Raymond A Bryant

US Patent:

6528735, Mar 4, 2003

Filed:

Sep 7, 2001

Appl. No.:

09/948432

Inventors:

Harsaran S. Bhatia - Hopewell Junction NY
Raymond M. Bryant - Hopewell Junction NY
Suresh Kadakia - Poughkeepsie NY
David C. Long - Wappingers Falls NY
Paul R. Walling - White Plains NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 116

US Classification:

174260, 174261

Abstract:

A method of substrate design of a multilayer ceramic module that uses menu die of the same size. One of these menu die provides a âgenericâ substrate design having internal wiring with the greatest number of input/output (I/O) signal leads of all the dies available. Middle (redistribution) layers include electrical interconnections for both power and the I/O signal lead wires between the die interface terminals and a bottom surface metallurgy (BSM) layer that has electrical connector pads by use of a customization layer.

US Patent:

6676784, Jan 13, 2004

Filed:

Jul 17, 2001

Appl. No.:

09/907391

Inventors:

Christopher D. Setzer - Poughkeepsie NY
Harsaran S. Bahatia - Hopewell Junction NY
Raymond M. Bryant - Poughquag NY
Michael S. Cranmer - Poughkeepsie NY
Suresh Kadakia - Poughkeepsie NY
Richard O. Seeger - Hopewell Junction NY
Satyapal Singh Bhatia - Wappingers Falls NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 3104

US Classification:

156 8912, 29851

Abstract:

A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.