Robert Charles May

age ~79

from Goodyear, AZ

Also known as:
  • Robert C May
  • Robert Carroll May
  • Mayrobert May
  • Robert T
Phone and address:
16407 Woodlands Ave, Goodyear, AZ 85338

Robert May Phones & Addresses

  • 16407 Woodlands Ave, Goodyear, AZ 85338
  • Cathedral City, CA
  • Litchfield Park, AZ
  • Rochester Hills, MI
  • Westland, MI
  • Maricopa, AZ

Real Estate Brokers

Robert May Photo 1

Robert May, Lethbridge MT Realtor and Mortgage Expert

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Specialties:
Buyer's Agent
Listing Agent
Refinancing
Mortgage Planning
Work:
Canada First Mortgage
2811 13 Ave South
4033303039 (Office)
Experience:
20 years
Description:
Lethbridge mortgage and real estate expert available to help with all aspects of Lethbridge and Southern Alberta real estate transacions. As a Lethbridge Realtor and Lethbridge mortgage broker, my focus is entirely upon obtaining the best possible outcomes to your real estate goals. A great property, a fair price, phenomenal interest rates, and confidential service are just the beginning. Lethbridgerealestateblog.com LethbridgeLoans.com
Links:
Site
Blog

Us Patents

  • Quick-Connect Fastener And Vibration Isolator Unit For Attachment Of Automotive Components

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  • US Patent:
    55447147, Aug 13, 1996
  • Filed:
    May 18, 1994
  • Appl. No.:
    8/247152
  • Inventors:
    Robert J. May - Livonia MI
    Stephen E. Gabalis - Washington MI
    Todd S. Weakley - Waterford MI
  • Assignee:
    Chrysler Corporation - Auburn Hills MI
  • International Classification:
    B60K 1104
  • US Classification:
    180 684
  • Abstract:
    Assembly of a radiator into the engine compartment of an automotive vehicle is quickly accomplished by raising the radiator with its lower support until projecting pins on the top of the radiator extend through a pair of openings in the upper cross member. A fastener and isolator unit is initially installed on each of the pins so that a lower retainer of the hard plastics main body of each unit inserted through the respective slot is immediately below the lower surface of the cross member while an upper retainer is located above the upper surface of the cross member. Installation is effected by gripping ears on the upper retainer and turning the unit on the pin until camming and positioning surfaces of a neck connecting the upper and lower retainers engage the edges defining the slot while trapping the cross member between the upper and lower retainers to secure the unit thereto. A vibration damper and isolator of resilient rubber-like material forms part of the unit to dampen and control vibration between the pins and the cross member while an integral rubber bumper supported on the lower retainer damps vertical vibratory motions between the radiator and the upper cross member.
  • Microelectronic Component Having Molded Regions With Through-Mold Vias

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  • US Patent:
    20220181262, Jun 9, 2022
  • Filed:
    Feb 22, 2022
  • Appl. No.:
    17/677130
  • Inventors:
    - Santa Clara CA, US
    Ram Viswanath - Phoenix AZ, US
    Xavier Francois Brun - Hillsboro OR, US
    Tarek A. Ibrahim - Mesa AZ, US
    Jason M. Gamba - Gilbert AZ, US
    Manish Dubey - Chandler AZ, US
    Robert Alan May - Chandler AZ, US
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    H01L 23/538
    H01L 23/367
    H01L 23/31
    H01L 23/00
  • Abstract:
    Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.
  • First Layer Interconnect First On Carrier Approach For Emib Patch

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  • US Patent:
    20230027030, Jan 26, 2023
  • Filed:
    Sep 30, 2022
  • Appl. No.:
    17/958296
  • Inventors:
    - Santa Clara CA, US
    Xiaoying GUO - Phoenix AZ, US
    Aleksandar ALEKSOV - Chandler AZ, US
    Steve S. CHO - Chandler AZ, US
    Leonel ARANA - Phoenix AZ, US
    Robert MAY - Chandler AZ, US
    Gang DUAN - Chandler AZ, US
  • International Classification:
    H01L 23/00
  • Abstract:
    A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. A first solder resist (SR) layer is formed on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. A second solder resist (SR) layer is formed on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.
  • First Layer Interconnect First On Carrier Approach For Emib Patch

