Peter J Farrell

US Patent:

6893574, May 17, 2005

Filed:

Oct 23, 2001

Appl. No.:

10/002953

Inventors:

Lawrence E. Felton - Hopkinton MA, US
Peter W. Farrell - Lunenburg MA, US
Jing Luo - Lexington MA, US
David J. Collins - Windham NH, US
John R. Martin - Foxborough MA, US
William A. Webster - Tewksbury MA, US

International Classification:

C23F001/00
H01L021/44
H01L021/48
H01L021/50

US Classification:

216 2, 438113

Abstract:

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

US Patent:

7166911, Jan 23, 2007

Filed:

Sep 28, 2004

Appl. No.:

10/952424

Inventors:

Maurice S. Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter W. Farrell - Lunenburg MA, US
Michael W. Judy - Wakefield MA, US
Lawrence E. Felton - Hopkinton MA, US
Lewis Long - Woburn MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/12

US Classification:

257711, 257710, 257669, 257E23188

Abstract:

A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator.

US Patent:

8344487, Jan 1, 2013

Filed:

Jun 28, 2007

Appl. No.:

11/770369

Inventors:

Xin Zhang - Acton MA, US
Michael Judy - Ipswich MA, US
Kevin H. L. Chau - Danville CA, US
Nelson Kuan - Brookline MA, US
Timothy Spooner - Dunstable MA, US
Chetan Paydenkar - Cambridge MA, US
Peter Farrell - Lunenburg MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/495

US Classification:

257669, 257738, 257685, 257686, 257E23045, 438118, 438126, 438127, 438666

Abstract:

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

US Patent:

20050056870, Mar 17, 2005

Filed:

Sep 28, 2004

Appl. No.:

10/952330

Inventors:

Maurice Karpman - Brookline MA, US
Nicole Hablutzel - Cambridge MA, US
Peter Farrell - Lunenburg MA, US
Michael Judy - Wakefield MA, US
Lawrence Felton - Hopkinton MA, US

International Classification:

H01L023/48

US Classification:

257222000

Abstract:

A packaged microchip has a microchip attach region with a lower modulus of elasticity than other portions of the package base. Specifically, the packaged microchip includes a stress sensitive microchip, and a package having a base with a primary region and an attach region. A surface of the microchip is coupled to the attach region of the package. The attach region has a modulus of elasticity that is less than the modulus of elasticity of the primary region.

US Patent:

57366071, Apr 7, 1998

Filed:

Jun 5, 1995

Appl. No.:

8/464320

Inventors:

John R. Martin - Foxborough MA
Peter W. Farrell - Acton MA

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 2160
C08L 8100

US Classification:

524609

Abstract:

A semiconductor die is packaged in a hermetically sealed ceramic dual in-line package (cerdip) with a non-standard polysulfone film, or with a paste made from the film, as a die attach material. A cerdip process heats to temperatures of at least about 380. degree. C. The paste is produced by dissolving the film with NMP or with a blend including NMP, and adding a thixotropic agent. The paste or film forms a bond in a cerdip with less than 5000 ppm moisture without using a getter.