Ralph Remsburg

US Patent:

D553170, Oct 16, 2007

Filed:

Feb 9, 2007

Appl. No.:

29/272529

Inventors:

Ralph Remsburg - San Diego CA, US
Matthew A. Reeves - Oceanside CA, US

Assignee:

Amulaire Thermal Technology, Inc - San Diego CA

International Classification:

1599

US Classification:

D15199

US Patent:

D553656, Oct 23, 2007

Filed:

Feb 9, 2007

Appl. No.:

29/272530

Inventors:

Matthew A. Reeves - Oceanside CA, US
Ralph Remsburg - San Diego CA, US

Assignee:

Amulaire Thermal Technology, Inc. - San Diego CA

International Classification:

1599

US Classification:

D15199

US Patent:

7334938, Feb 26, 2008

Filed:

Feb 11, 2005

Appl. No.:

11/056508

Inventors:

Ralph Remsburg - Caledonia MI, US

International Classification:

G01N 25/58
G01N 17/00
G08B 21/20

US Classification:

374109, 374 45, 374 57, 374 28, 200 6106, 340522, 340602

Abstract:

An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The map has a plurality of relative humidity and temperature combinations and one or more suggested actions, for the user, based on the combinations. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be a text display or an audio speaker for displaying one or more ambient conditions or suggested actions. Barometric pressure data may also be included with the map for more comprehensive suggestions for action.

US Patent:

7382269, Jun 3, 2008

Filed:

Jan 3, 2005

Appl. No.:

11/028389

Inventors:

Ralph Remsburg - Caledonia MI, US

International Classification:

G08B 21/00

US Classification:

340602, 340588, 340521, 200 6104

Abstract:

An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be an audio speaker. The indicator array may also include a message display for digitally displaying one or more ambient condition.

US Patent:

8112181, Feb 7, 2012

Filed:

Oct 9, 2009

Appl. No.:

12/576250

Inventors:

Ralph Remsburg - San Diego CA, US

International Classification:

G05D 23/00

US Classification:

700277, 700276, 700278

Abstract:

Apparatus for automatic environmental control includes an enclosed, zoned structure. A heating, ventilation and air conditioning (HVAC) system is incorporated into the structure. Each zone includes separate controls, separately-controlled air flow into and out of each zone, and separate intake, vent, damper, thermostat and humidistat for each zone. Temperature and humidity are separately controllable for each zone, and controller is in communication with HVAC system for controlling HVAC system and for controlling the damper for each zone, the controller having a map comprising a plurality of relative humidity and temperature combinations and one or more actions for automatic execution based on the combinations of temperature and humidity. A temperature sensor, a relative humidity sensor are included in each zone, and an indicator array/interface panel is in communication with the controller. The system provides for the automatic elimination of environmental conditions favorable to mold and fungus growth for each zone individually.

US Patent:

20090025910, Jan 29, 2009

Filed:

Jul 27, 2007

Appl. No.:

11/878809

Inventors:

Paul Hoffman - San Diego CA, US
Rajiv Tandon - San Diego CA, US
Ralph Remsburg - San Diego CA, US
Tadej Semenic - San Diego CA, US
Chu-wan Hong - San Diego CA, US

International Classification:

F28D 15/00

US Classification:

16510426, 16510421

Abstract:

A vapor chamber structure includes a casing, a working fluid, and an improved wick layer. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. Therefore, the present invention can increase the backflow velocity of the working fluid and improve the boiling of the working fluid due to the match of the improved wick structure. Because the backflow velocity and boiling of the working fluid is increased, the heat-transmitting efficiency is increased.

US Patent:

20090040726, Feb 12, 2009

Filed:

Aug 9, 2007

Appl. No.:

11/889074

Inventors:

Paul Hoffman - San Diego CA, US
Rajiv Tandon - San Diego CA, US
Ralph Remsburg - San Diego CA, US
Tadej Semenic - San Diego CA, US
Chu-Wan Hong - San Diego CA, US

International Classification:

H05K 7/20
B21D 53/02

US Classification:

361700, 29890032, 361695, 361703

Abstract:

A vapor chamber structure includes a casing, a working fluid, a wick layer, a plurality of structure strengthening bodies, and a plurality of backflow accelerating bodies. The casing has an airtight vacuum chamber. The working fluid is filled into the airtight vacuum chamber. The wick layer is formed on a surface of the airtight vacuum chamber. The structure strengthening bodies are respectively arranged in the airtight vacuum chamber for supporting the casing. The backflow accelerating bodies are respectively arranged in the airtight vacuum chamber for increasing the backflow velocity of the working fluid. Therefore, the present invention can maintain the completeness of the vapor chamber structure and increase the backflow velocity of the working fluid due to the match of the structure strengthening bodies and backflow accelerating bodies. Because the backflow velocity of the working fluid is increased, the heat-transmitting efficiency is increased.

US Patent:

20090145581, Jun 11, 2009

Filed:

Dec 11, 2007

Appl. No.:

12/000224

Inventors:

Paul Hoffman - San Diego CA, US
Ralph Remsburg - San Diego CA, US
Matt Reeves - Oceanside CA, US

International Classification:

F28F 7/00

US Classification:

165 803

Abstract:

A non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance.