Peter S Farrell

US Patent:

7166911, Jan 23, 2007

Filed:

Sep 28, 2004

Appl. No.:

10/952424

Inventors:

Maurice S. Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter W. Farrell - Lunenburg MA, US
Michael W. Judy - Wakefield MA, US
Lawrence E. Felton - Hopkinton MA, US
Lewis Long - Woburn MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/12

US Classification:

257711, 257710, 257669, 257E23188

Abstract:

A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator.

US Patent:

8344487, Jan 1, 2013

Filed:

Jun 28, 2007

Appl. No.:

11/770369

Inventors:

Xin Zhang - Acton MA, US
Michael Judy - Ipswich MA, US
Kevin H. L. Chau - Danville CA, US
Nelson Kuan - Brookline MA, US
Timothy Spooner - Dunstable MA, US
Chetan Paydenkar - Cambridge MA, US
Peter Farrell - Lunenburg MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/495

US Classification:

257669, 257738, 257685, 257686, 257E23045, 438118, 438126, 438127, 438666

Abstract:

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

US Patent:

20050056870, Mar 17, 2005

Filed:

Sep 28, 2004

Appl. No.:

10/952330

Inventors:

Maurice Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter Farrell - Lunenburg MA, US
Michael Judy - Wakefield MA, US
Lawrence Felton - Hopkinton MA, US

International Classification:

H01L023/48

US Classification:

257222000

Abstract:

A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.

US Patent:

57366071, Apr 7, 1998

Filed:

Jun 5, 1995

Appl. No.:

8/464320

Inventors:

John R. Martin - Foxborough MA
Peter W. Farrell - Acton MA

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 2160
C08L 8100

US Classification:

524609

Abstract:

A semiconductor die is packaged in a hermetically sealed ceramic dual in-line package (cerdip) with a non-standard polysulfone film, or with a paste made from the film, as a die attach material. A cerdip process heats to temperatures of at least about 380. degree. C. The paste is produced by dissolving the film with NMP or with a blend including NMP, and adding a thixotropic agent. The paste or film forms a bond in a cerdip with less than 5000 ppm moisture without using a getter.