Robert L Huntington

US Patent:

20070061986, Mar 22, 2007

Filed:

Sep 12, 2006

Appl. No.:

11/519535

Inventors:

Robert Huntington - Monson MA, US

International Classification:

A47L 13/18

US Classification:

015227000

Abstract:

A mitt having two different working surfaces and a multi-step process for collecting and removing lint, pet hair, and the like from target surfaces using the inventive mitt, are provided. The inventive mitt is made up of a hollow flexible body having a palm side surface coextensive with a back or rear side surface, with an open end for insertion of a hand into the hollow flexible body. The hollow flexible body has means on the palm side surface for gripping, pulling and collecting lint, pet hair, and the like on a target surface, and means on the back or rear side surface for picking up the collected lint, pet hair, and the like from the target surface.

US Patent:

52876195, Feb 22, 1994

Filed:

Mar 9, 1992

Appl. No.:

7/847895

Inventors:

W. David Smith - Abington CT
John A. Olenick - Thompson CT
Carlos L. Barton - Brooklyn CT
Jane L. Cercena - Ashford CT
Daniel J. Navarro - Putnam CT
Kathleen R. Olenick - Thompson CT
Angela M. Kneeland - Putnam CT
Thomas S. Kneeland - Putnam CT
Mark F. Sylvester - Pawtucket RI
Curtis H. Kempton - Mesa AZ
Scott E. Derosier - Rogers CT
Lynn E. Burdick - Hampton CT
Richard T. Traskos - Brooklyn CT
Robert B. Huntington - Tempe AZ
James S. Rivers - Ballouville CT
Samuel Gazit - West Hartford CT
Jeffrey B. Ott - Brooklyn CT
William P. Harper - Tempe AZ

Assignee:

Rogers Corporation - Rogers CT

International Classification:

H01K 310

US Classification:

29852

Abstract:

In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management.