Richard Dale Small

US Patent:

41105982, Aug 29, 1978

Filed:

Apr 21, 1977

Appl. No.:

5/789462

Inventors:

Richard B. Small - Dallas TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H05B 100

US Classification:

219216

Abstract:

In a method of mounting electronic devices, a gold lead is connected to each contact pad of each wafer in a semiconductor slice. In a parallel step, a body of wafer receiving material is secured to a support and is thereafter separated into wafer receiving members. Then, a layer of epoxy resin is applied to the slice, and the slice is secured to the wafer receiving members with each wafer mounted on a wafer receiving member and with the gold leads positioned between the wafers and the wafer receiving members. After the mounting step, the wafers comprising the slice are separated and the wafer receiving members are disengaged from the support. The resulting wafer-wafer receiving member subassemblies are subsequently fabricated into thermal printheads by mounting the wafer receiving members on heat sinks and connecting electrical conductors to the gold leads.