Peter R Miller

US Patent:

6617526, Sep 9, 2003

Filed:

Apr 23, 2001

Appl. No.:

09/839151

Inventors:

Peter A. Miller - Orlando FL

Assignee:

Lockheed Martin Corporation - Bethesda MD

International Classification:

H01R 1204

US Classification:

174261, 174255, 174262, 174266, 361792, 361794, 361795

Abstract:

A via on a printed circuit board having a circuit has a first interconnect and a second interconnect located about at least a portion of the first interconnect. The second interconnect connects to ground of the circuit and is coaxial and substantially concentric with the first interconnect and inductively coupled with the first interconnect. A method of electrically interconnecting at a via multiple layers on a printed circuit board to provide a common ground plane for a circuit is also provided. A high speed interconnection can be attained by allowing the ground return path for a circuit carried on multiple layers of a multilayer printed circuit board to remain coupled to the signal, thereby lowering ground inductance and maintaining signal integrity, even at UHF, while minimizing costs.

US Patent:

46111263, Sep 9, 1986

Filed:

Oct 4, 1984

Appl. No.:

6/657557

Inventors:

Peter A. Miller - Orlando FL

Assignee:

Werkzeugmaschinenfabrik Oerlikon-Buehrle AG - Zurich

International Classification:

H02J 700

US Classification:

307 64

Abstract:

A power on-off reset generator for monitoring a power supply for a logic system powered from the monitored power supply. A precision-voltage sensor produces a control signal for a time delay circuit when the power supply rises above a preselected value. A delay signal is generated which maintains an active-LOW control signal to the logic system and causes a Schmitt trigger circuit to produce a HIGH control signal to the logic system at the end of the delay signal.