Randy R Long

US Patent:

20080230863, Sep 25, 2008

Filed:

Mar 21, 2007

Appl. No.:

11/726051

Inventors:

Stanford Joseph Gautier - Plano TX, US
Rabah Mezenner - Richardson TX, US
Randy Long - Richardson TX, US

International Classification:

H01L 31/0232
H01L 31/18

US Classification:

257437, 438 72, 257E2146, 257E31128

Abstract:

In accordance with the teachings of the present disclosure, methods and apparatus are provided for a semiconductor device having thin anti-reflective layer(s) operable to absorb radiation that may otherwise reflect off surfaces disposed inwardly from the anti-reflective layer(s). In a method embodiment, a method for manufacturing a semiconductor device includes forming a support structure outwardly from a substrate. The support structure has a first thickness and a first outer sidewall surface that is not parallel with the substrate. The first outer sidewall surface has a first minimum refractive index. The method further includes forming an anti-reflective layer outwardly from the first outer sidewall surface. The anti-reflective layer has: a second outer sidewall surface that is not parallel with the substrate, a second refractive index that is greater than the first minimum refractive index, and a second thickness that is less than the first thickness.

US Patent:

20200207611, Jul 2, 2020

Filed:

Mar 10, 2020

Appl. No.:

16/813967

Inventors:

- Dallas TX, US
Juan Alejandro HERBSOMMER - Allen TX, US
Simon Joshua JACOBS - Lucas TX, US
Benjamin Stassen Cook - Los Gatos CA, US
James F. HALLAS - Allen TX, US
Randy LONG - Richardson TX, US

International Classification:

B81B 7/00
H03L 7/26
G01L 7/08
G04F 5/14
G01M 3/32
G01L 9/00

Abstract:

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

US Patent:

20190071304, Mar 7, 2019

Filed:

Sep 6, 2017

Appl. No.:

15/696245

Inventors:

- Dallas TX, US
Juan Alejandro HERBSOMMER - Allen TX, US
Simon Joshua JACOBS - Lucas TX, US
Benjamin Stassen COOK - Addison TX, US
James F. HALLAS - Allen TX, US
Randy LONG - Richardson TX, US

International Classification:

B81B 7/00
H03L 7/26
G01L 7/08
G04F 5/14

Abstract:

An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.