Peter M Engelgau

age ~73

from Dover, DE

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Peter Engelgau Phones & Addresses

  • 15 Bradford St, Dover, DE 19904 • 3027343965
  • Newark, DE
  • Oxford, PA

Us Patents

  • Method Of Forming Electronic Packages

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  • US Patent:
    51634996, Nov 17, 1992
  • Filed:
    May 9, 1990
  • Appl. No.:
    7/520936
  • Inventors:
    Marc S. Newkirk - Newark DE
    Danny R. White - Elkton MD
    Christopher R. Kennedy - Newark DE
    Alan S. Nagelberg - Wilmington DE
    Michael K. Aghajanian - Bel Air MD
    Robert J. Wiener - Newark DE
    Steven D. Keck - Hockessin DE
    John T. Burke - Hockessin DE
    Peter M. Engelgau - Dover DE
    Michael A. Rocazella - Newark DE
  • Assignee:
    Lanxide Technology Company, LP - Newark DE
  • International Classification:
    B22D 1914
    B23K 3100
  • US Classification:
    164 98
  • Abstract:
    The present invention relates to the formation of a macrocomposite body by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Particularly, an infiltration enhancer and/or infiltration enhancer precursor and/or infiltrating atmosphere are in communication with a filler material or a preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform, the infiltrated material is bonded to the second material, thereby forming a sealable electronic package.

  • Methods Of Forming Electronic Packages

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  • US Patent:
    55268676, Jun 18, 1996
  • Filed:
    Jun 6, 1995
  • Appl. No.:
    8/467482
  • Inventors:
    Steven D. Keck - Hockessin DE
    Michael A. Rocazella - Newark DE
    Peter M. Engelgau - Dover DE
    Gregory E. Hannon - Newark DE
    Danny R. White - Elkton MD
    Alan S. Nagelberg - Wilmington DE
  • Assignee:
    Lanxide Technology Company, LP - Newark DE
  • International Classification:
    B22D 1914
  • US Classification:
    164 97
  • Abstract:
    The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material or a preform with molten matrix metal and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its performance or bonding capabilities.
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