Richard Lee Huff

US Patent:

49806378, Dec 25, 1990

Filed:

Sep 23, 1988

Appl. No.:

7/249481

Inventors:

Richard E. Huff - Belmont CA
Brian Leslie - Cupertino CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

G01R 106

US Classification:

324158P

Abstract:

Disclosed is a test probe [10] for testing a test device [not shown], also known as a device under test, while precisely controlling the force exerted by the test probe [10] on the test device. Included is a translation ring [18] as well as a carrier [12] formed to have at least a first side and a second side. The support means [12] is coupled to the translation ring [18]. Also included is at least one flexure pivot [14] for delivering a force to a test device; the flexure pivot [14] is coupled to the first side of the carrier. A membrane [16] is coupled to the second side of the carrier. Finally, at least one signal contact bump [24] is mounted on the membrane [16] for communicating an electric current between the test probe [10] and the test device [not shown].

US Patent:

54352193, Jul 25, 1995

Filed:

Aug 8, 1994

Appl. No.:

8/287119

Inventors:

Richard E. Huff - Belmont CA

International Classification:

G10D 300

US Classification:

84313

Abstract:

A vibrato assembly for stringed instruments makes slight and rapid changes in the pitch of the tone produced by stringed instrument. Previously known vibrato assemblies use knife-edge hinges or rolling ball bearings to produce these variations. The vibrato assemblies described herein use flexure bearings to produce variations in the tension of the strings and thereby the pitch of the tones. These flexure bearing vibrato assemblies have the advantages of high strength, zero operational noise and rumble, and virtually zero friction and hysteresis. Additionally, flexure bearing vibrato assemblies provide a robust path between the instrument and the strings resulting in improved tonal quality, range, and sustain.

US Patent:

49069209, Mar 6, 1990

Filed:

Oct 11, 1988

Appl. No.:

7/256029

Inventors:

Richard E. Huff - Belmont CA
Farid Matta - Mountain View CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

G01R 106
G01R 3102

US Classification:

324158P

Abstract:

A self-leveling membrane probe [10] is disclosed. A carrier [12] supports a translation stage [18] through radial flexure pivots [14]. A flexible membrane [22] having a first and second side is stretched over the translation stage [28] and held in high tension across its central portion compared to the tension maintained in its outer portion. The membrane's [22] center of the first side faces a device under test (DUT) (not shown) and carries contact bumps [34] that relay electric signals in and out of the DUT. The second side opposite the contact bumps [34] is occupied by a receptacle [32] including a rotation plate [30] and a conical well [32b] designed to receive a pivot pin [26] enbedded in a reference plate [24] suspended from above by the translation stage [18]. The pin [26] and well [32b] function together as a bearing and provide an automatic compensating rotation in response to an alignment mismatch between the probe [10] and a device under test. When the contact bumps [34] encounter uneven test pads, one end of the rotation plate [30] is pushed upwards away from the test wafer.

US Patent:

51809770, Jan 19, 1993

Filed:

Dec 2, 1991

Appl. No.:

7/801702

Inventors:

Richard E. Huff - Belmont CA

Assignee:

Hoya Corporation USA - San Jose CA

International Classification:

G01R 106
G01R 3102

US Classification:

324158P

Abstract:

The present invention provides a membrane probe contact bump compliancy system implemented in an integrated circuit (IC) testing system to nondestructively test a wafer. This integrated circuit system includes a test controller which is capable of controlling and executing a set of test programs, a wafer dispensing system, and a probe card. Under control of the test controller, the wafer dispensing system handles and controls the wafer for the performance of said set of test program. The probe card has a performance board and a plurality of probes. In cooperation with the wafer dispensing system, the probe card positions each of the probes to engage the wafer substantially at a predefined location with a controlled amount of force. The performance board further includes a transmission line corresponding to each probe. The probes are affixed to the performance board with each probe connected to a corresponding transmission line such that each probe is in electric communication with the test controller via the performance board.

US Patent:

49183834, Apr 17, 1990

Filed:

Sep 28, 1988

Appl. No.:

7/250458

Inventors:

Richard E. Huff - Belmont CA
Miklos Perlaki - Colfax CA

International Classification:

G01R 1067

US Classification:

324158F

Abstract:

An apparatus [10] for providing an automatic lateral scrubbing motion when a test membrane [22] engages a device under test (DUT) (not shown). Included are a fixed length flexure pivot assembly [30] and a pair of variable length flexure pivot assemblies [38]. Signal traces, signal trace terminals, and contact bumps [23, 25, 60] are formed for communicating electrical signals between the apparatus [10] and the DUT. A membrane [22] is stretched and configured for carrying the signal traces, signal trace terminals, and contact bumps [23, 25 and 60]. A hexagonal translation stage [28] is formed with an upper surface [29] disposed for being coupled to at lesat one of the fixed and variable length flexure pivot assemblies [30 and 38], and formed with a lower surface [54]. Surface [54] is formed to define an aperture [51] through itself, formed for securing over itself the membrane [22] when stretched; it is disposed for being coupled to membrane [22]. Finally included is a carrier [12], formed for suspending the hexagonal translation stage [28] and fixed and variable length flexure pivot assemblies [30 and 38].

US Patent:

56023529, Feb 11, 1997

Filed:

Jul 24, 1995

Appl. No.:

8/521373

Inventors:

Richard E. Huff - Belmont CA

International Classification:

G10D 300

US Classification:

84291

Abstract:

An acoustic coupling plate extends from the bridge or vibrato to the neck of the instrument. It acoustically couples the strings, the neck, the instrument body, and either a bridge or a vibrato to alter the acoustic attenuation of the instrument and to reduce the amount of multipath distortion. When a different tonality is desired, this acoustic coupling plate can be divide into two plates and shaped to produce a desirable dampening versus frequency curve. One of these plates acoustically couples the instrument body to the bridge/vibrato and the second plate acoustically couples the neck to the instrument body. A vibrato assembly for stringed instruments makes slight and rapid changes in the pitch of the tone produced by stringed instrument. Previously known vibrato assemblies use knife-edge hinges or rolling ball bearings to produce these variations. The vibrato assemblies described herein use flexure bearings to produce variations in the tension of the strings and thereby the pitch of the tones.

US Patent:

58803831, Mar 9, 1999

Filed:

Feb 11, 1997

Appl. No.:

8/798061

Inventors:

Richard E. Huff - Belmont CA

International Classification:

G10D 300

US Classification:

84313

Abstract:

A vibrato assembly for stringed instruments makes slight and rapid changes in the pitch of the tone produced by a stringed instrument. The vibrato assemblies described herein use flexures to permit movement of an armature relative to a fixed base to produce variations in the tension of the strings and thereby the pitch of the tones. These flexure vibrato assemblies have the advantages of high strength, zero operational noise and rumble, and virtually zero friction and hysteresis. Additionally, flexure vibrato assemblies provide a robust path between the instrument and the strings resulting in improved tonal quality, range, and sustain. A modular flexural pivot is especially useful as the flexure of the present invention.