Robert F Karlicek

from Chelmsford, MA

Also known as:
  • B Karlicek
  • Bob F Karlicek
  • Robert C Karlicek
  • Robert J Karlicek
  • Robert S Karlicek
Phone and address:
4 Buttercup Ln, Kates Corner, MA 01824
9782568089

Robert Karlicek Phones & Addresses

  • 4 Buttercup Ln, Chelmsford, MA 01824 • 9782568089
  • 7 Fort Hill Dr, Mechanicville, NY 12118 • 5186645652
  • 5892 Oakhill Dr, Santa Maria, CA 93455 • 8059383169
  • 3238 Darien Ln, Twinsburg, OH 44087 • 3304058936
  • 27 Linden Ct, Flemington, NJ 08822 • 9087828972
  • 27 Spruce Ct, Flemington, NJ 08822 • 9087828972
  • Clifton Park, NY
  • Lowell, MA

Industries

Semiconductors

Resumes

Robert Karlicek Photo 1

Robert Karlicek

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Location:
Greater Boston Area
Industry:
Semiconductors

Us Patents

  • Gan Led With Solderable Backside Metal

    view source
  • US Patent:
    6787435, Sep 7, 2004
  • Filed:
    Jul 5, 2002
  • Appl. No.:
    10/064359
  • Inventors:
    Shawn R. Gibb - Charlotte NC
    Robert F. Karlicek - Santa Maria CA
    Prosanto K. Mukerji - Phoenix AZ
    Hari S. Venugopalan - Somerset NJ
    Ivan Eliashevich - Maplewood NJ
  • Assignee:
    GELcore LLC - Valley View OH
  • International Classification:
    H01L 2120
  • US Classification:
    438507, 438 20, 438 22, 438 24, 438 46, 438 47, 438 48
  • Abstract:
    A light-emitting element ( ) is disclosed. A light emitting diode (LED) includes a sapphire substrate ( ) having front and back sides ( ), and a plurality of semiconductor layers ( ) deposited on the front side ( ) of the sapphire substrate ( ). The semiconductor layers ( ) define a light-emitting structure that emits light responsive to an electrical input. A metallization stack ( ) includes an adhesion layer ( ) deposited on the back side ( ) of the sapphire substrate ( ), and a solderable layer ( ) connected to the adhesion layer ( ) such that the solderable layer ( ) is secured to the sapphire substrate ( ) by the adhesion layer ( ). A support structure ( ) is provided on which the LED is disposed. A solder bond ( ) is arranged between the LED and the support structure ( ). The solder bond ( ) secures the LED to the support structure ( ).
  • Microelectronic Package Having Improved Light Extraction

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  • US Patent:
    7023022, Apr 4, 2006
  • Filed:
    Nov 14, 2001
  • Appl. No.:
    10/416996
  • Inventors:
    Ivan Eliashevich - Maplewood NJ, US
    Robert F. Karlicek - Flemington NJ, US
    Hari Venugopalan - Somerset NJ, US
  • Assignee:
    Emcore Corporation - Somerset NJ
  • International Classification:
    H01L 33/00
  • US Classification:
    257 98, 257 81, 257100, 257676, 257680, 438 22, 438 23, 438 24, 313501, 313512
  • Abstract:
    A light-emitting package includes a substantially transparent substrate having a first surface and a second surface including a lens. The package also includes a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, the LED being secured over the first surface of the substantially transparent substrate. The second surface of the substrate defines a principal light emitting surface of the package. The lens at the second surface has a grating pattern that matches the predetermined wavelength of the light emitted from the LED for controlling the emission geometry of the light emitted by the package. The grating pattern has a radial configuration including a series of circles that are concentric.
  • Gan Led With Solderable Backside Metal

    view source
  • US Patent:
    7190005, Mar 13, 2007
  • Filed:
    Jun 22, 2004
  • Appl. No.:
    10/874104
  • Inventors:
    Shawn R. Gibb - Charlotte NC, US
    Robert F. Karlicek - Santa Maria CA, US
    Prosanto K. Mukerji - Phoenix AZ, US
    Hari S. Venugopalan - Somerset NJ, US
    Ivan Eliashevich - Maplewood NJ, US
  • Assignee:
    GELcore, LLC - Valley View OH
  • International Classification:
    H01L 33/00
    H01L 21/76
  • US Classification:
    257103, 257762, 257E33062
  • Abstract:
    A light-emitting element () is disclosed. A light emitting diode (LED) includes a sapphire substrate () having front and back sides (), and a plurality of semiconductor layers () deposited on the front side () of the sapphire substrate (). The semiconductor layers () define a light-emitting structure that emits light responsive to an electrical input. A metallization stack () includes an adhesion layer () deposited on the back side () of the sapphire substrate (), and a solderable layer () connected to the adhesion layer () such that the solderable layer () is secured to the sapphire substrate () by the adhesion layer (). A support structure () is provided on which the LED is disposed. A solder bond () is arranged between the LED and the support structure (). The solder bond () secures the LED to the support structure ().
  • Led Assembly

