Jun 2014 to 2000 Advanced Materials : Program Leader Thin Film CoatingsNortheastern University Boston, MA Oct 2005 to Jun 2014 Director, Kostas Facility for Microfabrication and NanotechnologyAegis Semiconductor Woburn, MA Mar 2004 to Oct 2005 Principal Process Development Fab EngineerFluens Corp Marblehead, MA Oct 2003 to Mar 2004 Co-founder/ ConsultantNEXX SYSTEMS Wilmington, MA Aug 2002 to Oct 2003 Process ManagerUNAXIS CORPORATION
2001 to 2002 Director Thin Film Process DevelopmentOPNETICS CORPORATION
2000 to 2001 Director -Thin Film Process DevelopmentCORNING Marlborough, MA 1997 to 2000 Sr. Project EngineerTHE GILLETTE COMPANY
1995 to 1997 Project / Process EngineerTHE GILLETTE COMPANY Boston, MA 1994 to 1997THE GILLETTE COMPANY
1994 to 1995 Senior Process EngineerLITTON -ITEK OPTICAL SYSTEMS
1989 to 1994 Senior Physical ScientistLITTON -ITEK OPTICAL SYSTEMS Lexington, MA 1987 to 1994LITTON -ITEK OPTICAL SYSTEMS
1987 to 1989 Physical ScientistSYRACUSE UNIVERSITY Syracuse, NY 1983 to 1986 Teaching AssistantARGONNE NATIONAL LABS Argonne, IL, US 1982 to 1982 Intern
Education:
Syracuse University Syracuse, NY 1986 M.S. in Experimental Solid State PhysicsSuffolk University Boston, MA 1982 B.S. in physical sciences
Name / Title
Company / Classification
Phones & Addresses
Richard A. Devito Owner
Devito Audio Labs Computer Related Services
31 Brk Rd, Cherry Brook, MA 02493
Richard A. Devito Owner
Devito Auto Restoration Ret Used Automobiles
116 Irving St, Framingham, MA 01702
Richard Devito President
VAECO INC Business Services at Non-Commercial Site
11 Parkside Dr, Jamaica Plain, MA 02130 11 Parksdie Dr, Jamaica Plain, MA 02130
Richard A. Devito Managing
Devito 1315, LLC
470 Boston Post Rd, Cherry Brook, MA 02493
Richard A. Devito President
AMERICAN SOCIETY OF HOSPICE CARE, INC
Richard A. Devito President
EASTHAM WATERFRONT OWNERS ASSOCIATION, LET US SAVE OUR SHOR*
Matthias Wagner - Cambridge MA, US Ming Wu - Arlington MA, US Nikolay Nemchuk - North Andover MA, US Julie Cook - Newburyport MA, US Richard DeVito - Saugus MA, US Robert Murano - Melrose MA, US Lawrence Domash - Conway MA, US
Assignee:
Aegis Semiconductor, Inc. - Wobum MA
International Classification:
G01J005/00
US Classification:
250338100
Abstract:
An IR camera system includes an array of thermally-tunable optical filter pixels, an NIR source and an NIR detector array. The IR camera system further includes IR optics for directing IR radiation from a scene to be imaged onto the array of thermally-tunable optical filter pixels and NIR optics for directing NIR light from the NIR source, to the filter pixels and to the NIR detector arrays. The NIR source directs NIR light onto the array of thermally-tunable optical filter pixels. The NIR detector array receives NIR light modified by the array of thermally-tunable optical filter pixels and for produces an electrical signal corresponding to the NIR light the NIR detector array receives.
Matthias Wagner - Cambridge MA, US Ming Wu - Arlington MA, US Nikolay Nemchuk - North Andover MA, US Julie Cook - Newburyport MA, US Richard DeVito - Saugus MA, US Robert Murano - Melrose MA, US Lawrence Domash - Conway MA, US
Assignee:
RedShift Systems Corporation - Waltham MA
International Classification:
G01J 5/00
US Classification:
250338100
Abstract:
An IR camera system includes an array of thermally-tunable optical filter pixels, an NIR source and an NIR detector array. The IR camera system further includes IR optics for directing IR radiation from a scene to be imaged onto the array of thermally-tunable optical filter pixels and NIR optics for directing NIR light from the NIR source, to the filter pixels and to the NIR detector arrays. The NIR source directs NIR light onto the array of thermally-tunable optical filter pixels. The NIR detector array receives NIR light modified by the array of thermally-tunable optical filter pixels and produces an electrical signal corresponding to the NIR light the NIR detector array receives.
