Robert Allen Falcone

US Patent:

56603193, Aug 26, 1997

Filed:

Jan 17, 1995

Appl. No.:

8/373161

Inventors:

Robert J. Falcone - Odessa TX
Timothy J. Hogan - Allen TX

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21607

US Classification:

2281101

Abstract:

A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).

US Patent:

58360719, Nov 17, 1998

Filed:

Dec 26, 1996

Appl. No.:

8/777844

Inventors:

Robert J. Falcone - Odessa TX
Stephen R. Martin - Midland TX

Assignee:

Texas Instrument Incorporated - Dallas TX

International Classification:

H05K 1300
G01R 3102

US Classification:

29593

Abstract:

A method for temporarily packaging a semiconductor die, includes attaching the semiconductor die (40) to a die support (60) in a cavity (58) of package housing (56) with an adhesive (52) that will cures at a first low temperature and volatilizes at a second, higher temperature that is less than the temperature that will drive diffusions in the die deeper and change the electrical characteristics of the die. A reverse bonding process is used to form a first wedge bond with a relatively soft wire (88) on a conductive pad (62) extending into cavity (58) and a second wedge bond on a bond pad (41) on die (40). The wedge tool (76) used to make the wedge bonds has a front radius which is larger than that on conventional wedge tools, so that the cross-sectional area of the bond heel (91) is increased. The increased cross-sectional area and soft wire permit the wire to be removed from the bond pad (41) without breaking the wire or significantly damaging the bond pad. Die 40 may be burned-in or tested following bonding by placing the package housing (56) in a tester.