    view source
  • US Patent:
    D574338, Aug 5, 2008
  • Filed:
    Mar 29, 2007
  • Appl. No.:
    29/285470
  • Inventors:
    Robert F. Karlicek - Chelmsford MA, US
    Michael Brattain - Lexington MA, US
    Georgia Chmielewski - Plaistow NH, US
    Rashmi Kumar - Billerica MA, US
  • Assignee:
    Luminus Devices, Inc. - Billerica MA
  • International Classification:
    1303
  • US Classification:
    D13180, D13179, D13182
  • Led Package

    view source
  • US Patent:
    D576968, Sep 16, 2008
  • Filed:
    Mar 29, 2007
  • Appl. No.:
    29/285433
  • Inventors:
    Paul Panaccione - Newburyport MA, US
    Christian Hoepfner - North Andover MA, US
    Georgia Chmielewski - Plaistow NH, US
    John W. Graff - Swampscott MA, US
    Robert F. Karlicek - Chelmsford MA, US
    Daniel Mendoza - Pelham NH, US
    Michael Denninger - Belmont MA, US
  • Assignee:
    Luminus Devices, Inc. - Billerica MA
  • International Classification:
    1303
  • US Classification:
    D13180
  • Led Device

    view source
  • US Patent:
    D578968, Oct 21, 2008
  • Filed:
    Mar 29, 2007
  • Appl. No.:
    29/285469
  • Inventors:
    Robert F. Karlicek - Chelmsford MA, US
    Michael Brattain - Lexington MA, US
    Georgia Chmielewski - Plaistow NH, US
    Rashmi Kumar - Billerica MA, US
  • Assignee:
    Luminus Devices, Inc. - Billerica MA
  • International Classification:
    1303
  • US Classification:
    D13180, D13179, D13182
  • Led Assembly

    view source
  • US Patent:
    D590784, Apr 21, 2009
  • Filed:
    Mar 29, 2007
  • Appl. No.:
    29/285431
  • Inventors:
    Robert F. Karlicek - Chelmsford MA, US
    Michael Brattain - Lexington MA, US
    Georgia Chmielewski - Plaistow NH, US
    Rashmi Kumar - Billerica MA, US
  • Assignee:
    Luminus Devices, Inc. - Billerica MA
  • International Classification:
    1303
  • US Classification:
    D13180
  • Led Package

    view source
  • US Patent:
    D603352, Nov 3, 2009
  • Filed:
    Mar 29, 2007
  • Appl. No.:
    29/285430
  • Inventors:
    Paul Panaccione - Newburyport MA, US
    Christian Hoepfner - North Andover MA, US
    Georgia Chmielewski - Plaistow NH, US
    John W. Graff - Swampscott MA, US
    Robert F. Karlicek - Chelmsford MA, US
    Daniel Mendoza - Pelham NH, US
    Michael Denninger - Belmont MA, US
  • Assignee:
    Luminus Devices, Inc. - Billerica MA
  • International Classification:
    1303
  • US Classification:
    D13180
Name / Title
Company / Classification
Phones & Addresses
Robert F. Karlicek
President, Principal
Soliduv, Inc
Mfg Misc Industry Machinery · Mfg Semiconductors/Related Devices
2 Eastern Rd, Acton, MA 01720
Robert Karlicek
Vice President Of Research And Development, Chief Scientist
LUMINUS DEVICES, INC
Mfg Lighting Equipment · Mfg Commercial Lighting Fixtures
175 New Boston St #T, Woburn, MA 01801
1100 Technology Park Dr, Billerica, MA 01821
1100 Tech Park Dr, Billerica, MA 01821
9785288000, 7819327831

Youtube

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Smart Lighting 2015: Interview with Robert Karlicek.

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Bob Karlicek Segment 4 How New Lighting Sys...

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Wireless bandwidth to accommodate high speed lighting Processing data...

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Bob Karlicek Segment 1 Present and Future Sta...

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