Richard C Olson

US Patent:

6443542, Sep 3, 2002

Filed:

May 23, 2000

Appl. No.:

09/576500

Inventors:

Stephen E. Lindquist - Boylston MA
James F. Staples - Westford MA
Richard E. Olson - Rindge NH
Robert M. Mondor - Sutton MA
Phil Tousignant - Dracut MA
Kenneth D. Ganon - Westminster MA

Assignee:

Compaq Computer Corporation - Houston TX

International Classification:

A47B 8700

US Classification:

312198, 3122231, 312111

Abstract:

A cabinet system includes first and second cabinets each including first and second side walls, upper and lower rectilinear frames extending between the side walls at vertically spaced-apart locations therealong and weldments connecting the upper and lower frames to the side walls to form a rigid housing. A pair of spaced-apart locating holes are formed in the side wall of the first cabinet adjacent to the lower frame thereof and an additional locating hole is present in the first wall of the first cabinet adjacent to the upper frame thereof. Further, a pair of spaced-part locating pins are provided in the second side wall of the second cabinet adjacent to the lower frame thereof along with an additional locating pin in the side wall of the second cabinet adjacent to the upper frame thereof. The locating pins of the second cabinet are arranged and adapted to slide into the corresponding ones of the locating holes of the first cabinet when the second side wall of the second cabinet is positioned flush against the first side wall of the first cabinet so as to align the cabinets in the X and Y directions. Fasteners are provided for securing the second side wall of the second cabinet to the first side wall of the first cabinet.

US Patent:

6565382, May 20, 2003

Filed:

Dec 7, 2001

Appl. No.:

10/021510

Inventors:

William M. Blodgett - Shirley MA
Richard E. Olson - Rindge NH
Raoji A. Patel - Framingham MA

Assignee:

Hewelett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R 1373

US Classification:

439547, 336200

Abstract:

A core mounting assembly includes a printed wiring board having a substrate with opposite sides, a winding on one side and a plurality of through holes extending through the substrate adjacent to the winding. A pair of mirror-image core sections are positioned against the sides of the board opposite the first winding, the core sections having corresponding portions which project into the through holes. A bracket has a back portion engaging one of the core sections and at least two legs extending from the back portion through two of the through holes in the board. A resilient cover member has a first end releasably secured to one of the legs, a second end releasably secured to the other of the legs and a bridging portion extending between the first and second ends and pressing against the other of the core sections so as to bias the core sections together.

US Patent:

48623202, Aug 29, 1989

Filed:

May 23, 1988

Appl. No.:

7/198644

Inventors:

William L. Schmidt - Acton MA
Richard E. Olson - Townsend MA
Douglas A. Bailey - Concord MA

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

H05K 720

US Classification:

361383

Abstract:

The present invention is directed to a structure for positioning electronic modules of an electronic system therein, and particularly to a rack often called a card cage in which circuit boards are disposed. The rack embodying the invention incorporates a frame having four sides and a back plate. Two of the opposite sides are grilles. The frame is adapted for supporting printed circuit boards perpendicular to the grill. Thus, a fluid cooling medium, such as air, can enter the rack through one of the grilles, flow along and between the circuit boards and exit through the other grilles. The resistance to the flow of such air for cooling by the grilles is significantly greater than the boards disposed therein. Thus, the grilles permit a uniform coolant flow for each of the circuit boards in the rack. The rack has a lever assembly which remotely actuates connectors positioned in the rack to contact the circuit boards positioned therein.

US Patent:

55970346, Jan 28, 1997

Filed:

Jul 1, 1994

Appl. No.:

8/270193

Inventors:

Charles R. Barker - Harvard MA
Richard E. Olson - Boylston MA
Stephen E. Lindquist - Boylston MA
Massimo Hartsarich - Kunzelsau, DE
David A. Cease - Avon CT
Robert S. Sobolewski - Woodbury CT

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

F28F 700

US Classification:

165 803

Abstract:

A fan heatsink assembly is provided to afford cooling for electronic components mounted on a circuit board. The assembly includes a blower mounted on top of a specially shaped heatsink, the heatsink having a truncated hyperbolic shaped central member, with fins radially emanating from the center. The blower draws air in through the area between the fins, up the curved central portion and into the blower assembly where it is then exited out the sides of the fan. The fins may be smooth or textured, straight or curved. The fan heatsink assembly is attached to the device to be cooled. Heat is transferred from the electronic component, into the heat dissipating member where the fan causes air to be drawn up between the fins and along the curved center portion, removing heat from the heat dissipating member and the electronic component.

