Robert Lee Comstock

US Patent:

47361085, Apr 5, 1988

Filed:

Jul 29, 1986

Appl. No.:

6/891443

Inventors:

Robert L. Comstock - Santa Clara CA
Michael R. Hansen - Santa Clara CA
Edrick H. Tong - Sunnyvale CA

Assignee:

Santana Engineering Systems - Santa Clara CA

International Classification:

G01N 2186

US Classification:

250561

Abstract:

A method and apparatus for measuring the alignment of leads along the perimeter of an integrated circuit surface mount device (SMD). The device is placed so that a first lead is within the path of a beam of light emitted from a light source. The light source is moved around the perimeter of the device so that the beam of light contacts all of the leads of the device. The angle of reflection of the beam of light off of each of the leads is detected. From this angle, the alignment of the leads is determined by first calculating a seating plane and then calculating the variation of each lead from the seating plane.

US Patent:

47543175, Jun 28, 1988

Filed:

Apr 28, 1986

Appl. No.:

6/856926

Inventors:

Robert L. Comstock - Santa Clara CA
Steven L. Baburek - Santa Clara CA

Assignee:

Monolithic Memories, Inc. - Santa Clara CA

International Classification:

H01L 2348
H01L 2304

US Classification:

357 70

Abstract:

In order to prevent bonding wire sag and to allow high lead count an insulative bridging member is provided between the ends of inner leads of a lead frame and a centrally mounted integrated circuit die. The bridging member of annular square configuration has transverse plated spaced conductive pathways. A first series of short bonding wires connect selected die contact pads to an inner end of selected conductive pathways and a second concentric series of bonding wires connect an outer end of the selective conductive pathways of the bridging member to selected ones of the inner leads of the lead frame. The above elements except for outer leads of the lead frame are encapsulated to form an overall die package with external leads or pin contacts.

US Patent:

20170053395, Feb 23, 2017

Filed:

Nov 7, 2016

Appl. No.:

15/344788

Inventors:

- Milpitas CA, US
Yalin Xiong - Pleasanton CA, US
Joseph M. Blecher - San Jose CA, US
Robert A. Comstock - Pleasanton CA, US
Mark J. Wihl - Tracy CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G06T 7/00
G01N 21/956

Abstract:

A reticle that is within specifications is inspected to generate baseline candidate defects and their location and size. After using the reticle in photolithography, the reticle is inspected to generate current candidate defects and their location and size. An inspection report of filtered candidate defects and their images is generated so that these candidate defects include a first subset of the current candidate defects and their images and exclude a second subset of the current candidate defects and their images. Each of the first subset of candidate defects has a location and size that fails to match any baseline candidate defect's location and size, and each of the excluded second subset of candidate defects has a location and size that matches a baseline candidate defect's location and size.

US Patent:

20150029498, Jan 29, 2015

Filed:

May 15, 2014

Appl. No.:

14/278277

Inventors:

- Milpitas CA, US
Yalin Xiong - Pleasanton CA, US
Joseph M. Blecher - San Jose CA, US
Robert A. Comstock - Pleasanton CA, US
Mark J. Wihl - Tracy CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G01N 21/956

US Classification:

3562371

Abstract:

A reticle that is within specifications is inspected so as to generate a baseline event indicating a location and a size value for each unusual reticle feature. After using the reticle in photolithography, the reticle is inspected so as to generate a current event indicating a location and a size value for each unusual reticle feature. An inspection report of candidate defects and their images is generated so that these candidate defects include a first subset of the current events and their corresponding candidate defect images and exclude a second subset of the current events and their corresponding excluded images. Each of the first included events has a location and size value that fails to match any baseline event's location and size value, and each of the excluded second events has a location and size value that matches a baseline event's location and size value.