Raymond Scott Freeman

US Patent:

8415782, Apr 9, 2013

Filed:

May 14, 2009

Appl. No.:

12/994078

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

Assignee:

Smartrac IP B.V. - Amsterdam

International Classification:

H01L 23/02

US Classification:

257679, 438107

Abstract:

The present invention relates to a chip card and a method for the production of a chip card having a chip () which is arranged in a card body, and having a plurality of components () being electrically conductively connected to the chip by means of a conductor arrangement (), wherein the card body is composed of a plurality of substrate layers () which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (), which are disposed so as to overlap one another, for producing an electrically conductive contacting.

US Patent:

8505825, Aug 13, 2013

Filed:

Mar 13, 2009

Appl. No.:

12/921673

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

Assignee:

Smartrac IP B. V. - Amsterdam

International Classification:

G06K 19/02

US Classification:

235488, 235492

Abstract:

The present invention relates to a layered composite () for producing a card body comprising a chip module () for a chip card, having a substrate layer arrangement () for arranging the chip module, and having intermediate layers () disposed on both sides of the substrate layer arrangement, each having a cover layer (), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.

US Patent:

8522422, Sep 3, 2013

Filed:

Mar 20, 2009

Appl. No.:

12/933711

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

Assignee:

Smartrac IP B.V. - Amsterdam

International Classification:

H01Q 17/00

US Classification:

29601, 29832, 29846

Abstract:

A method for application of a chip module to an antenna module includes supplying a plurality of chip modules arranged in a row arrangement on a sheet carrier. Separating chip modules from the row arrangement and transferring the separated chip modules to a application device. The chip module separated from the row arrangement are subsequently positioned on the antenna substrate by the application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.

US Patent:

8547288, Oct 1, 2013

Filed:

Apr 29, 2009

Appl. No.:

12/994048

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

Assignee:

Smartrac IP B.V. - Amsterdam

International Classification:

H01Q 9/28

US Classification:

343795

Abstract:

The present invention relates to an antenna arrangement () for the production of chip cards, in particular chip cards used in the UHF frequency range, having a substrate and a plurality of antenna conductor structures () formed on the substrate using a coating method, the antenna conductor structures having a terminal arrangement () for connecting the antenna conductor structures to a chip, wherein the substrate is formed as a substrate sheet (), and the antenna conductor structures are disposed on the substrate sheet in a matrix arrangement () having a plurality of columns and rows.

US Patent:

20110006967, Jan 13, 2011

Filed:

Mar 20, 2009

Appl. No.:

12/921700

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

International Classification:

H01Q 1/00
H01Q 7/00

US Classification:

343867, 343904

Abstract:

The present invention relates to a chip carrier () for contacting with a chip () and an antenna () disposed on an antenna substrate (), wherein the chip carrier features a strip-shaped carrier substrate () which is provided with a chip contact arrangement () located at a distance from longitudinal ends () of the carrier substrate for electrical contacting with a chip and which is provided with two antenna contact surfaces () having the chip contact arrangement therebetween for electrical contacting with the antenna, wherein the chip contact arrangement and the antenna contact surfaces are located on an application surface () of the chip carrier and at least one insulation surface () is formed on the application surface () between the chip contact arrangement and the antenna contact surfaces. The invention also relates to a chip carrier arrangement comprising a plurality of chip carriers which are disposed on a film-like sheet carrier in at least one row extending in the longitudinal direction of the sheet carrier, wherein the individual chip carriers extend in the longitudinal direction of the sheet carrier.

US Patent:

20110181477, Jul 28, 2011

Filed:

Apr 28, 2009

Appl. No.:

12/994089

Inventors:

Manfred Rietzler - Marktoberdorf, DE
Raymond Freeman - Mesa AZ, US

International Classification:

H01Q 1/24

US Classification:

343702

Abstract:

The present invention relates to an antenna arrangement for a chip card, comprising an antenna conductor structure () that is formed from a surface conductor, wherein the antenna conductor structure comprises a dipole arrangement () that is arranged on a card substrate () and that has a first antenna strand () and a second antenna strand (), and the antenna conductor structure comprises a terminal arrangement () for connecting the antenna conductor structure to a chip and for forming a transponder comprising the antenna conductor structure and the chip, to wherein a surface () of the card substrate is divided into a grasping zone () for handling the chip card and a transponder zone () for arranging the transponder in such a manner that the grasping zone extends beyond a center region of the substrate surface and at least one lateral edge () of the grasping zone is formed by a lateral edge () of the substrate surface.