Peter W Robinson

US Patent:

6632300, Oct 14, 2003

Filed:

Jun 12, 2001

Appl. No.:

09/879616

Inventors:

John F. Breedis - Trumbull CT
Dennis R. Brauer - Brighton IL
Peter W. Robinson - Branford CT

Assignee:

Olin Corporation - New Haven CT

International Classification:

C22C 904

US Classification:

148434, 148433, 420477, 420478, 420479, 420480, 420481, 420482, 420483, 420484

Abstract:

A copper alloy having improved stress relaxation resistance is formed from a copper base alloy that consists, by weight, essentially of 1. 8%-3. 0% iron, 0. 01%-1. 0% zinc, 0. 001 %-0. 25% phosphorus, 0. 1 %-0. 35% magnesium and the balance is copper and unavoidable impurities. When compared to other copper base alloys that include iron, zinc and phosphorous, the disclosed alloy has improved resistance to stress relaxation. In addition, directionality of stress relaxation resistance (where stress relaxation resistance is typically poorer in a transverse strip direction relative to a longitudinal strip direction for a copper alloy that is strengthened by cold rolling) is reduced to being nearly equivalent, regardless of strip direction. The alloy is particularly useful for electronic applications, such as being formed into an electrical connectors.

US Patent:

6640724, Nov 4, 2003

Filed:

Aug 4, 1999

Appl. No.:

09/366586

Inventors:

Peter W. Robinson - Branford CT
Jack D. Dippold - Edwardsville IL

Assignee:

Olin Corporation - East Alton IL

International Classification:

F42B 700

US Classification:

102517, 102501

Abstract:

A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.

US Patent:

7159519, Jan 9, 2007

Filed:

Sep 2, 2003

Appl. No.:

10/653516

Inventors:

Peter W. Robinson - Branford CT, US
Jack D. Dippold - Edwardsville IL, US

Assignee:

Olin Corporation - East Alton IL

International Classification:

F42B 7/00
F42B 8/14

US Classification:

102517, 102501, 102506

Abstract:

A frangible projectile for expelling from an industrial ballistic tool may be formed by a powder metallurgy process. A preferred embodiment of slug consists essentially of compacted and optionally sintered material and comprises up to 35% ferrotungsten in particulate form, up to 3% lubricant, and the balance iron in particulate form with inevitable impurities.

US Patent:

7182823, Feb 27, 2007

Filed:

Jun 30, 2003

Appl. No.:

10/610433

Inventors:

Frank N. Mandigo - North Branford CT, US
Peter W. Robinson - Glen Carbon IL, US
Derek E. Tyler - Cheshire CT, US
Andreas Boegel - Weissenhorn, DE
Hans-Achim Kuhn - Illertissen, DE
Frank M. Keppeler - Stuttgart, DE
Joerg Seeger - Ulm, DE

Assignee:

Olin Corporation - East Alton IL

International Classification:

C22C 9/06

US Classification:

148435, 148433, 148434, 148436

Abstract:

A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2. 5% of nickel, from 0. 5% to 2. 0% of cobalt, from 0. 5% to 1. 5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1. 7% to 4. 3%, the ratio of nickel to cobalt is from 1. 01:1 to 2. 6:1, the amount of (Ni+Co)/Si is between 3. 5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f).

US Patent:

7391116, Jun 24, 2008

Filed:

Oct 12, 2004

Appl. No.:

10/962917

Inventors:

Szuchain F. Chen - Hamden CT, US
Nicole A. Lasiuk - Spring TX, US
John E. Gerfen - St.Charles MO, US
Peter W. Robinson - Glen Carbon IL, US
Abid A. Khan - Ellisville MO, US

Assignee:

GBC Metals, LLC - East Alton IL

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257762, 257635, 257700, 257748, 257758

Abstract:

A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer. An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers.

US Patent:

7808109, Oct 5, 2010

Filed:

Jun 24, 2008

Appl. No.:

12/145420

Inventors:

Szuchain F. Chen - Hamden CT, US
Nicole A. Lasiuk - Niskayuna NY, US
John E. Gerfen - St. Charles MO, US
Peter R. Robinson - Glen Carbon IL, US
Abid A. Khan - Ellisville MO, US

Assignee:

GBC Metals, L.L.C. - East Alton IL

International Classification:

H01L 27/00

US Classification:

257762, 438653

Abstract:

An electrically conductive material coated with a plurality of layers, includes a metal or metal alloy substrate; a barrier layer deposited on said substrate effective to inhibit diffusion of constituents of said substrate to said plurality of layers; a sacrificial layer deposited on said barrier layer effective to form intermetallic compounds with tin; a low resistivity oxide metal layer deposited on said sacrificial layer; and an outermost layer of tin or a tin-base alloy directly deposited on said low resistivity oxide metal layer.

US Patent:

8257515, Sep 4, 2012

Filed:

Oct 7, 2005

Appl. No.:

11/246966

Inventors:

Frank N. Mandigo - North Branford CT, US
Peter W. Robinson - Glen Carbon IL, US
Derek E. Tyler - Cheshire CT, US
Andreas Boegel - Weissenhorn, DE
Hans-Achim Kuhn - Illertissen, DE
Frank M. Keppeler - Stuttgart, DE
Joerg Seeger - Ulm, DE

Assignee:

GBC Metals, LLC - East Alton IL
Wieland-Werke, AG - Ulm

International Classification:

C22F 1/08

US Classification:

148554, 148685

Abstract:

A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2. 5% of nickel, from 0. 5% to 2. 0% of cobalt, with a total nickel plus cobalt content of from 1. 7% to 4. 3%, from 0. 5% to 1. 5% of silicon with a ratio of (Ni+Co)/Si of between 3. 5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up 1% of silver. A process to manufacture the alloys of the invention as well as other copper-nickel-silicon alloys includes the sequential steps of (a). casting the copper alloy; (b). hot working the cast copper-base alloy to effect a first reduction in cross-sectional area; (c).

US Patent:

8430979, Apr 30, 2013

Filed:

Oct 26, 2006

Appl. No.:

11/588111

Inventors:

Frank N. Mandigo - North Branford CT, US
Peter W. Robinson - Glen Carbon IL, US
Derek E. Tyler - Cheshire CT, US
Andreas Boegel - Weissenhorn, DE
Hans-Achim Kuhn - Illertissen, DE
Frank M. Keppeler - Stuttgart, DE
Joerg Seeger - Ulm, DE

Assignee:

GBC Metals, LLC - East Alton IL

International Classification:

C22C 9/06

US Classification:

148435, 148433, 148434, 148436, 420485, 420486, 420487, 420488

Abstract:

A copper alloy having an improved combination of yield strength and electrical conductivity contains, by weight, from 1% to 2. 5% of nickel, from 0. 5% to 2. 0% of cobalt, with a total nickel plus cobalt content of from 1. 7% to 4. 3%, from 0. 5% to 1. 5% of silicon with a ratio of (Ni+Co)/Si of between 3. 5 and 6, and the balance copper and inevitable impurities wherein the wrought copper alloy has an electrical conductivity in excess of 40% IACS. A further increase in the combination of yield strength and electrical conductivity as well as enhanced resistance to stress relaxation is obtained by a further inclusion of up to 1% of silver.