Ranjit R Biswas

US Patent:

50538527, Oct 1, 1991

Filed:

Jul 5, 1990

Appl. No.:

7/548180

Inventors:

Ranjit Biswas - Westford MA
Hazen Curtis - Andover MA

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

H01L 2348
H01L 2328

US Classification:

357 74

Abstract:

The present invention is a molded Hybrid Integrated Circuit package in which a carrier substrate with a various circuit elements including an integrated circuit is supported within a resilient cradle formed by down-set and compliant portions of leads arranged in a quad configuration around the periphery of the carrier substrate, with ends of the down-set portions being secured to pads arranged on the periphery of the carrier substrate. Prior to the assembly with carrier substrate and molding of the resultant subassembly, the leads form a part of a lead frame including elongated bar and dam-bar on each of the quad sides interconnecting end and central portions, respectively, of the leads, and an interconnecting array of connecting links and bridges at the ends of the dam-bars. The lead-frame design, including the down-set and resilient portions of the leads, provides for the stress relief between the carrier substrate and the lead frame, especially during the termo-bond lead attachment and molding of an encapsulating resin around the carrier substrate and leads subassembly.

US Patent:

52137481, May 25, 1993

Filed:

Jun 27, 1991

Appl. No.:

7/722069

Inventors:

Ranjit Biswas - Westford MA
Michael A. Zimmerman - North Andover MA

Assignee:

AT&T Bell Laboratories - Murray Hill NJ

International Classification:

B29C 4512

US Classification:

264251

Abstract:

In a pre-molded package assembly, a thermoplastic ring molded onto a leadframe must maintain lead coplanarity. In this invention a plastic member of liquid crystal polmar is molded onto the leads of a metal leadframe. The plastic member is a thermoplastic anisotropic material which, when formed, has a flow direction which is in the long dimension of the plastic member and a transverse direction which is in the short dimension of the plastic member. Dam members on the leadframe help contain the plastic molding compound within the mold cavity during the molding process. A puddle gate prevents the formation of a weld line in the plastic member. Upon completion of the molding process, the dam members are excised from the leadframe to provide discrete leads.

US Patent:

46276785, Dec 9, 1986

Filed:

Feb 20, 1985

Appl. No.:

6/703259

Inventors:

Ranjit Biswas - Plainsboro NJ

Assignee:

Thomas & Betts Corporation - Raritan NJ

International Classification:

H01R 909

US Classification:

339 17CF

Abstract:

An accessory circuit component for an electrical package is disclosed. This circuit component includes a conductive path for connecting an accessory component to selected contacts of the electrical package. The conductive path includes portions thereof which are selectively removable to create an open electrical circuit between the selected package contacts.

US Patent:

47353511, Apr 5, 1988

Filed:

Dec 16, 1982

Appl. No.:

6/450307

Inventors:

Ranjit Biswas - Plainsboro NJ

Assignee:

Thomas & Betts Corporation - Bridgewater NJ

International Classification:

B65H 3510

US Classification:

225 25

Abstract:

A wire marker dispenser including a plurality of chambers to receive tape rolls therein. A retaining member adjacent each chamber engages a portion of the tape extending from the roll and prevents the tape extent from rolling back onto the tape roll. The tape dispenser also includes an interconnection means for connecting plural dispensers together.

US Patent:

45196583, May 28, 1985

Filed:

Jan 24, 1983

Appl. No.:

6/460434

Inventors:

Ranjit Biswas - Plainsboro NJ

Assignee:

Thomas & Betts Corporation - Raritan NJ

International Classification:

H01R 2372

US Classification:

339 17CF

Abstract:

An accessory circuit component interconnected with the contacts of an electrical package comprises a flexible substrate with a circuit pattern of conductive traces thereon and a decoupling capacitor connected to selected conductive traces. A plurality of deflectable tabs inclusive of a portion of the substrate and a conductive trace are provided interiorly of side margins of the substrate. Upon assembly of the accessory component to a socket, the tabs deflect as urged by the contacts thereby providing openings through the substrate for receipt of the contacts therethrough. The conductive trace portions of the deflected tabs are connected to the contacts bearing thereagainst.

US Patent:

56181965, Apr 8, 1997

Filed:

Aug 18, 1995

Appl. No.:

8/516851

Inventors:

Ranjit Biswas - Westford MA

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H01R 1353

US Classification:

439 181

Abstract:

A socket connector having improved protection against electrostatic discharges. The body of the connector is encircled by a conductive shell and contains a plurality of female contacts for receiving respective pins of a pin connector. The surface of the body facing the pin connector is coated with conductive material which is coupled to the conductive shell through a conductive stripe on the body and a resilient conductive member contacting both the stripe and the shell. Charge reaching the conductive material from the pin connector is led harmlessly to ground from the shell.