Hillsboro OR
George Daskalakis - Forest Grove OR
Craig Jahne - Beaverton OR
Paul A. Cole - Clackamas OR
Neal E. Broadbent - Portland OR
Stephen R. Brown - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01R 900

US Classification:

29842, 29762, 29764, 29845

Abstract:

A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

US Patent:

51666090, Nov 24, 1992

Filed:

May 24, 1990

Appl. No.:

7/530141

Inventors:

Paul A. Cole - Portland OR
Bozidar Janko - Portland OR
Richard G. Chambers - Portland OR
Wolfgang H. Herr - Beaverton OR
Douglas W. Trobough - Beaverton OR
Peter M. Compton - Beaverton OR

Assignee:

Tektronix, Inc. - Wilsonville OR

International Classification:

G01R 3102
H01R 909

US Classification:

324158F

Abstract:

A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.

US Patent:

61676136, Jan 2, 2001

Filed:

Oct 26, 1998

Appl. No.:

9/179110

Inventors:

Brian S. Jarrett - Hillsboro OR
Ronald C. Flamm - Olympia WA
Sanjay Pai - Hillsboro OR
George Daskalakis - Forest Grove OR
Craig Jahne - Beaverton OR
Paul A. Cole - Clackamas OR
Neal E. Broadbent - Portland OR
Stephen R. Brown - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B23P 1900

US Classification:

29762

Abstract:

A device is disclosed herein for engaging and disengaging electrical connector halves, particularly electrical connector halves mounted on printed assembly boards that are to be electrically connected to a back plane. The device provides a drive train mechanism comprised of a plurality of gears and racks that, when attached, act to reduce the insertion force required to make the electrical connector halves disposed on the printed board assemblies and the back plane. A further aspect of the present invention involves the method of attaching a back plane to at least one stationary printed board assembly by actuation of a drive train.

US Patent:

55482236, Aug 20, 1996

Filed:

Feb 16, 1995

Appl. No.:

8/390459

Inventors:

Paul A. Cole - Aloha OR
Emory J. Harry - Aloha OR
Michael A. Wright - Portland OR

Assignee:

Tektronix, Inc. - Wilsonville OR

International Classification:

G01R 1073

US Classification:

324754

Abstract:

An adapter for a measurement test instrument electrical probe has a flexible dielectric substrate with electrically conductive runs thereon. One end of the conductive runs has first electrical contacts with a pitch geometry corresponding to the pitch geometry of electrical contacts of an electronic device that is electrically connected to a substrate via the electrical contacts of the device. The other end of the conductive runs has second electrical contacts that have a pitch geometry compatible with the electrical probe of the measurement test instrument.

US Patent:

59031620, May 11, 1999

Filed:

Oct 14, 1997

Appl. No.:

8/949853

Inventors:

Paul A. Cole - Aloha OR
Emory J. Harry - Aloha OR
Michael A. Wright - Portland OR

Assignee:

Tektronix, Inc. - Wilsonville OR

International Classification:

G01R1/073

US Classification:

324754

Abstract:

An adapter for a measurement test instrument electrical probe has a flexible dielectric substrate with electrically conductive runs thereon. One end of the conductive runs has first electrical contacts with a pitch geometry corresponding to the pitch geormetry of electrical contacts of an electronic device that is electically connected to a substrate via the electrical contacts of the device. The other end of the conductive runs has second electrical contacts that have a pitch geometry compatible with the electrical probe of the measurement test instrument.

US Patent:

47086610, Nov 24, 1987

Filed:

Jul 28, 1986

Appl. No.:

6/889488

Inventors:

Mark R. Morland - Portland OR
Paul A. Cole - Portland OR
Ivan J. Cousins - Beaverton OR
Raymond A. Zandonatti - Beaverton OR

Assignee:

Tektronix, Inc. - Beaverton OR

International Classification:

H01R 909

US Classification:

439 77

Abstract:

A modified BNC connector for connecting an active probe to an active probe to an electronic instrument includes a female BNC input on the instrument for cooperatively mating with the male BNC output of the probe. The female BNC input includes a flex circuit mounted on a planar surface and disposed about the periphery of its outer coaxial shield. A plastic bezel fits over the flex circuit to permit access to contact points located thereon and to mask the remaining area. The male BNC connector is located in a housing which includes a set of spring loaded telescoping pins which make contact with the flex circuit contact points. The housing includes a rotatable knob that locks the male and female portions together.

US Patent:

51566494, Oct 20, 1992

Filed:

Nov 27, 1991

Appl. No.:

7/800655

Inventors:

Peter M. Compton - Beaverton OR
Paul A. Cole - Aloha OR

Assignee:

Tektronix, Inc. - Wilsonville OR

International Classification:

H01R 2368

US Classification:

439 68

Abstract:

An adapter for coupling electrical signal to and from an integrated circuit device mounted on a circuit board has a frame composed of individual side sections with each side section having ribs formed therein for providing detented cantilever engagement of the side sections to the sides of the IC device. Electrically conductive elements fit in between the ribs and engage the leads on the IC. The electrically conductive elements are connected to conductive pads formed on a substrate that is secured with the frame. A securing means that includes pins are used for securing the side sections together.

US Patent:

52026221, Apr 13, 1993

Filed:

Jun 24, 1991

Appl. No.:

7/720072

Inventors:

Paul A. Cole - Aloha OR
Bozidar Janko - Portland OR
Richard G. Chambers - Portland OR
Wolfgang H. Herr - Beaverton OR
Douglas W. Trobough - Beaverton OR
Peter M. Compton - Beaverton OR

Assignee:

Tektronix, Inc. - Wilsonville OR

International Classification:

G01R 3102
G01R 1073

US Classification:

324158F

Abstract:

A test fixture for a high pin count surface mounted IC device has a test head assembly connected to an adapter having electrically conductive elements that couple the output of the IC device to test points on the test head assembly. The test points are coupled to conductive pads on the test head assembly via conductive runs. The test head assembly conductive pads mate with conductive pad formed in the electrically conductive elements of the adapter. The conductive elements engage leads on the IC device providing conductive paths between the IC leads an the test points on the test head assembly. The test fixture is secured to the IC device by friction forces between the periphery of the IC device and the inner surface of the adapter. The test fixture or the adapter is usable as a low profile chip carrier by inverting the fixture or adapter and as a circuit board interconnect.