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  • US Patent:
    20210343673, Nov 4, 2021
  • Filed:
    Jul 2, 2021
  • Appl. No.:
    17/366469
  • Inventors:
    - Santa Clara CA, US
    Xiaoying GUO - Phoenix AZ, US
    Aleksandar ALEKSOV - Chandler AZ, US
    Steve S. CHO - Chandler AZ, US
    Leonel ARANA - Phoenix AZ, US
    Robert MAY - Chandler AZ, US
    Gang DUAN - Chandler AZ, US
  • International Classification:
    H01L 23/00
  • Abstract:
    A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. A first solder resist (SR) layer is formed on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. A second solder resist (SR) layer is formed on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.
  • Embedded Die Architecture And Method Of Making

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  • US Patent:
    20210305108, Sep 30, 2021
  • Filed:
    Mar 27, 2020
  • Appl. No.:
    16/832851
  • Inventors:
    Robert L. Sankman - Phoenix AZ, US
    Rahul N. Manepalli - Chandler AZ, US
    Robert Alan May - Chandler AZ, US
    Srinivas Venkata Ramanuja Pietambaram - Chandler AZ, US
    Bharat P. Penmecha - Chandler AZ, US
  • International Classification:
    H01L 23/15
    H01L 25/065
    H01L 23/538
    H01L 23/31
    H01L 21/48
  • Abstract:
    Various examples provide a semiconductor patch. The patch includes a glass core having first and second opposed major surfaces extending in an x-y direction. The patch further includes a conductive via extending from the first major surface to the second major surface substantially in a z-direction. The patch further includes a bridge die embedded in a dielectric material in communication with the conductive via. The patch further includes an overmold at least partially encasing the glass core.
  • Microelectronic Component Having Molded Regions With Through-Mold Vias

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  • US Patent:
    20210305162, Sep 30, 2021
  • Filed:
    Mar 25, 2020
  • Appl. No.:
    16/829396
  • Inventors:
    - Santa Clara CA, US
    Ram Viswanath - Phoenix AZ, US
    Xavier Francois Brun - Hillsboro OR, US
    Tarek A. Ibrahim - Mesa AZ, US
    Jason M. Gamba - Gilbert AZ, US
    Manish Dubey - Chandler AZ, US
    Robert Alan May - Chandler AZ, US
  • Assignee:
    Intel Corporation - Santa Clara CA
  • International Classification:
    H01L 23/538
    H01L 23/367
    H01L 23/31
    H01L 23/00
  • Abstract:
    Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic component may include a substrate having a first face and an opposing second face, wherein the substrate includes a through-substrate via (TSV); a first mold material region at the first face, wherein the first mold material region includes a first through-mold via (TMV) conductively coupled to the TSV; and a second mold material region at the second face, wherein the second mold material region includes a second TMV conductively coupled to the TSV.
  • First Layer Interconnect First On Carrier Approach For Emib Patch

    view source
  • US Patent:
    20200286847, Sep 10, 2020
  • Filed:
    Jan 12, 2018
  • Appl. No.:
    16/646084
  • Inventors:
    - Santa Clara CA, US
    Xiaoying GUO - Phoenix AZ, US
    Aleksandar ALEKSOV - Chandler AZ, US
    Steve S. CHO - Chandler AZ, US
    Leonel ARANA - Phoenix AZ, US
    Robert MAY - Chandler AZ, US
    Gang DUAN - Chandler AZ, US
  • International Classification:
    H01L 23/00
  • Abstract:
    A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. Forming a first solder resist (SR) layer on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. Forming a second solder resist (SR) layer on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.
  • Package Substrate Having Polymer-Derived Ceramic Core

