Paul J Diconza

US Patent:

20030203224, Oct 30, 2003

Filed:

May 19, 2003

Appl. No.:

10/440668

Inventors:

Paul DiConza - Clifton Park NY, US
Dennis Gray - Delanson NY, US

International Classification:

B32B009/00

US Classification:

428/472000, 428/701000, 428/702000, 428/332000

Abstract:

A thermal barrier coating for an article, such as a component of a turbine assembly. The thermal barrier coating comprises a ceramic material and has a plurality of substantially vertical cracks therein and a porosity that is within a predetermined range. The ratio of tensile adhesion strength to modulus of elasticity of the thermal barrier coating has a value of between about 6×10and about 15×10. The thermal barrier coating is formed by air spraying the ceramic material onto a metallic bond coat which has been previously applied to a substrate and heating the coated article to between about 1040 C. and about 1200 C. for a predetermined time.

US Patent:

55679854, Oct 22, 1996

Filed:

Jun 1, 1995

Appl. No.:

8/457551

Inventors:

Charles D. Iacovangelo - Niskayuna NY
Paul J. DiConza - Clifton Park NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

H01L 2302
H01L 3902

US Classification:

257701

Abstract:

Differences in thermal expansion properties between integrated circuit chips, especially of gallium arsenide, and the dielectric substrates (especially diamond and aluminum nitride) on which said chips are mounted are accommodating by interposing between the substrate and the chip a mixed metal layer comprising at least one ductile, thermally conductive metal such as copper and at least one other metal, preferably a refractory metal, having a lower coefficient of thermal expansion, preferably tungsten. A compliant metal layer, typically of aluminum, silver, copper or gold, is preferably interposed between the substrate and the mixed metal layer.

US Patent:

53726812, Dec 13, 1994

Filed:

Jul 26, 1993

Appl. No.:

8/096807

Inventors:

Charles D. Iacovangelo - Schenectady NY
Paul J. DiConza - Clifton Park NY

Assignee:

General Electric Company - Schenectady NY

International Classification:

C25C 336

US Classification:

204 71

Abstract:

Divalent titanium is prepared by the reduction of higher valence titanium halides in a molten salt electrolyte for subsequent titanium deposition with aluminum to form alloys exhibiting excellent mechanical properties for use at high temperatures. At least one aluminum halide such as AlCl. sub. 3 is combined with aluminum metal, at least one titanium halide such as TiCl. sub. 3 where the titanium has a valence greater than two, and at least one salt capable of forming a melt with said aluminum halide at temperatures up to about 250. degree. C. to form a molten salt electrolyte. The salt may be an alkali, alkaline earth or organic halide. Upon heating in an inert atmosphere at a temperature greater than the melting point of the electrolyte, the higher valence titanium is reduced by aluminum metal to form divalent titanium. Titanium-aluminum alloys of up to 50 atomic percent titanium can then be deposited from the electrolyte.