Rothwell, Figg, Ernst & Manbeck A Professional Corporation
Specialties:
Life Sciences / Biotechnology Counseling Licensing & Transactions Litigation Alternative Dispute Resolution Appellate Federal District Court Hatch-Waxman International Trade Commission Patent Interferences Patent Prosecution Biomedical Biology and Biotechnology Chemical Pharmaceutical Unfair Competition
ISLN:
906293872
Admitted:
1976
University:
Indiana University, 1972; Indiana University, 1972; The George Washington University Law School, 1976
Law School:
George Washington University National Law Center, JD - Juris Doctor, 1976
W. David Smith - Abington CT John A. Olenick - Thompson CT Carlos L. Barton - Brooklyn CT Jane L. Cercena - Ashford CT Daniel J. Navarro - Putnam CT Kathleen R. Olenick - Thompson CT Angela M. Kneeland - Putnam CT Thomas S. Kneeland - Putnam CT Mark F. Sylvester - Pawtucket RI Curtis H. Kempton - Mesa AZ Scott E. Derosier - Rogers CT Lynn E. Burdick - Hampton CT Richard T. Traskos - Brooklyn CT Robert B. Huntington - Tempe AZ James S. Rivers - Ballouville CT Samuel Gazit - West Hartford CT Jeffrey B. Ott - Brooklyn CT William P. Harper - Tempe AZ
Assignee:
Rogers Corporation - Rogers CT
International Classification:
H01K 310
US Classification:
29852
Abstract:
In accordance with the present invention, an MCM substrate product is manufactured in an additive process using multiple layers of a fluoropolymer composite material and copper. The copper layers are plated, and the fluoropolymer composite layers are laminated. A seeding process promotes reliable bonding between the fluoropolymer composite material and the plated copper. The use of the filled fluoropolymeric composite eliminates the need for a barrier metal layer between the insulation and the conductors. The MCM substrate device of the present invention may have multiple metal layers and multiple dielectric layers; four or five, or more, of each in a single structure would be easily achieved and is typical. The structure would include lead lines in separate mutually orthogonal planes (sometimes referred to as "x" and "y" lead lines) sandwiched between ground and power voltage planes of copper. The MCM substrate device of the present invention also has solid copper vias, which may be used either as electrical interconnection between layers of the MCM substrate and/or to the I/C's to be packaged in the module, or as thermal vias for heat conduction for thermal management.