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  • US Patent:
    20190393109, Dec 26, 2019
  • Filed:
    Mar 30, 2017
  • Appl. No.:
    16/481216
  • Inventors:
    - Santa Clara CA, US
    Lauren Ashley LINK - Tempe AZ, US
    Robert Alan MAY - Chandler AZ, US
    Amruthavalli Pallavi ALUR - Tempe AZ, US
    Kristof Kuwawi DARMAWIKARTA - Chandler AZ, US
    Siddharth K. ALUR - Chandler AZ, US
    Sri Ranga Sai BOYAPATI - Chandler AZ, US
    Andrew James BROWN - Phoenix AZ, US
    Lilia MAY - Chandler AZ, US
  • International Classification:
    H01L 23/15
    H01L 23/498
    H01L 21/48
    C04B 35/622
    C04B 35/64
  • Abstract:
    Semiconductor packages including package substrates having polymer-derived ceramic cores are described. In an example, a package substrate includes a core layer including a polymer-derived ceramic. The polymer-derived ceramic may include filler particles to control shrinkage and reduce warpage of the core layer during fabrication and use of the package substrate. The core layer may include counterbores or blind holes to embed a contact pad or an electrical interconnect in the core layer. A semiconductor die may be mounted on the package substrate and may be electrically connected to the contact pad or the electrical interconnect.
Name / Title
Company / Classification
Phones & Addresses
Robert May
Chief Executive
May,robert
Groceries and Related Products
8412 W. Foothill Dr, Peoria, AZ 85382
Robert Steven May
President
RIVERSIDE MOUNTAIN RESCUE UNIT, INC
43950 Acacia Ave, Hemet, CA 92544
Robert Thomas May
Emergency Medicine Specialist
Mc Lacren Cancer Institute
General Hospital Social Services · Social Services
50 N Perry St, Pontiac, MI 48342
2483385000
Robert S. May
Governing Person
Foxborough Energy Company, LLC
Oil/Gas Exploration Services
4052863526
Robert O May
Incorporator
DOWNTOWN IMPROVEMENT ASSOCIATION OF GREENVILLE, MISSISSIPPI, INC
Robert May
Incorporator
FOURTH DISTRICT (CENTRAL MISSISSIPPI) DENTAL SOCIETY
Robert R. May
MAYFIELD AIRSTRIP LLC
Robert J May
IRELAND - MAY LTD

Resumes

Robert May Photo 2

Robert May Hotchkiss, CO

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Work:
Oxbow Mining, LLC
Somerset, CO
Oct 2011 to Jul 2014
Mine Geologist
AMEC Earth & Environmental
Nashville, TN
Nov 2007 to Jul 2011
Senior Geologist
Marshall Miller & Associates
Bluefield, VA
Feb 2004 to Nov 2007
Senior Geologist
James River Coal Service Company
London, KY
2001 to Nov 2003
Chief Geologist
Interstate Coal Company
London, KY
Mar 1983 to 2001
Geologist
ANR Coal Company
Roanoke, VA
Jul 1979 to Dec 1982
Senior Geological Engineer
American Natural Service Company
Detroit, MI
Sep 1976 to Jul 1979
Geological Engineer
Earth Sciences, Inc
Golden, CO
Apr 1973 to Sep 1976
Project Geologist
Education:
Eastern Kentucky University
1986 to 1990
Geology courses - groundwater, petroleum
Colorado School of Mines
Dec 1971
B.S. in Geological Engineering
U.S. Army Engineer School
Skills:
SurvCAD, AutoCAD, Microsoft Office
Robert May Photo 3

Robert May Macomb, MI

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Work:
Macy's Department Store

2012 to 2012
Men's Tailored sales representative
Corporate Mall Services
Lincoln Park, MI
2010 to 2011
marketing and sales
Rockland Inc
Troy, MI
2008 to 2009
Sales Representative
State of Tennesee
Nashville, TN
2003 to 2004
Case management, Data input, Mail room duties
May Landscaping
Cottontown, TN
1994 to 2001
Landscaper

