Rhonda K Drayton

US Patent:

56082630, Mar 4, 1997

Filed:

Sep 6, 1994

Appl. No.:

8/301131

Inventors:

Rhonda F. Drayton - Ann Arbor MI
Linda P. B. Katehi - Northville MI

Assignee:

The Regents of the University of Michigan - Ann Arbor MI

International Classification:

H01L 2312
H01P 100

US Classification:

257728

Abstract:

A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.

US Patent:

59131349, Jun 15, 1999

Filed:

Dec 5, 1996

Appl. No.:

8/763555

Inventors:

Rhonda Franklin Drayton - Ann Arbor MI
Linda P. B. Katehi - Northville MI

Assignee:

The Regents of the University of Michigan - Ann Arbor MI

International Classification:

H01L 2120
H01L 2160
H01L 2980
H01P 308

US Classification:

438456

Abstract:

A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.