Phyllis J Nelson

US Patent:

6711280, Mar 23, 2004

Filed:

May 25, 2001

Appl. No.:

09/866072

Inventors:

Oscar M. Stafsudd - Los Angeles CA 90077-1806
Ioannis Kanellakopoulos - Cupertino CA 95014-2662
Phyllis R. Nelson - Mt Baldy CA 91759
Nicholas Bambos - San Mateo CA 94401

Assignee:

Oscar M. Stafsudd - Los Angeles CA
Ioannis Kanellakopoulos - Cupertino CA
Phyllis R. Nelson - Mt. Baldy CA
Nicholas Bambos - San Mateo CA

International Classification:

G06R 900

US Classification:

382106, 382194, 382299, 382260, 348622, 359385

Abstract:

A method and system for ranging an object are disclosed. The method includes illuminating a field of view potentially including the object, synchronously receiving reflected signals from the field of view with and without illumination, capturing first and second images within an array, and generating a subtraction image using the images. One image is captured in the array while the other image is in the array. The first and second images include reflected signals from the field of view with and without illumination, respectively. The array includes first and second groups of lines that are unmasked and masked, respectively. In one exposure, the first group of lines is loaded with the first or second image. The image in the first group of lines is shifted into the second group. In another exposure, the first group of lines is loaded with the other image, which is shifted into the second group.

US Patent:

56591950, Aug 19, 1997

Filed:

Jun 8, 1995

Appl. No.:

8/489023

Inventors:

William J. Kaiser - Los Angeles CA
Kristofer S. J. Pister - Pacific Palisades CA
Oscar M. Stafsudd - Los Angeles CA
Phyllis R. Nelson - Mar Vista CA
Amit Burstein - N. Hollywood CA

Assignee:

The Regents of the University of California - Oakland CA

International Classification:

H01L 2982

US Classification:

257415

Abstract:

Improved microsensors are provided by combining surface micromachined substrates, including integrated CMOS circuitry, together with bulk micromachined wafer bonded substrates which include at least part of a microelectromechanical sensing element. In the case of an accelerometer, the proof mass is included within the wafer bonded bulk machined substrate, which is bonded to the CMOS surface machine substrate, which has corresponding etch pits defined therein over which the wafer bonded substrate is disposed, and in the case of accelerometer, the proof mass or thin film membranes in the case of other types of detectors such as acoustical detectors or infrared detectors. A differential sensor electrode is suspended over the etch pits so that the parasitic capacitance of the substrate is removed from the capacitance sensor, or in the case of a infrared sensor, to provide a low thermal conductance cavity under the pyroelectric refractory thin film. Where a membrane suspended electrode is utilized over an etch pit, one or more apertures are defined therethrough to avoid squeeze film damping. Accelerometers built according to the methodology are provided with a nulling feedback voltage to maintain the switch DC voltage across sensing capacitors in a null condition and to maintain high sensitivity without requiring either a precision transformer or regulated power sources in the capacitance bridge of the accelerometer.