Victor Barinov - Brooklyn NY, US Robert Dabrowski - Brooklyn NY, US Kalle Levon - Brooklyn NY, US Roberto Pieraccini - New York NY, US Krishna Dayanidhi - Jersey City NJ, US
International Classification:
G10L 15/04
US Classification:
704251, 704E15001
Abstract:
A method for variable resolution and error control in spoken language understanding (SLU) allows arranging the categories of the SLU into a hierarchy of different levels of specificity. The pre-determined hierarchy is used to identify different types of errors such as high-cost errors and low-cost errors and trade, if necessary, high cost errors for low cost errors.
Methods And Apparatus For Modifying Gel Adhesion Strength
Victor Barinov - Brooklyn NY, US Robert Dabrowski - Brooklyn NY, US Kalle Levon - Brooklyn NY, US
International Classification:
B32B 38/00
US Classification:
156344, 156584
Abstract:
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.
Methods And Apparatus For Electrically Modifying Gel Adhesion
Victor Barinov - Brooklyn NY, US Robert Dabrowski - Brooklyn NY, US Kalle Levon - Brooklyn NY, US
International Classification:
B32B 38/10
US Classification:
156701
Abstract:
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.