Pei Yuen Chen

Address:

323 Monticello Ave, San Jose, CA 95125

Phone:

4087331878

VIN:

5TDKK3DC2CS272334

Make:

TOYOTA

Model:

SIENNA

Year:

2012

US Patent:

6532134, Mar 11, 2003

Filed:

Jul 26, 1996

Appl. No.:

08/686567

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 560

US Classification:

3602352, 3602366, 3602358

Abstract:

A silicon coating on an air bearing surface for magnetic thin film heads. A thick silicon layer is provided to replace metallic layers such as TiW as an overcoat for thin film heads. The silicon layer will provide a durable head-disk interface and act as a reflective surface for fly height measurement. The silicon layer can be planarized with the pole tips to avoid any magnetic spacing loss. The thickness of the silicon coating is preferably between 125 and 6500 angstroms thick. The slider body may be fabricated from silicon such that the silicon coating is substantially identical to the silicon slider body, thereby preventing thermal mismatch therebetween. The silicon coating is preferably applied using a magnetron sputtering technique which provides a high rate of deposition of silicon to form a dense, low stress silicon layer.

US Patent:

7296420, Nov 20, 2007

Filed:

Dec 2, 2004

Appl. No.:

11/001795

Inventors:

Pei Chen - Campbell CA, US
Jorge Goitia - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Bigal Leung - Redwood City CA, US
Diana Perez - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies Amsterdam, B.V. - Amsterdam

International Classification:

F25D 25/00
F25D 17/06
F25D 23/12

US Classification:

62 62, 62 89, 622592, 16510433

Abstract:

Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.

US Patent:

7481312, Jan 27, 2009

Filed:

Dec 2, 2004

Appl. No.:

11/001798

Inventors:

Pei Chen - Campbell CA, US
Jorge Goitia - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Bigal Leung - Redwood City CA, US
Diana Perez - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

International Classification:

B65D 85/00

US Classification:

206386, 206710, 118724

Abstract:

Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

US Patent:

7613372, Nov 3, 2009

Filed:

Oct 10, 2007

Appl. No.:

11/870404

Inventors:

Xin Simon Luo - Monterey Park CA, US
Pei Chuang Chen - La Canada Flintridge CA, US
Leming Wang - Arcadia CA, US
Zhijie Wang - Arcadia CA, US

Assignee:

AGX Technologies, Inc. - Monrovia CA

International Classification:

G02B 6/32

US Classification:

385 33, 365 15, 365 31

Abstract:

A coupling apparatus includes a lens disposed between a port, such as a photodetector, and a light source, such as a fiber. The lens is aligned such that light emitted from the light source is focused by the lens onto the port. Between the lens and light source and/or lens and port, a low contrast medium is disposed to reduce reflection that could degrade signal strength.

US Patent:

7846305, Dec 7, 2010

Filed:

Mar 1, 2005

Appl. No.:

11/070530

Inventors:

Pei Cheh Chen - Campbell CA, US
Omar Eduardo Montero Camacho - Jalisco, MX
Laurence Scott Samuelson - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies, Netherlands, B.V. - Amsterdam

International Classification:

C23C 14/34

US Classification:

20419234, 20419232, 20429832, 20429836

Abstract:

A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.

US Patent:

20090021816, Jan 22, 2009

Filed:

Sep 12, 2007

Appl. No.:

11/853815

Inventors:

Xin Simon Luo - Monterey Park CA, US
Pei Chuang Chen - La Canada Flintridge CA, US
Leming Wang - Arcadia CA, US
Zhijie Wang - Arcadia CA, US

International Classification:

G02B 26/08

US Classification:

359196

Abstract:

An apparatus and method steer a light through a lens into a receiving port via a steering device. The steering device is located between the lens and a light source. A feedback mechanism adjusts the steering device to correct for aberration.

US Patent:

20130051413, Feb 28, 2013

Filed:

Aug 25, 2011

Appl. No.:

13/218341

Inventors:

Pei Chuang Chen - Monrovia CA, US
Leming Wang - Monrovia CA, US
Xin Simon Luo - Monrovia CA, US

Assignee:

AGX Technologies, Inc. - Monrovia CA

International Classification:

H01S 3/04

US Classification:

372 36

Abstract:

An internal laser module may be capable of providing a similar high performance as that provided by traditional internally cooled laser modules, but with improved cost efficiency and manufacturability. In the internally cooled laser module, a laser subassembly, such as a coaxial semiconductor laser, may be mounted on a thermoelectric cooler cooler-base with several other components enclosed in a properly designed case.

US Patent:

60238402, Feb 15, 2000

Filed:

Aug 31, 1998

Appl. No.:

9/144000

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 542

US Classification:

2960312

Abstract:

A single layer wear coating is provided for a magnetic head assembly. The single layer is silicon or silicon-based material with a thickness in the range of 30-75. ANG. The single layer may be formed by a single step of deposition employing a DC magnetron. The single layer wear coating improves the wear performance of the magnetic head assembly and protects one or more sensitive elements of a magnetic head without significant reduction of spacing loss.