Paul A Ouellette

US Patent:

6844992, Jan 18, 2005

Filed:

Mar 18, 2003

Appl. No.:

10/390176

Inventors:

Thomas A. Schaefer - Groveland MA, US
Gregory G. Cappiello - Windham NH, US
Ninghui Zhu - Winchester MA, US
Kurt E. Abdelmaseh - Worcester MA, US
Evgueni V. Babenko - Manchester NH, US
William J. Hubbard - Litchfield NH, US
Kevin J. McIntyre - Derry NH, US
Brian J. McKeen - Bow NH, US
Paul Ouellette - North Andover MA, US
Andrew Radl - Dunbarton NH, US
Dick Rolfe - Biddeford ME, US

Assignee:

Confluent Photonics Corporation - Salem NH

International Classification:

G02B 702

US Classification:

359820, 359821, 359822, 359823

Abstract:

An opto-mechanical platform for supporting truncated optical elements having at least one substantially flat side surface is disclosed. In one particular exemplary embodiment, the opto-mechanical platform may be realized as an apparatus for supporting truncated optical elements having at least one substantially flat side surface. Such an apparatus may comprise a platform having a substantially flat surface area for supporting the substantially flat side surface of the truncated optical elements. Such an apparatus may also comprise at least one substantially vertical wall formed on at least a portion of the platform for providing mechanical rigidity to the platform.

US Patent:

20050073757, Apr 7, 2005

Filed:

Mar 18, 2003

Appl. No.:

10/390152

Inventors:

Ian Turner - Stratham NH, US
Ian Prees - Chelmsford MA, US
Gregory Cappiello - Windham NH, US
Paul Ouellette - North Andover MA, US
Thomas Schaefer - Groveland MA, US

International Classification:

G02B007/182

US Classification:

359871000

Abstract:

A technique for attaching an optical element to a structural element is disclosed. In one particular exemplary embodiment, the technique may be realized as an optical element mounting apparatus. Such an apparatus may comprise a base structure, a first mounting pad located on a first flexure formed in the base structure, a second mounting pad located on a second flexure formed in the base structure, and a third mounting pad located on the base structure, wherein the first, second, and third mounting pads support an optical element mounted thereon.

US Patent:

44821972, Nov 13, 1984

Filed:

Oct 29, 1982

Appl. No.:

6/437723

Inventors:

Paul J. Ouellette - Amesbury MA
Vincent F. Riviezzo - Salem NH

Assignee:

AT&T Technologies, Inc. - New York NY

International Classification:

H01R 402

US Classification:

339 17C

Abstract:

A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more than 45. degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation. During the assembling operation, compressive forces also are applied to the lead (10) above and below substrate-engaging stop tabs (56) to force the clamping finger (20) and the contact finger (22) into firm engagement with respective opposite sides of the substrate circuit device (16).

US Patent:

43458149, Aug 24, 1982

Filed:

Feb 4, 1981

Appl. No.:

6/231569

Inventors:

Ernst A. Gutbier - North Andover MA
Paul J. Ouellette - Amesbury MA

Assignee:

Western Electric Company, Inc. - New York NY

International Classification:

H01R 906

US Classification:

339275R

Abstract:

A solder-bearing lead (10) is provided with solder flow-control stops (20 and 22) on opposite surfaces of a contact finger (18) closely adjacent a flux-bearing solder preform (12) on the contact finger, to preclude flow of molten solder from the solder preform along the contact finger to a stem (26) of the lead in a soldering operation. The first solder flow-control stop (20) forces the molten solder to flow directly across sides of the contact finger (18) to a contact pad (14), where it is confined by the second solder flow-control stop (22) to form a soldered connection (24) in a reduced time period and without the necessity for any significant supplemental fluxing. Additional solder flow-control stops (38 and 40) also are formed on resilient spring clamping fingers (28) of the lead. The solder flow-control stops (20, 22, 38 and 40) are formed by oxidized portions of a phosphor bronze base metal from which portions of solder-wettable tin coatings (42 and 44) have been removed.

US Patent:

45374619, Aug 27, 1985

Filed:

Jul 28, 1982

Appl. No.:

6/402684

Inventors:

Paul J. Ouellette - Amesbury MA

Assignee:

AT&T Technologies, Inc. - Berkeley Heights NJ

International Classification:

H01R 1122
H01R 402

US Classification:

339258R

Abstract:

A solder-bearing lead (10) includes a contact clamping finger (20) having an arcuate, reverse-bent clamping portion (34) which is wrapped about a solder preform (12) so that a surface portion (24) of the preform and an outer end surface portion (22) of the contact finger both directly engage a contact pad (14) on a substrate circuit device (16) when the lead is mounted on the device. When the lead (10) is temporarily subjected to heat in a soldering operation, the solder preform (12) melts and flows directly over the contact pad (14) and then resolidifies to form a soldered connection (28) having the outer end surface portion (22) of the reverse-bent clamping portion (34) of the contact clamping finger (20) embedded in the soldered connection in firm engagement with the contact pad (14).

US Patent:

41775546, Dec 11, 1979

Filed:

Apr 26, 1978

Appl. No.:

5/900220

Inventors:

Ernest E. Deveres - Lowell MA
Paul J. Ouellette - Amesbury MA
Joseph F. Pollitt - Bradford MA

Assignee:

Western Electric Co., Inc. - New York NY

International Classification:

H05K 332

US Classification:

29626

Abstract:

Solderable leads (22) of the type which project in parallel relationship from a continuous independent support rail (30) are rapidly and efficiently assembled to substrates (26) by simultaneously feeding a pair of the independent support rails (30) and their associated leads (22) to locate successive leading sets of leads (22) on opposite sides of a lead-substrate assembling position (36). In the assembling position outer portions of the leading sets of leads (22) are engaged to move the leads (22) in opposite directions toward a substrate (26), so as to cut the support rails (30) and thus sever the leading sets of leads (22) from the remaining leads (22) on the support rails (30). Continued movement of the severed sets of leads (22) then causes the leads (22) to be assembled to respective opposite sides of the substrate (26) simultaneously. During the cutting and assembling operations inner portions of the leading sets of leads (22) are engaged to retain the leads (22) in alignment with respective terminals (24) on the substrate (26).