Robert V Frye
age ~70
from Gilbert, AZ
- Also known as:
-
- Robert Vincent Frye
- Robert V Ftye
- Robert Fry
- Robert V Anglin
- Phone and address:
- 169 W Sage Brush St, Gilbert, AZ 85233
Robert Frye Phones & Addresses
- 169 W Sage Brush St, Gilbert, AZ 85233
- 5209 Old Plantation Cir, Winston Salem, NC 27104
- Greensboro, NC
- Lyman, WY
- Winnemucca, NV
- Evanston, WY
- Albuquerque, NM
- Maricopa, AZ
Work
-
Company:Prudential Douglas Elliman
-
Address:
-
Phones:9175867923
Images
Medicine Doctors
Robert L. Frye
view sourceSpecialties:
Cardiovascular Disease
Work:
Mayo ClinicMayo Clinic Rochester Gonda
200 1 St SW, Rochester, MN 55905
5072842511 (phone), 5072841803 (fax)
200 1 St SW, Rochester, MN 55905
5072842511 (phone), 5072841803 (fax)
Education:
Medical School
Vanderbilt University School of Medicine
Graduated: 1956
Vanderbilt University School of Medicine
Graduated: 1956
Conditions:
Aortic Valvular Disease
Conduction Disorders
Mitral Valvular Disease
Acute Myocardial Infarction (AMI)
Angina Pectoris
Conduction Disorders
Mitral Valvular Disease
Acute Myocardial Infarction (AMI)
Angina Pectoris
Languages:
English
Description:
Dr. Frye graduated from the Vanderbilt University School of Medicine in 1956. He works in Rochester, MN and specializes in Cardiovascular Disease. Dr. Frye is affiliated with Mayo Clinic Hospital-Rochester Methodist Campus and Saint Marys Hospital.
Isbn (Books And Publications)
Us Patents
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Miniaturized Wide-Band Baluns For Rf Applications
view source -
US Patent:7629860, Dec 8, 2009
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Filed:Jun 8, 2007
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Appl. No.:11/760207
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H03H 7/42
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US Classification:333 25
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Abstract:A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between secondhand third portions of the third coil.
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Compact Coils For High Performance Filters
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US Patent:7688160, Mar 30, 2010
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Filed:Apr 12, 2007
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Appl. No.:11/734410
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H03H 7/00
H01F 5/00 -
US Classification:333185, 333177, 336 20
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Abstract:A coil structure for a filter device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil. A portion of the second coil is oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A portion of the third coil is oriented interiorly of the second coil.
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Semiconductor Package With Stacked Semiconductor Die Each Having Ipd And Method Of Reducing Mutual Inductive Coupling By Providing Selectable Vertical And Lateral Separation Between Ipd
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US Patent:7892858, Feb 22, 2011
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Filed:Mar 5, 2008
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Appl. No.:12/042903
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Inventors:Kai Liu - Phoenix AZ, US
Robert C. Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H01L 21/00
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US Classification:438 3, 438107, 438381, 257E21001, 257E23001
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Abstract:A semiconductor package has first and second semiconductor die mounted to a substrate. The first semiconductor die includes a first inductor coil electrically coupled to the substrate. The second semiconductor die is mounted over the first semiconductor die. The second semiconductor die includes a second inductor coil electrically coupled to the substrate. A center of the second inductor coil has a vertical and lateral separation with respect to a center of the first inductor coil which are each selectable to minimize mutual inductive coupling between the first and second inductor coils. A spacer is disposed between the first and second semiconductor die to adjust the vertical separation. The center of the second inductor is positioned laterally within the second semiconductor die with respect to the center of the first inductor to adjust the lateral separation. The mutual inductive coupling decreases with increasing vertical and lateral separation.
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Semiconductor Device And Method Of Forming Compact Coils For High Performance Filter
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US Patent:8111112, Feb 7, 2012
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Filed:Feb 15, 2010
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Appl. No.:12/705790
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H03H 7/00
H01H 85/02
H01L 27/08 -
US Classification:333185, 333177, 336232, 257531
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Abstract:A semiconductor device has a first coil structure formed over the substrate. A second coil structure is formed over the substrate adjacent to the first coil structure. A third coil structure is formed over the substrate adjacent to the second coil structure. The first and second coil structures are coupled by mutual inductance, and the second and third coil structures are coupled by mutual inductance. The first, second, and third coil structures each have a height greater than a skin current depth of the coil structure defined as a depth which current reduces to 1/(complex permittivity) of a surface current value. In the case of copper, the coil structures have a height greater than 5 micrometers. The first, second, and third coil structures are arranged in rounded or polygonal pattern horizontally across the substrate with a substantially flat vertical profile.
