Rachel L Peters

US Patent:

20190056067, Feb 21, 2019

Filed:

Aug 17, 2017

Appl. No.:

15/679547

Inventors:

- Redmond WA, US
Christopher John McMillan - Woodinville WA, US
Rachel Leigh Peters - Seattle WA, US

International Classification:

F21K 9/20
H01L 33/48
H01L 33/64
F21V 29/70
H04N 5/225

Abstract:

PCBs, PCB components and PCB assemblies are provided with mounting configurations and structures for reducing Z height dimensions of the PCB assemblies and, in some instances, for improving thermal conductivity of the PCB components and assemblies. The active illumination device or other PCB components (e.g., camera modules and LED packages) are affixed to a mounting substrate that has a top surface that is physically and electrically mounted to a bottom surface of a PCB, with at least a portion of the active illumination device being concurrently positioned within one or more holes in the PCB. A thermal interface in contact with at least the mounting substrate can also be used for dissipating heat from the PCB components and PCB.