US Patent:

58221956, Oct 13, 1998

Filed:

Mar 31, 1997

Appl. No.:

8/834793

Inventors:

Colin E. Brench - Stow MA
Stephen Richard Coe - Ashburnham MA
Samuel Hammond Duncan - Arlington MA
Stephen Edward Lindquist - Boylston MA
Richard Ernest Olson - Rindge NH

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

H05K 0714

US Classification:

361818

Abstract:

An interface module for an electronic system that permits signals to pass between a high frequency main circuit board area such as used for central processing units, memories, or other relatively high clock rate components and a low frequency circuit area such as used for standard peripheral circuit modules used for disk drives, video interfaces and the like. The interconnect module is positioned near an opening in a sheet metal bulkhead used as an electromagnetic interference (EMI) barrier around the main circuit area. The interface module uses a connector that is surrounded by one or more conductive shields that contain metal fingers on inboard and outboard sides to provide a ground connection between the interface module and the EMI barrier.

US Patent:

54104483, Apr 25, 1995

Filed:

Aug 10, 1993

Appl. No.:

8/104518

Inventors:

Charles R. Barker - Harvard MA
Richard E. Olson - Rindge NH

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

H05H 720

US Classification:

361695

Abstract:

A parallel air flow system which automatically maintains proper coolant flow regardless of the number of circuit boards installed in an enclosure. The enclosure is constructed such that air flow path through any one slot does not affect the air flow through any other slot. Proper air flow through the entire system is maintained by an air flow sensor disposed in an air flow path having a known air flow resistance. This sensor controls the speed of an air-mover in order to maintain a constant predetermined air flow through the known resistance, in such a way that a constant static air pressure is maintained at each slot. Baffle modules are preferably inserted into the enclosure to prevent air flow into any empty slots, to reduce the total air volume necessary to achieve the predetermined static pressure, thereby reducing the audible noise generated by the air-mover.

US Patent:

49358642, Jun 19, 1990

Filed:

Jun 20, 1989

Appl. No.:

7/368741

Inventors:

William L. Schmidt - Acton MA
Richard E. Olson - Rindge NH
Dennis J. Solley - Windham NH

Assignee:

Digital Equipment Corporation - Maynard MA

International Classification:

H01L 2504

US Classification:

363141

Abstract:

A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performance of which is known to improve by cooling, a heat removal assembly consisting of a heat sink attached to a card edge portion and occupying an adjacent second slot, and a thermoelectric cooler intimately bonded to both the chip and heat removal assembly. A controller provides power via the connector of the second slot to the thermoelectric cooler and stabilizes the temperature of the chip to a predetermined value.

US Patent:

20210277004, Sep 9, 2021

Filed:

Jun 26, 2019

Appl. No.:

17/254914

Inventors:

- Princeton NJ, US
Min Ding - Stow MA, US
Robert G. Gentles - Killingworth CT, US
Yazhong Huang - Wallingford CT, US
Scott W. Martin - Middletown CT, US
Ivar M. Mcdonald - Woodstock CT, US
Stephen E. Mercer - Wakefield MA, US
Richard E. Olson - Cambridge MA, US
Upender Velaparthi - Princeton Junction NJ, US
Michael Wichroski - Yardley PA, US
Xiaofan Zheng - Cheshire CT, US

International Classification:

C07D 471/04
A61P 35/00

Abstract:

Disclosed are compounds of Formula (I): or a salt thereof, wherein: R, R, R, and Rare defined herein. Also disclosed are methods of using such compounds to inhibit the activity of one or both of diacylglycerol kinase alpha (DGK α) and diacylglycerol kinase zeta (DGKζ), and pharmaceutical compositions comprising such compounds. These compounds are useful in the treatment of viral infections and proliferative disorders, such as cancer.