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Semiconductor Device And Method Of Forming Thin Film Capacitor
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US Patent:8111113, Feb 7, 2012
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Filed:Feb 15, 2010
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Appl. No.:12/705810
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H03H 7/00
H01G 4/06 -
US Classification:333185, 257303, 361311
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Abstract:A semiconductor device has a first coil structure formed over the substrate. A second coil structure is formed over the substrate adjacent to the first coil structure. A third coil structure is formed over the substrate adjacent to the second coil structure. The first and second coil structures are coupled by mutual inductance, and the second and third coil structures are coupled by mutual inductance. The first, second, and third coil structures each have a height greater than a skin current depth of the coil structure defined as a depth which current reduces to 1/(complex permittivity) of a surface current value. A thin film capacitor is formed within the semiconductor device by a first metal plate, dielectric layer over the first metal plate, and second and third electrically isolated metal plates opposite the first metal plate. The terminals are located on the same side of the capacitor.
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Miniaturized Wide-Band Baluns For Rf Applications
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US Patent:8228154, Jul 24, 2012
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Filed:Oct 14, 2009
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Appl. No.:12/579307
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H01F 5/00
H01F 27/28
H01F 7/06 -
US Classification:336170, 336200, 336222, 296021
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Abstract:A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.
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Miniaturized Wide-Band Baluns For Rf Applications
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US Patent:8564382, Oct 22, 2013
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Filed:Oct 14, 2009
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Appl. No.:12/579286
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Inventors:Kai Liu - Phoenix AZ, US
Robert Charles Frye - Piscataway NJ, US -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H03H 7/42
H01F 5/00 -
US Classification:333 25, 333204
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Abstract:A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between second and third portions of the third coil.
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Semiconductor Device Having Balanced Band-Pass Filter Implemented With Lc Resonator
view source -
US Patent:8576026, Nov 5, 2013
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Filed:Dec 10, 2008
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Appl. No.:12/331492
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Inventors:Kai Liu - Phoenix AZ, US
Robert C. Frye - Piscataway NJ, US
Yaojian Lin - Singapore, SG -
Assignee:STATS ChipPAC, Ltd. - Singapore
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International Classification:H01P 3/08
H01P 7/08 -
US Classification:333204, 333219
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Abstract:A band-pass filter has a plurality of frequency band channels each including a first inductor having a first terminal coupled to a first balanced port and a second terminal coupled to a second balanced port. A first capacitor is coupled between the first and second terminals of the first inductor. A second inductor has a first terminal coupled to a first unbalanced port and a second terminal coupled to a second unbalanced port. The second inductor is disposed within a first distance of the first inductor to induce magnetic coupling. A second capacitor is coupled between the first and second terminals of the second inductor. A third inductor is disposed within a second distance of the first inductor and within a third distance of the second inductor to induce magnetic coupling. A second capacitor is coupled between first and second terminals of the third inductor.
Name / Title
Company / Classification
Phones & Addresses
Owner
Tech Ed Concepts, LLC
Business Services · Business Services, Nec, Nsk
Business Services · Business Services, Nec, Nsk
9243 S Nc Hwy 150, Linwood, NC 27299
Director
R M FRYE INSURANCE AGENCY, INC
6106 N 2 Ave, Phoenix, AZ 85013
Director 6106 N 2 Ave, Phoenix, AZ 85013
Director 6106 N 2 Ave, Phoenix, AZ 85013
CIMARRON AUTO TRANSPORT LLC
Transportation Services
Transportation Services
169 W Sagebrush St, Gilbert, AZ 85233
4808139947
4808139947
SURGICAL BLOOD ALTERNATIVES, LLC
R MICHAEL ENTERPRISES, LLC
SKYWAY PARTNERSHIP INVESTMENTS, LLC
SKYLINKS INVESTMENTS, LLC
WALNUT SPOKE ENTERPRISE INC
License Records
Robert A Frye
License #:
13888 - Expired
Issued Date:
Oct 18, 1960
Expiration Date:
Jun 30, 1974
Type:
Civil Engineer
Robert A Frye
License #:
13983 - Expired
Issued Date:
Oct 18, 1960
Expiration Date:
Jun 30, 1974
Type:
Land Surveyor
Robert A Frye
License #:
RS167235L - Expired
Category:
Real Estate Commission
Type:
Real Estate Salesperson-Standard
Robert L Frye
License #:
RS151753A - Expired
Category:
Real Estate Commission
Type:
Real Estate Salesperson-Standard
Lawyers & Attorneys
Real Estate Brokers
Robert T. Frye, Brooklyn Heights Brooklyn Agent
view sourceWork:
Prudential Douglas Elliman
9175867923 (Phone)
9175867923 (Phone)
About:
“Know thy product, in thy market.” A humorous take on what Robert Frye feels is most important about a real estate broker’s success. One he used to launch his career to greatness; one that continually earns him clients’ respect, referrals and repeat business.