Medicine Doctors

Robert May Photo 4

Dr. Robert T May, Pontiac MI - DO (Doctor of Osteopathic Medicine)

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Specialties:
Emergency Medicine
Address:
De Gara Physicians Group
50 N Perry St, Pontiac, MI 48342
2483385000 (Phone)
Certifications:
Emergency Medicine
Awards:
Healthgrades Honor Roll
Languages:
English
Hospitals:
De Gara Physicians Group
50 N Perry St, Pontiac, MI 48342

McLaren Oakland
50 North Perry Street, Pontiac, MI 48342
Education:
Medical School
Michigan State University / College of Osteopathic Medicine
Graduated: 1997
Robert May Photo 5

Robert C. May

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Specialties:
Nephrology
Work:
Dialysis Clinic Inc
205 Vly Vw Dr, West Plains, MO 65775
4172571683 (phone), 4172577920 (fax)

Ozarks Community Hospital Evergreen Clinic
1540 E Evergreen St, Springfield, MO 65803
4178862747 (phone), 4178232981 (fax)
Education:
Medical School
University of Chicago Pritzker School of Medicine
Graduated: 1978
Procedures:
Dialysis Procedures
Electrocardiogram (EKG or ECG)
Vaccine Administration
Conditions:
Acute Bronchitis
Acute Pharyngitis
Acute Renal Failure
Acute Sinusitis
Anemia
Languages:
English
Description:
Dr. May graduated from the University of Chicago Pritzker School of Medicine in 1978. He works in West Plains, MO and 1 other location and specializes in Nephrology. Dr. May is affiliated with Mercy Hospital Springfield and Ozarks Community Hospital.
Robert May Photo 6

Robert T. May

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Specialties:
Emergency Medicine
Work:
De Gara Physicians Group
50 N Perry St, Pontiac, MI 48342
2483385000 (phone), 2483385129 (fax)
Education:
Medical School
Michigan State University College of Osteopathic Medicine
Graduated: 1997
Procedures:
Vaccine Administration
Arthrocentesis
Conditions:
Abnormal Vaginal Bleeding
Acute Bronchitis
Acute Conjunctivitis
Acute Pancreatitis
Acute Renal Failure
Languages:
English
Description:
Dr. May graduated from the Michigan State University College of Osteopathic Medicine in 1997. He works in Pontiac, MI and specializes in Emergency Medicine. Dr. May is affiliated with Mclaren Oakland.
Robert May Photo 7

Robert K. May

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Specialties:
Family Medicine
Work:
Central Ohio Nutrition Center
1904 Bethel Rd, Columbus, OH 43220
6144511910 (phone), 6144511960 (fax)
Education:
Medical School
Ohio State University College of Medicine
Graduated: 1976
Procedures:
Allergen Immunotherapy
Arthrocentesis
Cardiac Stress Test
Destruction of Benign/Premalignant Skin Lesions
Electrocardiogram (EKG or ECG)
Nutrition Therapy
Pulmonary Function Tests
Skin Tags Removal
Vaccine Administration
Conditions:
Acne
Diabetes Mellitus (DM)
Disorders of Lipoid Metabolism
Fractures, Dislocations, Derangement, and Sprains
Gastroesophageal Reflux Disease (GERD)
Languages:
English
Description:
Dr. May graduated from the Ohio State University College of Medicine in 1976. He works in Columbus, OH and specializes in Family Medicine.
Robert May Photo 8

Robert Lewis May

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Specialties:
Radiology
Thoracic Surgery
Cardiothoracic Vascular Surgery
Education:
Case Western Reserve University(1963)
Robert May Photo 9

Robert Henry May

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Specialties:
Orthopaedic Surgery
Education:
University of Arkansas(1968)
Robert May Photo 10

Robert T May, Pontiac MI

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Specialties:
Emergency Medicine Physician
Address:
50 N Perry St, Pontiac, MI 48342

