Richard Lynn Platt

US Patent:

7701924, Apr 20, 2010

Filed:

Feb 27, 1998

Appl. No.:

09/032083

Inventors:

Robert T. Bell - Bountiful UT, US
Paul S. Hahn - Plano TX, US
Michael H. McClung - Middleburg VA, US
Richard B. Platt - Allen TX, US

Assignee:

Cisco Technology, Inc. - San Jose CA

International Classification:

H04L 12/66
H04L 12/28
H04J 3/16

US Classification:

370352, 370402, 370466

Abstract:

A system for, and method for, performing state-based signaling on behalf of a stateless client. In one embodiment, the system includes a controller, couplable to a state-based terminal, that translates at least one stateless signaling message received from the stateless client to at least one state-based signaling message for presentation to the state-based terminal thereby facilitating a media stream communications session between the stateless client and the state-based terminal over an Internet Protocol (IP)-based network.

US Patent:

20100205280, Aug 12, 2010

Filed:

Apr 19, 2010

Appl. No.:

12/762677

Inventors:

Robert T. Bell - Bountiful UT, US
Paul S. Hahn - Plano TX, US
Michael H. McClung - Middleburg VA, US
Richard B. Platt - Allen TX, US

Assignee:

Cisco Technology, Inc. - San Jose CA

International Classification:

G06F 15/16

US Classification:

709219, 709227, 709231

Abstract:

A system for, and method for, performing state-based signaling on behalf of a stateless client. In one embodiment, the system includes a controller, couplable to a state-based terminal, that translates at least one stateless signaling message received from the stateless client to at least one state-based signaling message for presentation to the state-based terminal thereby facilitating a media stream communications session between the stateless client and the state-based terminal over an Internet Protocol (IP)-based network.

US Patent:

63207559, Nov 20, 2001

Filed:

Aug 6, 1999

Appl. No.:

9/370103

Inventors:

Michael R. Schweers - Hillsboro OR
William J. Hill - Hillsboro OR
Richard Platt - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 702

US Classification:

361760

Abstract:

An improved assembly for a computer that includes at least two through hole mounted components, which are mounted to a printed circuit board, and a heat resistant strip mounted to the top of each of those components.

US Patent:

59370572, Aug 10, 1999

Filed:

Mar 5, 1997

Appl. No.:

8/811675

Inventors:

Robert T. Bell - Bountiful UT
Richard B. Platt - Allen TX

Assignee:

Selsius Systems, Inc. - Dallas TX

International Classification:

H04M 300

US Classification:

379265

Abstract:

For use in a call center having a plurality of agent stations and an audio automatic call distribution system (ACD) for routing an incoming audio call received from a communications network to one of the plurality of agent stations, a system and method that allows the audio ACD to route an audio/video call received into the call center. The system includes: (1) an audio/video call control circuit for responding to a video portion of an incoming audio/video call from the communications network and routing an audio portion of the incoming audio/video call to the audio ACD, the audio ACD processing the audio portion as an incoming audio call and routing the audio portion to one of the plurality of agent stations and (2) a video routing circuit for determining an identity of the one of the plurality of agent stations and routing the video portion to the one of the plurality of agent stations in response thereto, both the audio portion and the video portion of the incoming audio/video call thereby routed to the one of the plurality of agent stations in response to routing control given by the audio ACD.

US Patent:

62923668, Sep 18, 2001

Filed:

Jun 26, 2000

Appl. No.:

9/603795

Inventors:

Richard Platt - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361700

Abstract:

A printed circuit board that includes first and second outer layers and a rigid core block that is positioned between those layers. An integrated circuit is positioned within the rigid core block and a heat pipe is formed within the rigid core block. The heat pipe is thermally coupled to the integrated circuit.