Robert W Eaton

Address:

2131 Burton Ave, Fort Myers, FL 33907

VIN:

1GNDS13SX72288744

Make:

CHEVROLET

Model:

TRAILBLAZER

Year:

2007

US Patent:

6361646, Mar 26, 2002

Filed:

Mar 18, 1999

Appl. No.:

09/271729

Inventors:

Thomas Frederick Allen Bibby, Jr. - Gilbert AZ
John A. Adams - Escondido CA
Robert A. Eaton - Scottsdale AZ

Assignee:

Speedfam-IPEC Corporation - Chandler AZ

International Classification:

C23F 104

US Classification:

156345, 216 85, 216 88, 216 89, 216 90, 216 91, 438 7, 438 8, 438 14, 438 16, 438690, 438691, 438692, 451 6

Abstract:

An apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-hole in a polish pad, a light source, a fiber optic cable, a light sensor, and a computer. A pad assembly includes the polish pad, a pad backer, and a pad backing plate. The pad backer includes a pinhole and a canal that holds the fiber optic cable. The pad backer holds the polish pad so that the through-hole is coincident with the pinhole opening. A wafer chuck holds a semiconductor wafer so that the surface to be polished is against the polish pad. The light source provides light within a predetermined bandwidth. The fiber optic cable propagates the light through the through-hole opening to illuminate the surface as the pad assembly orbits and the chuck rotates. The light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal.

US Patent:

6641462, Nov 4, 2003

Filed:

Jun 27, 2001

Appl. No.:

09/893131

Inventors:

Robert A. Eaton - Scottsdale AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 1922

US Classification:

451 41, 451 57, 451 60, 451285

Abstract:

A fluid delivery system is provided for delivering a fluid to a polishing surface of a chemical mechanical polishing tool. The system includes a platen, manifold and slurry delivery conduit. The platen has a plurality of conduits for allowing a fluid to pass to the polishing surface. The manifold, through the use of a plurality of channels, controls the fluid distribution to the conduits in the platen. The channel cross-sectional area at substantially every point is greater than, preferably 1. 5 to 2 times, the combined cross-sectional area of all the conduits being serviced by the channel. This results in the conduits being the most restrictive feature and a uniform pressure within the manifold. However, the volume of the channels should also be reduced as this reduces the time necessary for a fluid change over. The slurry delivery conduit communicates fluid from a fluid source to the channels in the manifold.

US Patent:

6805613, Oct 19, 2004

Filed:

Oct 17, 2000

Appl. No.:

09/690521

Inventors:

Matthew Weldon - Phoenix AZ
Thomas Laursen - Tempe AZ
Malcolm Grief - Chandler AZ
Paul Holzapfel - Mercer PA
Mark A. Meloni - Lewisville TX
Robert Eaton - Scottsdale AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 4912

US Classification:

451 6, 451288, 451 5

Abstract:

The invention is a method and apparatus for planarizing a wafer. Discrete measurements are taken across the surface of the wafer at a desired spatial density. The measurements may be generated using a flash lamp to reflect a light signal off the surface of the wafer with a spectrometer analyzing the reflected light. A plurality of probes may be used at different locations to shorten the time necessary for taking measurements across the full front surface of the wafer and for allowing a plurality of areas to be sampled substantially simultaneously. A control system receives the measurements and their corresponding locations. The control system is then able to analyze the data looking for areas or bands on the front surface of the wafer that need an increase or decrease in material removal rate. The control system is then able to adjust one or more planarization parameters to improve the process for the current wafer or for future wafers.

US Patent:

6960115, Nov 1, 2005

Filed:

Aug 22, 2003

Appl. No.:

10/646011

Inventors:

Matthew Weldon - Phoenix AZ, US
Thomas Laursen - Tempe AZ, US
Malcolm Grief - Chandler AZ, US
Paul Holzapfel - Mercer PA, US
Mark A. Meloni - Lewisville TX, US
Robert Eaton - Scottsdale AZ, US

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B049/12

US Classification:

451 6, 451 41

Abstract:

The invention is a method and apparatus for planarizing a wafer. Discrete measurements are taken across the surface of the wafer at a desired spatial density. The measurements may be generated using a flash lamp to reflect a light signal off the surface of the wafer with a spectrometer analyzing the reflected light. A plurality of probes may be used at different locations to shorten the time necessary for taking measurements across the full front surface of the wafer and for allowing a plurality of areas to be sampled substantially simultaneously. A control system receives the measurements and their corresponding locations. The control system is then able to analyze the data looking for areas or bands on the front surface of the wafer that need an increase or decrease in material removal rate. The control system is then able to adjust one or more planarization parameters to improve the process for the current wafer or for future wafers.

US Patent:

61066621, Aug 22, 2000

Filed:

Jun 8, 1998

Appl. No.:

9/093467

Inventors:

Thomas Frederick Allen Bibby - Gilbert AZ
John A. Adams - Escondido CA
Robert A. Eaton - Scottsdale AZ
Christopher E. Barns - Portland OR
Charles Hannes - Phoenix AZ

Assignee:

SpeedFam-IPEC Corporation - Chandler AZ

International Classification:

B24B 500

US Classification:

156345

Abstract:

An apparatus to generate an endpoint signal to control the polishing of thin films on a semiconductor wafer surface includes a through-hole in a polish pad, a light source, a fiber optic cable, a light sensor, and a computer. A pad assembly includes the polish pad, a pad backer, and a pad backing plate. The pad backer includes a pinhole and a canal that holds the fiber optic cable. The pad backer holds the polish pad so that the through-hole is coincident with the pinhole opening. A wafer chuck holds a semiconductor wafer so that the surface to be polished is against the polish pad. The light source provides light within a predetermined bandwidth. The fiber optic cable propagates the light through the through-hole opening to illuminate the surface as the pad assembly orbits and the chuck rotates. The light sensor receives reflected light from the surface through the fiber optic cable and generates reflected spectral data. The computer receives the reflected spectral data and calculates an endpoint signal.