Richard Lee Shook

US Patent:

7368326, May 6, 2008

Filed:

May 27, 2004

Appl. No.:

10/855148

Inventors:

John William Osenbach - Kutztown PA, US
Brian Dale Potteiger - Reading PA, US
Richard Lawrence Shook - Fogelsville PA, US
Brian Thomas Vaccaro - Mertztown PA, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 21/50
H01L 21/48
H01L 21/44
H01L 23/495
H01L 23/52
H01L 23/48
H01L 23/40

US Classification:

438123, 438106, 438124, 257666, 257677, 257734, 257735, 257736, 257766, 257692, 257E23053, 257E23054, 257E23031, 257E23035

Abstract:

A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.

US Patent:

8013428, Sep 6, 2011

Filed:

Jul 28, 2009

Appl. No.:

12/462069

Inventors:

Kultaransingh N. Hooghan - Murphy TX, US
John W. Osenbach - Kutztown PA, US
Brian Dale Potteiger - Reading PA, US
Poopa Ruengsinsub - Bangkok, TH
Richard L. Shook - Fogelsville PA, US
Prakash Suratkar - Bangalore, IN
Brian T. Vaccaro - Mertztown PA, US

Assignee:

LSI Corporation - Milpitas CA

International Classification:

B32B 15/20
H01L 23/495
H01L 23/28
C22F 1/08

US Classification:

257666, 257687, 257787, 428647, 428648, 428929, 428941, 148536, 148537, 29827, 4273837, 174521, 174565

Abstract:

A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

US Patent:

20050077080, Apr 14, 2005

Filed:

Oct 14, 2003

Appl. No.:

10/682969

Inventors:

Adesoji Dairo - Macungie PA, US
Jeffery Gilbert - Schwenksville PA, US
Christopher Horvath - Allentown PA, US
Richard Shook - Fogelsville PA, US
Ebyson Thomas - Allentown PA, US
Brian Vaccaro - Mertztown PA, US

International Classification:

H05K007/06

US Classification:

174255000, 361804000, 174260000, 257778000

Abstract:

The present invention includes tab supports on the solder ball side of a BGA package substrate. The tab supports are preferably sized in a height direction to avoid or prevent a warped corner or edge of a BGA substrate from excessively pressing down on the solder balls when warping occurs, most often during the high temperature solder-reflow process. Exemplary tab supports comprise small standoff tabs placed in all four corners of the lower substrate of a BGA package, and/or on all four edges of the lower substrate. The invention has particular application to a plastic BGA (PBGA) package.

US Patent:

20060068218, Mar 30, 2006

Filed:

Sep 28, 2004

Appl. No.:

10/951430

Inventors:

Kultaransingh Hooghan - Murphy TX, US
John Osenbach - Kutztown PA, US
Brian Potteiger - Reading PA, US
Poopa Ruengsinsub - Bangkok, TH
Richard Shook - Fogelsville PA, US
Prakash Suratkar - Bangalor, IN
Brian Vaccaro - Mertztown PA, US

International Classification:

B32B 15/00
B32B 15/01

US Classification:

428615000, 428646000, 428647000, 148527000

Abstract:

The electrical and mechanical properties of structures such as lead frames and other electrical/electronic devices containing, during processing, copper/tin interfaces are improved by introduction of nickel to such interface. Typically, a weight percentage of nickel to tin in the range 1 to 12 weight percent yields upon melting of the tin, an intermetallic compound with essentially no occluded, unbound tin. Thus undesirable anomalous structures such as tin needles and substantially non-planar interface compositions are avoided. Advantageously a nickel/tin/copper intermetallic interface that is substantially planar is formed in the substantial absence of needle-like tin structures.

US Patent:

20060266446, Nov 30, 2006

Filed:

May 25, 2005

Appl. No.:

11/136911

Inventors:

John Osenbach - Kutztown PA, US
Brian Potteiger - Reading PA, US
Richard Shook - Fogelsville PA, US

International Classification:

C22C 13/00

US Classification:

148538000

Abstract:

It has been found that composition containing copper, tin, and silver prevents tin whisker formation on an electronic structure while allowing solders to wet such structures during soldering processes. It has further been found that conventional techniques, such as electrolytic plating, electroless plating, wet dipping and vapor deposition, for forming such materials have undesirable limitations and/or characteristics. However, by forming a Ag/Sn precursor on a copper containing electronic structure and inducing a self-limiting reaction between the precursor and the copper of the structure, the advantageous Ag/Sn/Cu material is formed without the undesirable limitations and characteristics associated with conventional techniques.