Richard DeVito - Saugus MA, US Martin Klein - Bedford MA, US Piero Sferlazzo - Marblehead MA, US
Assignee:
FLUENS CORPORATION - Billerica MA
International Classification:
C23C 14/00 C23C 14/32
US Classification:
204192100, 204298020
Abstract:
A reactive sputtering system includes a vacuum chamber and a reactive ion source that is positioned inside the vacuum chamber. The reactive ion source generates a reactive ion beam from a reactant gas. A sputtering chamber is positioned in the vacuum chamber. The sputtering chamber includes a sputter source having a sputtering target that generates sputtering flux, walls that contain an inert gas, and a seal that impedes the reactant gas from entering into the sputtering chamber and that impedes inert gas and sputtered material from escaping into the vacuum chamber. A transport mechanism transports a substrate under the reactive ion source and through the sputtering chamber. The substrate is exposed to the reactive ion beam while passing under the reactive ion source and then is exposed to sputtering flux while passing through the sputtering chamber.
A deposition method comprises flowing a first gas into a metallization zone maintained at a first pressure. A second gas flows into a reaction zone maintained at a second pressure. The second pressure is less than the first pressure. A rotating drum includes at least one substrate mounted to a surface of the drum. The surface alternately passes through the metallization zone and passes through the reaction zone. A target is sputtered in the metallization zone to create a film on the at least one substrate. The film on the at least one substrate is reacted in the reaction zone.
Deposition System With Integrated Cooling On A Rotating Drum
In one aspect, a system for depositing a film on a substrate is disclosed, which comprises at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive species. The system further includes an inner cooling cylinder and a substrate cylinder, where the inner cooling cylinder is fixedly positioned relative to the substrate cylinder, and the substrate cylinder at least partially surrounds the inner cooling cylinder. At least one mount is coupled to the substrate cylinder for mounting one or more substrates to the substrate cylinder.
Deposition System With Integrated Cooling On A Rotating Drum
In one aspect, a system of depositing a film on a substrate is disclosed, which includes at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive ionic species. The system further includes a pair of inner and outer concentric cylinders, where the outer cylinder has first and second openings positioned relative to the metallization source and the reactive source to allow entry of the metal atoms and the reactive ionic species into a metallization region and a reaction region, respectively, between the two cylinders. At least one mount is coupled to the inner cylinder for mounting the substrate thereto such that said substrate is in radiative thermal communication with the inner surface of the outer cylinder, said inner cylinder being rotatable for moving the substrate between the two regions so as to expose the substrate alternatingly to said metal atoms and said reactive ionic species. Further, the outer cylinder includes at least one cooling channel through which a cooling fluid can flow for maintaining the inner surface of the outer cylinder at a temperature suitable for radiative cooling of the substrate.
Deposition System With Integrated Cooling On A Rotating Drum
In one aspect, a system of depositing a film on a substrate is disclosed, which includes at least one metallization source for generating metal atoms, and at least one reactive source for generating at least one reactive ionic species. The system further includes a pair of inner and outer concentric cylinders, where the outer cylinder has first and second openings positioned relative to the metallization source and the reactive source to allow entry of the metal atoms and the reactive ionic species into a metallization region and a reaction region, respectively, between the two cylinders. At least one mount is coupled to the inner cylinder for mounting the substrate thereto such that said substrate is in radiative thermal communication with the inner surface of the outer cylinder, said inner cylinder being rotatable for moving the substrate between the two regions so as to expose the substrate alternatingly to said metal atoms and said reactive ionic species. Further, the outer cylinder includes at least one cooling channel through which a cooling fluid can flow for maintaining the inner surface of the outer cylinder at a temperature suitable for radiative cooling of the substrate.
- Jamaica Plain MA, US Richard DeVito - Jamaica Plain MA, US
Assignee:
Vaeco, Inc. - Jamaica Plain MA
International Classification:
H01J 37/32 H01J 37/34
US Classification:
20429811, 20429826, 20429816
Abstract:
A deposition method comprises flowing a first gas into a metallization zone maintained at a first pressure. A second gas flows into a reaction zone maintained at a second pressure. The second pressure is less than the first pressure. A rotating drum includes at least one substrate mounted to a surface of the drum. The surface alternately passes through the metallization zone and passes through the reaction zone. A target is sputtered in the metallization zone to create a film on the at least one substrate. The film on the at least one substrate is reacted in the reaction zone.
Chuck Topinka, Maureen Gilmartin, Anthony Marutollo, Dan Petrucci, Theresa Brown, Jack Fiorelli, Grace Will, Joe Fata, Irene Miller, Patsy Albanese, Tony Delano