Randall Michael German

US Patent:

6399018, Jun 4, 2002

Filed:

Apr 16, 1999

Appl. No.:

09/293706

Inventors:

Randall M. German - State College PA
Timothy J. Weaver - Bellefonte PA
Julian A. Thomas - Reedsville PA
Sundar V. Atre - State College PA
Anthony Griffo - The Woodlands TX

Assignee:

The Penn State Research Foundation - University Park PA

International Classification:

B22F 700

US Classification:

419 2, 75236, 75240, 75244, 75246, 75252, 164 91, 164 97, 164 61, 164 661, 419 5, 419 13, 419 18, 419 27, 419 65, 428545

Abstract:

Solid objects are made by means of a novel multi-step forming, debinding, sintering and infiltrating process, using a metal-ceramic composition. In this process, the mixture is held for a period of time to degas and settle the powdered material from a liquid binder. The packed geometry is then heated to above the melting temperature of the binder to remove the binder portion of the solid geometry. Upon removal of the binder the binder-free solid geometry is raised to a temperature where the metal pre-sinters together into a three-dimensional rigid matrix with interconnected porosity to form a solid precursor. The porous matrix includes the particulate ceramic material and a first metal, which are at least partially sintered. A molten second metal is then introduced to the fill the porous matrix and form an infiltrated matrix. In addition to speed of production, improvements associated with this method include a solid object having improved thermal conductivity, hardness, wear resistance and reduced shrinkage as compared with the rapid tooling techniques taught in the prior art.

US Patent:

6436470, Aug 20, 2002

Filed:

Feb 22, 2001

Appl. No.:

09/647842

Inventors:

Ronald G. Iacocca - State College PA
Karthik Sivaraman - State College PA
Anand Lal - State College PA
Randall M. German - State College PA

Assignee:

Penn State Research Foundation - University Park PA

International Classification:

B05D 112

US Classification:

427201, 427180, 427295, 4273744, 427427, 427429, 427435

Abstract:

An improved method of applying a particulate material to a substrate, includes the steps of: removing impurities from a surface of the substrate; forming a coating composition having a bonding material and at least one particulate material; applying the coating composition to the substrate surface; and creating a diffusion bond between the substrate, bonding material and particulate material for generating a continuous interface between the substrate surface and particulate material such that the change in mechanical properties between the substrate and particulate material occurs in a direction normal to the plane of the substrate surface, thereby minimizing residual strain and coefficient of thermal expansion mismatch between the substrate and particulate material, the surfaces of individual particles of said particulate material being chemically wetted by the bonding material. The particulate material and the bonding material comprise a layer on the substrate surface.

US Patent:

6458279, Oct 1, 2002

Filed:

Jul 22, 1998

Appl. No.:

09/120301

Inventors:

Roger Duffield - Hampshire, GB
Randall M. German - State College PA
Teh Fu Yen - Los Angeles CA
Ronald G. Iacocca - State College PA

Assignee:

Klinair Environmental Technologies (Ireland) Limited - Dublin

International Classification:

B01D 1504

US Classification:

210687, 210689, 21050025, 2105021, 210503, 2105101, 2989662, 29902, 75340, 420562

Abstract:

A fuel filter having a formulation of a stable intermetallic compound of materials such as tin and antimony. The filter may have an integral porous structure or may be in the form of particles. It removes trace metal ions such as Ca and Na ions.

US Patent:

6660109, Dec 9, 2003

Filed:

Oct 31, 2001

Appl. No.:

09/984871

Inventors:

Mohammad R. Hajaligol - Midlothian VA
Clive Scorey - Cheshire CT
Vinod K. Sikka - Oak Ridge TN
Seetharama C. Deevi - Midlothian VA
Grier Fleishhauer - Midlothian VA
Randall M. German - State College PA

Assignee:

Chrysalis Technologies Incorporated - Richmond VA

International Classification:

C21D 800

US Classification:

148651, 419 43, 419 50, 419 28, 419 29

Abstract:

A powder metallurgical process of preparing a sheet from a powder having an intermetallic alloy composition such as an iron, nickel or titanium aluminide. The sheet can be manufactured into electrical resistance heating elements having improved room temperature ductility, electrical resistivity, cyclic fatigue resistance, high temperature oxidation resistance, low and high temperature strength, and/or resistance to high temperature sagging. The iron aluminide has an entirely ferritic microstructure which is free of austenite and can include, in weight %, 4 to 32% Al, and optional additions such as 1% Cr, 0. 05% Zr 2% Ti, 2% Mo, 1% Ni, 0. 75% C, 0. 1% B, 1% submicron oxide particles and/or electrically insulating or electrically conductive covalent ceramic particles, 1% rare earth metal, and/or 3% Cu. The process includes forming a non-densified metal sheet by consolidating a powder having an intermetallic alloy composition such as by roll compaction, tape casting or plasma spraying, forming a cold rolled sheet by cold rolling the non-densified metal sheet so as to increase the density and reduce the thickness thereof and annealing the cold rolled sheet. The powder can be a water, polymer or gas atomized powder which is subjecting to sieving and/or blending with a binder prior to the consolidation step.

US Patent:

6935022, Aug 30, 2005

Filed:

Aug 28, 2002

Appl. No.:

10/229831

Inventors:

Randall M. German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US

Assignee:

Advanced Materials Technologies PTE, Ltd. - Singapore

International Classification:

F28F007/00
F28D015/00
B23P006/00

US Classification:

29890032, 16510426, 16510433

Abstract:

Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

US Patent:

20050284616, Dec 29, 2005

Filed:

Jun 1, 2005

Appl. No.:

11/141885

Inventors:

Randall German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US

International Classification:

H05K007/20

US Classification:

165104330, 361700000

Abstract:

Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

US Patent:

20060000584, Jan 5, 2006

Filed:

Jun 1, 2005

Appl. No.:

11/141886

Inventors:

Randall German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US

International Classification:

H05K 7/20

US Classification:

165104330, 361700000

Abstract:

Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.

US Patent:

20110030440, Feb 10, 2011

Filed:

Aug 3, 2010

Appl. No.:

12/849711

Inventors:

John M. Keane - Harrison City PA, US
Randall M. German - Del Mar CA, US

Assignee:

Allomet Corporation - North Huntington PA

International Classification:

B21C 1/00

US Classification:

72274, 428546, 264241

Abstract:

Consolidated materials comprising a plurality of coated particles dispersed in a tough matrix material are disclosed. The coated particles include a plurality of core particles having an intermediate layer that substantially surrounds each of the core particles. An optional outer layer may be present on the intermediate layer. A matrix contains or substantially contains each of the coated particles, and is formed from at least one third compound including a mixture of W, WC, and/or WC with Co. The amount of Co in the at least one third compound may range from greater than 0 to about 20 weight %. Methods for providing consolidated materials, and articles comprising such consolidated materials are also disclosed.