Ralph E Digiacomo

US Patent:

52192920, Jun 15, 1993

Filed:

Apr 3, 1992

Appl. No.:

7/862943

Inventors:

David M. Dickirson - Boca Raton FL
Ralph E. Digiacomo - Tamarac FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01R 909

US Classification:

439 67

Abstract:

A printed circuit substrate interconnection is made between two printed circuit substrates. A first printed circuit substrate (10) is a laminate of at least two dielectric layers (12, 14), and has a first circuit pattern (16) disposed between the two layers. The circuit pattern terminates in one or more lands or pads (17) located near a vertical edge (13) of the layer. The second dielectric layer is laminated to the first layer, over the circuit pattern, so as to reveal the lands. A second printed circuit substrate (20) is a laminate of at least one dielectric layer (22), and has a second circuit pattern (26) terminating in one or more lands or pads (27) located near a vertical edge (23) of the layer, and in a pattern corresponding to the lands of the first circuit pattern. The first printed circuit substrated (10) is coupled to the second printed circuit substrate (20) so as to co-operatively mate the two printed circuit substrates, forming an electrical interconnection between the first circuit pattern lands (17) and the second circuit pattern lands (27).