Randolph G Nichols

US Patent:

7095615, Aug 22, 2006

Filed:

Nov 13, 2003

Appl. No.:

10/705906

Inventors:

Randolph G. Nichols - New Port Richey FL, US

Assignee:

Honeywell International, Inc. - Morristown NJ

International Classification:

H05K 7/20

US Classification:

361719, 361704, 361713

Abstract:

A circuit card assembly and a method for manufacturing the circuit card assembly are disclosed. The circuit card assembly includes a printed wiring board with electronic components bonded thereto. The printed wiring board and electronic components are placed in an outer shell made of lightweight stiff material. The spaces or voids between the outer shell and the printed wiring board and the electronic components are filled with lightweight filling material and thermal filler material. The outer shell and the filling material provide increased rigidity to the electronic components and the thermal filler material increases heat transfer from a given electronic component to outside the circuit card assembly.

US Patent:

58019235, Sep 1, 1998

Filed:

Mar 14, 1997

Appl. No.:

8/818511

Inventors:

Randolph G. Nichols - New Port Richey FL

Assignee:

Honeywell Inc. - Minneapolis MN

International Classification:

H05K 720

US Classification:

361704

Abstract:

A multichip module is attached to a printed wire circuit board using three conductive mounting feet that are vapor phase soldered to conductive feet on the module's substrate and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.