Robert M Dabrowski

US Patent:

20080243505, Oct 2, 2008

Filed:

Mar 12, 2008

Appl. No.:

12/075566

Inventors:

Victor Barinov - Brooklyn NY, US
Robert Dabrowski - Brooklyn NY, US
Kalle Levon - Brooklyn NY, US
Roberto Pieraccini - New York NY, US
Krishna Dayanidhi - Jersey City NJ, US

International Classification:

G10L 15/04

US Classification:

704251, 704E15001

Abstract:

A method for variable resolution and error control in spoken language understanding (SLU) allows arranging the categories of the SLU into a hierarchy of different levels of specificity. The pre-determined hierarchy is used to identify different types of errors such as high-cost errors and low-cost errors and trade, if necessary, high cost errors for low cost errors.

US Patent:

20090114344, May 7, 2009

Filed:

Nov 1, 2005

Appl. No.:

11/666567

Inventors:

Victor Barinov - Brooklyn NY, US
Robert Dabrowski - Brooklyn NY, US
Kalle Levon - Brooklyn NY, US

International Classification:

B32B 38/00

US Classification:

156344, 156584

Abstract:

The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.

US Patent:

20120325410, Dec 27, 2012

Filed:

Aug 9, 2012

Appl. No.:

13/570299

Inventors:

Victor Barinov - Brooklyn NY, US
Robert Dabrowski - Brooklyn NY, US
Kalle Levon - Brooklyn NY, US

International Classification:

B32B 38/10

US Classification:

156701

Abstract:

The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.