Pongsak T Tiengtum from 17 Bramford St, San Juan Capistrano, CA 92694, age 51, Phone: 9494295423

Thermal Chamber For Ic Chip Testing
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US Patent:

20130008628, Jan 10, 2013
Filed:

Jul 8, 2011
Appl. No.:

13/179341
Inventors:

Pongsak Tiengtum - Ladera Ranch CA, US
Enrique Paz - Ladera Ranch CA, US
Assignee:

Titan Semiconductor Tool, LLC - Ladera Ranch CA
International Classification:

F28F 27/02
F16B 2/10
F16M 13/02
US Classification:

165100, 2482247
Abstract:

A thermal chamber and system for influencing the temperature of an IC chip under test including a thermal block that receives a chip socket, the thermal block adapted to be disposed between a docking interface plate and a workpress. The thermal block receives a flow of heated or cooled gas, and causes an IC chip to become heated or cooled prior to and during a test of the chip. The thermal chamber and system allows an IC chip to be testing under specific temperature conditions without using an expensive handler costing hundreds of thousands of dollars.

Integrated Circuit Socket With A Two-Piece Connector With A Rocker Arm
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US Patent:

7918669, Apr 5, 2011
Filed:

Jul 22, 2010
Appl. No.:

12/841866
Inventors:

Pongsak Tiengtum - Ladera Ranch CA, US
Assignee:

Titan Semiconductor Tool, LLC - Ladera Ranch CA
International Classification:

H01R 12/00
G01R 31/02
US Classification:

439 66, 32475403
Abstract:

A socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. When the integrated circuit is seated on the platform, the two piece connector assemblies pivot so as to make contact between a contact pad on the IC and the board for establishing or evaluating signal transmission by the IC. The platform houses a resilient tubular member that biases the connector assembly in a disengaged position out of contact with the board or test equipment. When the IC is placed on the platform, the bias of the resilient tubular member is overcome and an electrical connection is established across the connector assembly.

Integrated Circuit (Ic) Test Socket Using Kelvin Bridge
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US Patent:

20150241474, Aug 27, 2015
Filed:

Feb 25, 2014
Appl. No.:

14/189787
Inventors:

- Ladera Ranch CA, US
Pongsak Tiengtum - Ladera Ranch CA, US
Assignee:

Titan Semiconductor Tool, LLC - Ladera Ranch CA
International Classification:

G01R 1/04
G01R 31/28
Abstract:

An integrated circuit test socket is adapted to use with Kelvin connectors by creating closely spaced connectors and counter-rotating links that are nested to conserve space. The connectors are shaped to make contact with a chip and communicate force and sense signals to a tester, allowing a measure of the chip's actual resistance.

Socket Mount
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US Patent:

20140235096, Aug 21, 2014
Filed:

Dec 20, 2013
Appl. No.:

14/136931
Inventors:

- Ladera Ranch CA, US
Pongsak Tiengtum - Ladera Ranch CA, US
Dan Mashayekh - Irvine CA, US
Assignee:

Titan Semiconductor Tool, LLC - Ladera Ranch CA
International Classification:

H01R 13/516
US Classification:

439527
Abstract:

A socket mount for use in connection with an integrated circuit test socket having a body with fastener holes, a plurality of electrical connector links, and a plurality of elastomer elements biasing said links, the socket mount comprising a block having a flat upper surface, a flat lower surface, and four flat edges defining a square, and respective fastener holes aligned with the fastener holes in the test socket, a first groove oriented perpendicularly with respect to a flat edge along the flat lower surface, and a second groove oriented diagonally from a first edge to a second edge along the flat lower surface, the grooves having a length equal to a length of elastomer in the test socket.

Pongsak T Tiengtum