Shawn R. Gibb - Charlotte NC Robert F. Karlicek - Santa Maria CA Prosanto K. Mukerji - Phoenix AZ Hari S. Venugopalan - Somerset NJ Ivan Eliashevich - Maplewood NJ
A light-emitting element ( ) is disclosed. A light emitting diode (LED) includes a sapphire substrate ( ) having front and back sides ( ), and a plurality of semiconductor layers ( ) deposited on the front side ( ) of the sapphire substrate ( ). The semiconductor layers ( ) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack ( ) includes an adhesion layer ( ) deposited on the back side ( ) of the sapphire substrate ( ), and a solderable layer ( ) connected to the adhesion layer ( ) such that the solderable layer ( ) is secured to the sapphire substrate ( ) by the adhesion layer ( ). A support structure ( ) is provided on which the LED is disposed. A solder bond ( ) is arranged between the LED and the support structure ( ). The solder bond ( ) secures the LED to the support structure ( ).
Microelectronic Package Having Improved Light Extraction
A light-emitting package includes a substantially transparent substrate having a first surface and a second surface including a lens. The package also includes a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, the LED being secured over the first surface of the substantially transparent substrate. The second surface of the substrate defines a principal light emitting surface of the package. The lens at the second surface has a grating pattern that matches the predetermined wavelength of the light emitted from the LED for controlling the emission geometry of the light emitted by the package. The grating pattern has a radial configuration including a series of circles that are concentric.
Shawn R. Gibb - Charlotte NC, US Robert F. Karlicek - Santa Maria CA, US Prosanto K. Mukerji - Phoenix AZ, US Hari S. Venugopalan - Somerset NJ, US Ivan Eliashevich - Maplewood NJ, US
Assignee:
GELcore, LLC - Valley View OH
International Classification:
H01L 33/00 H01L 21/76
US Classification:
257103, 257762, 257E33062
Abstract:
A light-emitting element () is disclosed. A light emitting diode (LED) includes a sapphire substrate () having front and back sides (), and a plurality of semiconductor layers () deposited on the front side () of the sapphire substrate (). The semiconductor layers () define a light-emitting structure that emits light responsive to an electrical input. A metallization stack () includes an adhesion layer () deposited on the back side () of the sapphire substrate (), and a solderable layer () connected to the adhesion layer () such that the solderable layer () is secured to the sapphire substrate () by the adhesion layer (). A support structure () is provided on which the LED is disposed. A solder bond () is arranged between the LED and the support structure (). The solder bond () secures the LED to the support structure ().
Paul Panaccione - Newburyport MA, US Christian Hoepfner - North Andover MA, US Georgia Chmielewski - Plaistow NH, US John W. Graff - Swampscott MA, US Robert F. Karlicek - Chelmsford MA, US Daniel Mendoza - Pelham NH, US Michael Denninger - Belmont MA, US
Paul Panaccione - Newburyport MA, US Christian Hoepfner - North Andover MA, US Georgia Chmielewski - Plaistow NH, US John W. Graff - Swampscott MA, US Robert F. Karlicek - Chelmsford MA, US Daniel Mendoza - Pelham NH, US Michael Denninger - Belmont MA, US
Assignee:
Luminus Devices, Inc. - Billerica MA
International Classification:
1303
US Classification:
D13180
Name / Title
Company / Classification
Phones & Addresses
Robert F. Karlicek President, Principal
Soliduv, Inc Mfg Misc Industry Machinery · Mfg Semiconductors/Related Devices
2 Eastern Rd, Acton, MA 01720
Robert Karlicek Vice President Of Research And Development, Chief Scientist