Robert is a consummate professional who offers exemplary service, and excels in every facet of selling real estate to make the process easy from beginning to end. Because he knows his product – coops, condos and brownstones – as well as his market – Brownstone Brooklyn, Robert continually applies his proven knowledge to ensure smooth deals, handling every detail and any obstacles that may get in the way. He treats high-end and low-end properties with the same devotion, eye for value, and a focus on your satisfaction.
Coupled with his integrity and market savvy is a polished, gentlemanly approach to working with customers and clients. Robert will always respect your decisions, protect your best interests, and listen to your needs, which is why he’s so easy to work with. Yet with that comes the tenacity it takes to negotiate on your behalf, and the humor required to make the real estate experience as pleasant and rewarding as possible.
Robert’s accomplished real estate career has included sales, rentals and management. Former Director of Rentals for a previous Brooklyn firm, he also oversaw its public relations and advertising departments, which reinforced his creativity and leadership ability. Prior to entering real estate, Robert was a successful talent agent representing actors in film, on television and in theater.
Co-op owner across from Prospect Park, Robert is an avid cyclist who begins each morning with an invigorating bike ride around his favorite playground. He loves the outdoors, whether skiing in winter or the beach in summer, plus enjoys yoga and going to the gym. Robert is also food and wine enthusiast, and a great appreciate of all that NYC has to offer, from fine art to the theater.
Classmates
Robert Frye
view sourceSchools:
Rich Valley High School Saltville VA 1970-1977
Community:
Otessa Necessary, Carol Penland, Robert Campbell, Jim Grogg
Robert Frye
view sourceSchools:
Spencer High School Spencer IN 1965-1969
Community:
Judy Denney, Elaine Rasner, Peggy Burkett, Lelia Terrell, Evelyn Perry
Robert Frye
view sourceSchools:
Bloomfield High School Bloomfield IN 1964-1968
Community:
Robin Schmidt
Robert Frye
view sourceSchools:
Northwood High School Saltville VA 1989-1993
Community:
Misti Greer, Judith Barrett, Christy Lloyd
Robert Frye
view sourceSchools:
Northwood High School Saltville VA 1989-1993
Community:
Misti Greer, Judith Barrett, Christy Lloyd
Robert Mr. Frye (Frye)
view sourceSchools:
Lovettsville High School Lovettsville VA 1948-1952
Community:
Linda Jacobs, Sarah Fulcher, Joan Merchant, Joe Bishop, June Rollins, Geraldine Speaks
Robert Frye
view sourceSchools:
Indiana Soldiers & Sailors School Knightstown IN 1988-1992
Community:
Susan Jackson, Clara Wolfe
Robert Frye
view sourceSchools:
Loudoun Valley High School Purcellville VA 1972-1976
Community:
C Bailey, Margaret Fleming
Robert T. Frye
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Robert Michael Frye
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Robert Frye
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Robert Frye
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Robert Dishon Frye
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Robert Frye
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Robert Anthony Frye
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Robert J Frye
view sourceYoutube
Plaxo
Robert Frye
view sourceNashville
Robert W. Frye
view sourcePhiladelphia, PA
Robert Frye
view sourceConsultant at RF Design Consulting LLC
robert frye
view sourceCox Communications
Robert Frye
view sourceArt Director at Upper Ground Enterprises
Googleplus
Robert Frye
Work:
State of Indiana - Retired firefighter
Education:
Ball State University - Biology and Chemistry
Robert Frye (Solavei Succ...
Robert Frye
Tagline:
The MAN
Robert Frye
Robert Frye
Robert Frye
Robert Frye
Robert Frye
Myspace
Robert Frye
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Get Report for Robert V Frye from Gilbert, AZ, age ~70