Robert W Dobbs

US Patent:

6680853, Jan 20, 2004

Filed:

Jan 27, 2003

Appl. No.:

10/351950

Inventors:

Robert William Dobbs - Granite Bay CA
James Kristian Koch - Rocklin CA
Andrew Harvey Barr - Roseville CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 702

US Classification:

361810, 361818, 361717

Abstract:

Systems for mounting components to circuit assemblies are provided. One such system comprises a circuit assembly having a front, a back, a length and a width. A support structure is attached to one of the front and the back of the circuit assembly, with the support structure being sized and shaped to span at least one of the length and the width of the circuit assembly. A first component is attached to the support structure such that at least a portion of the support structure is located between the first component and the circuit assembly, with the first component electrically communicating with the circuit assembly. Methods and other systems also are provided.

US Patent:

6791843, Sep 14, 2004

Filed:

Jun 11, 2003

Appl. No.:

10/459231

Inventors:

Robert W. Dobbs - Granite Bay CA
Stephan K. Barsun - Davis CA
Andrew H. Barr - Roseville CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 700

US Classification:

361758, 361754, 361759, 361742, 361747, 361801, 361740, 361770

Abstract:

An electronic system includes a first system component having a first connector and a second system component having a second connector. One of the first system component having the second system component pivots between a first position in which the first connector and the second connector are disconnected and a second position in which the first connector and the second connector are connected.

US Patent:

6798661, Sep 28, 2004

Filed:

May 8, 2003

Appl. No.:

10/434762

Inventors:

Stephan Karl Barsun - Davis CA
Andrew Harvey Barr - Roseville CA
Robert William Dobbs - Granite Bay CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 720

US Classification:

361700, 361704, 361707, 257715, 174 152, 165 804, 16510426

Abstract:

A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

US Patent:

6812719, Nov 2, 2004

Filed:

May 28, 2003

Appl. No.:

10/447798

Inventors:

Andrew Harvey Barr - Roseville CA
Robert William Dobbs - Granite Bay CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

G01R 3102

US Classification:

324754, 324758

Abstract:

A signal probe includes a conductive probe tip for contacting a signal node of an electronic device, and a mount to hold the tip in contact with the node. With such a probe, a technician no longer has to hold the probe to maintain contact with a signal node, such as a lead of a component.

US Patent:

6822878, Nov 23, 2004

Filed:

Oct 9, 2002

Appl. No.:

10/267768

Inventors:

Robert W. Dobbs - Granite Bay CA
James K. Koch - Rocklin CA
Thane M. Larson - Roseville CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H05K 114

US Classification:

361807, 361758, 361796, 361752

Abstract:

Various embodiments of a circuit board support arrangement and associated methods are provided that facilitate hot plug access to circuit components in a server, computer system or other device. A circuit board support arrangement comprises a first circuit board and a second circuit board that is attached to a pivot joint. The second circuit board is juxtaposed over and pivotal relative to the first circuit board, and, an electronic coupling is attached between the first circuit board and the second circuit board.

US Patent:

6856518, Feb 15, 2005

Filed:

Jul 14, 2003

Appl. No.:

10/619026

Inventors:

Robert William Dobbs - Granite Bay CA, US
Andrew Harvey Barr - Roseville CA, US
Stephan Karl Barsun - Davis CA, US

Assignee:

Hewlett Packard Development Company, L.P. - Houston TX

International Classification:

H05K007/14
H05K007/18

US Classification:

361801, 361684, 361685, 361740, 361736

Abstract:

An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.

US Patent:

6891347, May 10, 2005

Filed:

Oct 9, 2002

Appl. No.:

10/267766

Inventors:

Robert W. Dobbs - Granite Bay CA, US
James K. Koch - Rocklin CA, US
Jeremy I. Wilson - Roseville CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H02P001/04

US Classification:

318471, 318254, 318461, 388800, 388806, 388903, 388934

Abstract:

Various systems and methods are provided for cooling a cabinet. In one embodiment, a method is provided that comprises the steps of controlling a speed of the at least one cooling fan in response to a temperature of the cabinet, and, controlling the speed of the at least one cooling fan in response to a position of an access panel relative to the cabinet.

US Patent:

6896539, May 24, 2005

Filed:

Jun 30, 2003

Appl. No.:

10/610144

Inventors:

Robert William Dobbs - Granite Bay CA, US
Andrew Harvey Barr - Roseville CA, US
Stephan Karl Barsun - Davis CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01R013/64

US Classification:

439376, 439341, 361802

Abstract:

A pivot component of an apparatus in one example is coupled with a first circuit board that comprises a first connection component. The pivot component controls a relative alignment of the first connection component with a second connection component of a second circuit board for an engagement of the first connection component with the second connection component.