Paul F Connors

US Patent:

20200234982, Jul 23, 2020

Filed:

Apr 2, 2020

Appl. No.:

16/838128

Inventors:

- Santa Clara CA, US
Jeongmin LEE - San Ramon CA, US
Paul CONNORS - San Mateo CA, US
Dale R. DU BOIS - Los Gatos CA, US
Prashant Kumar KULSHRESHTHA - San Jose CA, US
Karthik Thimmavajjula NARASIMHA - San Francisco CA, US
Brett BERENS - San Jose CA, US
Kalyanjit GHOSH - Pleasanton CA, US
Jianhua ZHOU - Campbell CA, US
Ganesh BALASUBRAMANIAN - Fremont CA, US
Kwangduk Douglas LEE - Redwood City CA, US
Juan Carlos ROCHA-ALVAREZ - San Carlos CA, US
Hiroyuki OGISO - Sunnyvale CA, US
Liliya KRIVULINA - Santa Clara CA, US
Rick GILBERT - San Jose CA, US
Mohsin WAQAR - Alameda CA, US
Venkatanarayana SHANKARAMURTHY - San Jose CA, US
Hari K. PONNEKANTI - San Jose CA, US

International Classification:

H01L 21/67
H01J 37/32
H01L 21/687

Abstract:

Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

US Patent:

20190371630, Dec 5, 2019

Filed:

Aug 14, 2019

Appl. No.:

16/540304

Inventors:

- Santa Clara CA, US
Jeongmin Lee - San Ramon CA, US
Paul Connors - San Mateo CA, US
Dale R. Du Bois - Los Gatos CA, US
Prashant Kumar Kulshreshtha - San Jose CA, US
Karthik Thimmavajjula Narasimha - San Francisco CA, US
Brett Berens - San Jose CA, US
Kalyanjit Ghosh - Pleasanton CA, US
Jianhua Zhou - Campbell CA, US
Ganesh Balasubramanian - Fremont CA, US
Kwangduk Douglas Lee - Redwood City CA, US
Juan Carlos Rocha-Alvarez - San Carlos CA, US
Hiroyuki Ogiso - Sunnyvale CA, US
Liliya Krivulina - Santa Clara CA, US
Rick Gilbert - San Jose CA, US
Mohsin Waqar - Alameda CA, US
Venkatanarayana Shankaramurthy - San Jose CA, US
Hari K. Ponnekanti - San Jose CA, US

International Classification:

H01L 21/67
H01J 37/32
H01L 21/687

Abstract:

Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.

US Patent:

20170178758, Jun 22, 2017

Filed:

Dec 5, 2016

Appl. No.:

15/369219

Inventors:

- Santa Clara CA, US
Paul CONNORS - San Mateo CA, US
Jianhua ZHOU - Campbell CA, US
Juan Carlos ROCHA-ALVAREZ - San Carlos CA, US
Kwangduk Douglas LEE - Redwood City CA, US
Ziqing DUAN - Sunnyvale CA, US
Nicolas J. BRIGHT - Arlington WA, US
Feng BI - Cupertino CA, US

International Classification:

G21F 3/00
C23C 16/458
C23C 16/50
C23C 16/448

Abstract:

The present disclosure generally relates to a radiation shield for a process chamber which improves substrate temperature uniformity. The radiation shield may be disposed between a slit valve door of the process chamber and a substrate support disposed within the process chamber. In some embodiments, the radiation shield may be disposed under a heater of the process chamber. Furthermore, the radiation shield may block radiation and/or heat supplied from the process chamber, and in some embodiments, the radiation shield may absorb and/or reflect radiation, thus providing improved temperature uniformity as well as improving a planar profile of the substrate.

US Patent:

20160240410, Aug 18, 2016

Filed:

Apr 26, 2016

Appl. No.:

15/139274

Inventors:

- Santa Clara CA, US
Ganesh Balasubramanian - Fremont CA, US
JuanCarlos Rocha-Alvarez - San Carlos CA, US
Jeffrey B. Robinson - San Jose CA, US
Dale Robert du Bois - Los Gatos CA, US
Paul Connors - San Mateo CA, US

International Classification:

H01L 21/67
H01L 21/673
H01L 21/677

Abstract:

A substrate lift assembly is disclosed. The substrate lift assembly includes a lift frame, a plurality of fingers extending from the frame, the fingers adapted to support a substrate, and a containment ring supported by the lift frame. Process load locks including the substrate lift assembly are disclosed, as are other aspects.

US Patent:

20160211185, Jul 21, 2016

Filed:

Jan 15, 2015

Appl. No.:

14/598061

Inventors:

- Santa Clara CA, US
Todd Egan - Fremont CA, US
Paul Connors - San Mateo CA, US
Sergey Starik - Kyiv, UA
Ganesh Balasubramanian - Fremont CA, US

Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA

International Classification:

H01L 21/66
H01L 21/67
H01L 21/308

Abstract:

Methods and systems for alignment of substrate-scale masks are described. The alignment methods presented may improve the uniformity and repeatability of processes which are impacted by the relative lateral position of a substrate-scale mask and a substrate. The methods involve measuring the “overhang” of the substrate at multiple locations around the periphery of the substrate-scale mask. Based on the measurements, the relative position of the substrate relative to the substrate-scale mask is modified by adjustment of the substrate and/or mask position. The adjustment of the relative position is made in one adjustment in embodiments. A feature of hardware and methods involves the capability of making measurements and adjustments while a substrate processing system is fully assembled and possibly under vacuum.

US Patent:

20140262036, Sep 18, 2014

Filed:

Mar 10, 2014

Appl. No.:

14/203098

Inventors:

- Santa Clara CA, US
Ganesh Balasubramanian - Fremont CA, US
JuanCarlos Rocha-Alvarez - San Carlos CA, US
Jeffrey B. Robinson - San Jose CA, US
Dale Robert du Bois - Los Gatos CA, US
Paul Connors - San Mateo CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B23Q 3/16

US Classification:

15634531, 118500, 118719, 269287, 29559

Abstract:

A process load lock apparatus is disclosed. The process load lock apparatus includes a load lock chamber adapted to couple between a mainframe section and a factory interface, the load lock chamber including an entry and an exit each having a slit valve, and a load lock process chamber located at a different level than the load lock chamber at the load lock location wherein the load lock process chamber is adapted to carry out a process on a substrate, such as oxide removal or other processes. Systems including the process load lock apparatus and methods of operating the process load lock apparatus are provided. A lift assembly including a containment ring is also disclosed, as are numerous other aspects.