Peter H Farrell

US Patent:

6893574, May 17, 2005

Filed:

Oct 23, 2001

Appl. No.:

10/002953

Inventors:

Lawrence E. Felton - Hopkinton MA, US
Peter W. Farrell - Lunenburg MA, US
Jing Luo - Lexington MA, US
David J. Collins - Windham NH, US
John R. Martin - Foxborough MA, US
William A. Webster - Tewksbury MA, US

International Classification:

C23F001/00
H01L021/44
H01L021/48
H01L021/50

US Classification:

216 2, 438113

Abstract:

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

US Patent:

8344487, Jan 1, 2013

Filed:

Jun 28, 2007

Appl. No.:

11/770369

Inventors:

Xin Zhang - Acton MA, US
Michael Judy - Ipswich MA, US
Kevin H. L. Chau - Danville CA, US
Nelson Kuan - Brookline MA, US
Timothy Spooner - Dunstable MA, US
Chetan Paydenkar - Cambridge MA, US
Peter Farrell - Lunenburg MA, US

Assignee:

Analog Devices, Inc. - Norwood MA

International Classification:

H01L 23/495

US Classification:

257669, 257738, 257685, 257686, 257E23045, 438118, 438126, 438127, 438666

Abstract:

A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.

US Patent:

D3384144, Aug 17, 1993

Filed:

Jun 27, 1990

Appl. No.:

7/544477

Inventors:

Peter J. Farrell - Baldwinville MA

US Classification:

D10 69