Rebecca S Reed

US Patent:

53349628, Aug 2, 1994

Filed:

May 29, 1990

Appl. No.:

7/530461

Inventors:

Brian P. Higgins - Boise ID
David W. Gardner - Colorado Springs CO
Kerry D. Rhea - Colorado Springs CO
Thomas E. Linnenbrink - Monument CO
Rebecca S. Reed - Colorado Springs CO
Peter C. T. Roberts - Sudbury MA

Assignee:

Q-Dot Inc. - Colorado Springs CO

International Classification:

H01P 500
H01L 2312

US Classification:

333247

Abstract:

The high speed data pathway system is used to convey data signals to integrated circuits connected to mother and daughter boards. The integrated circuits include a package and an integrated circuit chip carried by the package. An internal transmission line is carried by the package and coupled to the integrated circuit chip. The package includes both input and output connections for the internal transmission line. A high speed pathway is formed by serially connecting the internal transmission lines with external transmission lines to form a unified transmission medium. Advantageously, the internal transmission lines, external transmission lines and the connection between them have substantially corresponding characteristic impedances.