Richard M Pointer

US Patent:

7402051, Jul 22, 2008

Filed:

Nov 10, 2006

Appl. No.:

11/558603

Inventors:

Rakesh Batish - Phoenixville PA, US
Richard M. Pointer - Media PA, US

Assignee:

Antares Advanced Test Technologies, Inc. - Vancouver WA

International Classification:

H01R 12/00

US Classification:

439 66, 439 91

Abstract:

An interconnect assembly is provided for electrically connecting first and second circuit members. Each of the circuit members comprises an array of electrical contacts. The interconnect assembly includes a plurality of compressible electrical conductors having opposite ends respectively configured for contacting the electrical contacts of the first and second circuit members. The interconnect assembly also includes a carrier defining a plurality of apertures for receiving the conductors and at least one retainer contacting each conductor. Each of the retainers has a maximum diameter that is greater than a minimum diameter of the apertures such that a portion of each conductor is retained within one of the apertures.