License Records

Robert R May

License #:
578 - Expired
Issued Date:
Jan 1, 1974
Expiration Date:
Jun 30, 2008
Type:
Psychologist

Robert Bertrand May Md

License #:
7750 - Expired
Category:
Medicine
Issued Date:
Mar 16, 1938
Effective Date:
Nov 13, 1981
Type:
Physician

Robert F May

License #:
NA043366A - Expired
Category:
Real Estate Commission
Type:
Associate Broker (AB)-Standard

Robert Charles May

Address:
16768 W Mckinley St, Goodyear, AZ 85338
License #:
A1219276
Category:
Airmen

Lawyers & Attorneys

Robert May Photo 11

Robert R May - Lawyer

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Address:
May Cruz Consultores
4424973737 (Office)
Licenses:
Dist. of Columbia - Active 1994
Robert May Photo 12

Robert A. May - Lawyer

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Licenses:
Virginia - Authorized to practice law 2009
Specialties:
Criminal Defense - 70%
Speeding / Traffic Ticket - 15%
DUI / DWI - 15%
Robert May Photo 13

Robert May - Lawyer

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Office:
Cleary Gottlieb Steen & Hamilton LLP
Specialties:
Administrative Law
Litigation
ISLN:
919852134
Admitted:
1985
University:
University of North Carolina, B.A., 2004
Law School:
Columbia University School of Law, J.D., 2007
Robert May Photo 14

Robert May - Lawyer

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Specialties:
Criminal Defense
Speeding & Traffic Ticket
DUI & DWI
Criminal Defense
ISLN:
1000634614
Admitted:
2009
Robert May Photo 15

Robert May - Lawyer

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Office:
Juge, Napolitano, Guilbeau, Ruli, Frieman & Whiteley
ISLN:
901423465
Admitted:
1991
University:
Loyola University, 1991; University of New Orleans, B.A., 1984
Robert May Photo 16

Robert Stanley May, Surprise AZ - Lawyer

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Office:
17635 W. Watson Ln., Surprise, AZ
ISLN:
905075943
Admitted:
1990
University:
University of California, B.A.
Law School:
University of San Francisco, J.D.

Flickr

Facebook

Robert May Photo 25

Robert May

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Friends:
Thania Aguilera, Ivelisse Betancourt Marrero

Googleplus

Robert May Photo 26

Robert May

Education:
Simsboro High School, Cedar Creek, Louisiana Tech University, Technical college of The Low Country
Tagline:
As soon as you say "I DO" she says "I DON'T"!
Bragging Rights:
Two kids, one boy one girl, girls are tough to raise.
Robert May Photo 27

Robert May

Work:
BlueCrossBlueShield of IL - Retired (1991-2008)
CNA Insurance (1968-1991)
Education:
Hanover College, New Trier High School, New Trier Township High School
Robert May Photo 28

Robert May

Work:
Bare Naked - Senior Developer (2012)
Core - Web Developer (2009-2012)
About:
A man with far, far too many hobbies.
Bragging Rights:
Fires a cannon on a regular basis
Robert May Photo 29

Robert May

Work:
Image Forward LLC - Internet Stategy Director (2011)
Education:
University of Northern Colorado - Psychology
Robert May Photo 30

Robert May

Work:
Guardian Life Insurance Company of America - Senior Telecommunications Engineer
Education:
Taconic High School
Bragging Rights:
2 kids, 5 grandchildren, 2 great grandchildren
Robert May Photo 31

Robert May

Education:
Sam Houston State University - Political Science
About:
East Texas raised. Country morals, but trying to get a world perspective. SHSU
Bragging Rights:
My supporting cast is off the chain.
Robert May Photo 32

Robert May

Education:
Ohio State University - Electrical and Computer Engineering
Robert May Photo 33

Robert May

Work:
Northwestern Mutual - Financial Advisor
About:
I am a financial advisor with the Northwestern Mutual Financial Network.  The Network's mission is to develop enduring relationships with clients by providing expert guidance for a lifetime of fin...

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