BTU International (Public Company; BTUI; Semiconductors industry): Engineering Manager ,Electronics Business Group/Manufacturing Engineering., (October 1987-Present) Engineering Manager of the Electronics Division of BTU International in Billerica Ma .and Shanghai China .
Manufa...
Martin Soderlund - Westboro MA Richard Nihan - Dracut MA
Assignee:
BTU International - N. Billerica MA
International Classification:
B65G 1500
US Classification:
198841
Abstract:
A system provides support for the underside of a planar object, such as a printed circuit board. The system includes a flexible loop having an outer face from which support elements protrude. A guide positions the flexible loop to align the support elements with one or more selected locations on the underside of the object. The system can also include a device for moving the guide toward or away from the object as desired. A tensioning element can be provided that is responsive to displacement of the guide to maintain a substantially constant tension on the loop.
Apparatus And Method For Solder Reflow Bottom Cooling
Francis C. Nutter - Methuen MA Martin I. Soderland - Westboro MA Richard J. Nihan - Dracut MA
Assignee:
BTU International, Inc. - North Billerica MA
International Classification:
H05K 334
US Classification:
228 46
Abstract:
An apparatus and method for cooling one side of a double sided product as the product is being reflow soldered is presented. A cooling assembly directs cold gas to a first side of the product which has previously had the first side reflow soldered, while at approximately the same time, a heating assembly directs hot gas to a second side of the product. The second side of the product is reflow soldered while the first side of the product is maintained at a temperature below the melting point of the solder.