Robert E Bond

US Patent:

8526709, Sep 3, 2013

Filed:

Jan 13, 2011

Appl. No.:

13/005989

Inventors:

Robert Bond - San Jose CA, US
Fareed Nabkel - Concord CA, US
Richard Adachi - Castro Valley CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G06K 9/00

US Classification:

382145, 382149

Abstract:

A method for determining physical placement data for a plurality of wafers is disclosed. The method includes obtaining raw CCD array data from a linear CCD array by clocking data from pixels of the linear CCD array into memory cells of the memory device and ascertaining pixel transition data to determine whether at least one of an upper edge error, a lower edge error, a wafer thickness error, and transition-per-slot error exists. If an error is found, the method includes generating an error signal.

US Patent:

8582837, Nov 12, 2013

Filed:

Jan 16, 2009

Appl. No.:

12/355673

Inventors:

Robert Henry Bond - Oakland CA, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

Authentec, Inc. - Melbourne FL

International Classification:

G06K 9/00

US Classification:

382124, 382115, 382116, 382141

Abstract:

An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is generally opaque. Accordingly, the light source and at least a portion of the IC are not visible to the unaided human eye. The thickness and geometry of the encapsulation are such that when the light source is caused to emit light, the encapsulation structure permits at least a portion of that light to be visible to a user. The IC may be a portion of a fingerprint sensor, exposed for receiving a fingertip of a user. The light source, or a plurality of such light sources, may be functional (e. g. , providing visual indication of the of the condition or state of an item of hardware or software, assist the user in operation of a device), be primarily aesthetic, or a combination thereof.

US Patent:

20100127366, May 27, 2010

Filed:

Nov 27, 2008

Appl. No.:

12/324869

Inventors:

Robert Bond - Oakland CA, US
Alan Kramer - Berkeley CA, US
Giovanni Gozzini - Berkeley CA, US

Assignee:

UPEK, Inc. - Emeryville CA

International Classification:

H01L 23/495
H01L 21/71

US Classification:

257676, 438123, 438 48, 382124, 257E23037, 257E21536

Abstract:

An integrated leadframe and bezel structure includes a planar carrier frame, a plurality of bonding leads, a die pad region, and a bezel structure. The bezel structure includes a bending portion shaped and disposed to facilitate a portion of said bezel structure being bent out of the plane of said carrier frame. A sensor IC may be secured to the die pad region, and wire bonds made to permit external connection to the sensor IC. The bezel structure includes portions which are bent such that their upper extent is in or above a sensing surface. The assembly is encapsulated, exposing on the top surface part of the bezel portions and the upper surface of the sensor IC, and on the bottom surface the contact pads. Two or more bezel portions may be provided, one or more on each side of the sensor IC.