Richard Allen Gordon

US Patent:

20130191301, Jul 25, 2013

Filed:

Feb 1, 2013

Appl. No.:

13/756595

Inventors:

Jennifer M. Lansden - Woodhaven NY, US
Gerald J. Foy - Wilmington DE, US
Tim Beadle - Dartmouth Woods DE, US
Richard Gordon - Dover DE, US
Bryan W. Groth - Huntley IL, US

Assignee:

JPMorgan Chase Bank, N.A. - New York NY

International Classification:

G06Q 10/08

US Classification:

705341

Abstract:

Aspects of the present invention are directed to a system for next day reconciliation of transportation records. The system having a transportation record storage provider (TRSP) that receives and stores storage medium transportation requests; an outside service provider (OSP) inventory manager that receives and maintains records of transported storage mediums scanned at the OSP; and a reconciliation provider that receives a first list from the TRSP and a second list from the OSP inventory manger, for reconciliation. The reconciliation provider includes receivers for receiving the first and second list; a processing engine that reconciles the first list and the second list; and a reporting unit that reports the results of the reconciliation. The processing engine matches inbound and outbound records of the first list and second list, and processes invalid records; and analyzes and accounts for un-matched records.

US Patent:

42918154, Sep 29, 1981

Filed:

Feb 19, 1980

Appl. No.:

6/122527

Inventors:

Richard Gordon - Scarsdale NY
John G. Ciallella - White Plains NY

Assignee:

Consolidated Refining Co., Inc. - Mamaroneck NY

International Classification:

B65D 728
B65D 640
B65D 3900

US Classification:

220200

Abstract:

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a flowed solderable layer in registration with each other in the hermetic sealing area.

US Patent:

46750657, Jun 23, 1987

Filed:

Aug 30, 1985

Appl. No.:

6/771326

Inventors:

Richard E. Gordon - Westfield NJ

Assignee:

Bar Ilan University - Ramat Gan

International Classification:

B32B 3104
B32B 3128

US Classification:

1562728

Abstract:

A method is provided for securing a metallic microsieve which comprises; (a) inserting a metallic microsieve within the well of a frame-like support member, at least a portion of the upper edge of the well being fabricated from a fusible material and the height of the well wall being greater than the thickness of the microsieve; (b) directing a laser beam against a point on the upper edge of the well to melt fusible material in contact with the laser beam; (c) permitting the laser-molten fusible material to travel down the wall of the well and contact the edge of the microsieve; and, (d) permitting the laser-molten fusible material in contact with the edge of the microsieve solidify thereby forming a retaining member which secures the microsieve to the support member.

US Patent:

47725400, Sep 20, 1988

Filed:

Aug 30, 1985

Appl. No.:

6/771315

Inventors:

Mordechai Deutsch - Magdiel-Hod Hasharon, IL
Tamar Landau - Rehovot, IL
Richard E. Gordon - Westfield NJ

Assignee:

Bar Ilan University - Ramat Gan

International Classification:

G03C 500

US Classification:

430320

Abstract:

An ordinarily delicate microsieve is provided with greater resistance to mechanical distortion by being formed integrally with a rigid frame or by having its thickness built up to an extent where it is significantly more capable of withstanding flex.

US Patent:

43312535, May 25, 1982

Filed:

Mar 13, 1981

Appl. No.:

6/243389

Inventors:

Richard Gordon - Scarsdale NY
John G. Ciallella - White Plains NY

Assignee:

Consolidated Refining Co., Inc. - Mamaroneck NY

International Classification:

B65D 728
B65D 640
B65D 3900

US Classification:

220200

Abstract:

A lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a flowed solderable layer in the hermetic sealing area.

US Patent:

43560474, Oct 26, 1982

Filed:

Feb 17, 1981

Appl. No.:

6/235094

Inventors:

Richard Gordon - Scarsdale NY
John G. Ciallella - White Plains NY

Assignee:

Consolidated Refining Co., Inc. - Mamaroneck NY

International Classification:

B32B 3126
C04B 3912

US Classification:

156 89

Abstract:

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a preflowed solderable layer in registration with each other in the hermetic sealing area.